A resin composition includes 100 parts by weight of a polyolefin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance and thermal resistance after moisture absorption and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion. ##STR00001##

A resin composition includes 100 parts by weight of a polyolefin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance and thermal resistance after moisture absorption and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion. ##STR00001##

A thermoplastic resin composition includes a rubber-reinforced styrenic thermoplastic resin (A1) in an amount of 97 to 80 parts by mass); and a hitting sound reducing material (B) in an amount of 3 to 20 parts by mass. The hitting sound reducing material (B) is a hydrogenated copolymer derived from hydrogenation of a copolymer formed of a block portion (I) primarily including structural units derived from an aromatic vinyl-based compound, and a random portion (II) primarily including structural units derived from an aromatic vinyl-based compound and primarily including structural units derived from butadiene. The structural units in the block portion (I) and the structural units derived from an aromatic vinyl-based compound in the random portion (II) are present in 55 to 80 mass % relative to a 100 total mass % of the copolymer, and the hydrogenated copolymer has a primary dispersion peak of tan δ at 0° C. or greater.

A thermoplastic resin composition includes a rubber-reinforced styrenic thermoplastic resin (A1) in an amount of 97 to 80 parts by mass); and a hitting sound reducing material (B) in an amount of 3 to 20 parts by mass. The hitting sound reducing material (B) is a hydrogenated copolymer derived from hydrogenation of a copolymer formed of a block portion (I) primarily including structural units derived from an aromatic vinyl-based compound, and a random portion (II) primarily including structural units derived from an aromatic vinyl-based compound and primarily including structural units derived from butadiene. The structural units in the block portion (I) and the structural units derived from an aromatic vinyl-based compound in the random portion (II) are present in 55 to 80 mass % relative to a 100 total mass % of the copolymer, and the hydrogenated copolymer has a primary dispersion peak of tan δ at 0° C. or greater.

A thermoplastic resin composition includes a resin component (A) in an amount of 97 to 80 parts by mass; and a hitting sound reducing material (B) in an amount of 3 to 20 parts by mass. The hitting sound reducing material (B) is a hydrogenated copolymer derived from hydrogenation of a copolymer formed of a block portion (I) primarily including structural units derived from an aromatic vinyl-based compound, and a random portion (II) primarily including structural units derived from an aromatic vinyl-based compound and derived from butadiene. The structural units derived from an aromatic vinyl-based compound in the block portion (I) and derived from an aromatic vinyl-based compound in the random portion (II) are present in a total content of 55 to 80 mass % relative to a 100 total mass % of the copolymer, and the hydrogenated copolymer has a primary dispersion peak of tan δ at 0° C. or greater.

A thermoplastic resin composition includes a resin component (A) in an amount of 97 to 80 parts by mass; and a hitting sound reducing material (B) in an amount of 3 to 20 parts by mass. The hitting sound reducing material (B) is a hydrogenated copolymer derived from hydrogenation of a copolymer formed of a block portion (I) primarily including structural units derived from an aromatic vinyl-based compound, and a random portion (II) primarily including structural units derived from an aromatic vinyl-based compound and derived from butadiene. The structural units derived from an aromatic vinyl-based compound in the block portion (I) and derived from an aromatic vinyl-based compound in the random portion (II) are present in a total content of 55 to 80 mass % relative to a 100 total mass % of the copolymer, and the hydrogenated copolymer has a primary dispersion peak of tan δ at 0° C. or greater.

A thermoplastic resin composition and a molded article including the same can include 100 parts by weight of a base resin including 10 to 50% by weight of an acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (A-1) containing acrylate rubber having an average particle diameter of 0.3 to 0.5 μm, 5 to 40% by weight of an acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (A-2) containing acrylate rubber having an average particle diameter of 0.05 μm or more and less than 0.3 μm, and 20 to 65% by weight of an aromatic vinyl polymer (B), and 0.5 to 12 parts by weight of a polyamide (C). The thermoplastic resin composition can have a solvent resistance of 15 days or more.

A thermoplastic resin composition and a molded article including the same can include 100 parts by weight of a base resin including 10 to 50% by weight of an acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (A-1) containing acrylate rubber having an average particle diameter of 0.3 to 0.5 μm, 5 to 40% by weight of an acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (A-2) containing acrylate rubber having an average particle diameter of 0.05 μm or more and less than 0.3 μm, and 20 to 65% by weight of an aromatic vinyl polymer (B), and 0.5 to 12 parts by weight of a polyamide (C). The thermoplastic resin composition can have a solvent resistance of 15 days or more.

A composition comprising: a) one or more copolymers of i) one or more of one or more vinyl or vinylidene aromaticmonomers and/or (meth)acrylates; with ii) one or more unsaturated compounds containing one or more nucleophilic groups wherein the copolymer contains on average about 0.01 to about 5.0 percent by weight of nucleophilic groups based on the weight of the copolymer; b) one or more thermoplastic elastomer based polymers containing one or more nucleophilic groups; and c) one or more polymers having electrophilic groups; wherein the electrophilic groups have reacted with the nucleophilic groups and at least a portion of the one or more copolymers containing nucleophilic groups are bonded to at least a portion of the one or more thermoplastic elastomers containing one or more nucleophilic groups by at least a portion of the one or more polymers having electrophilic groups.

A composition comprising: a) one or more copolymers of i) one or more of one or more vinyl or vinylidene aromaticmonomers and/or (meth)acrylates; with ii) one or more unsaturated compounds containing one or more nucleophilic groups wherein the copolymer contains on average about 0.01 to about 5.0 percent by weight of nucleophilic groups based on the weight of the copolymer; b) one or more thermoplastic elastomer based polymers containing one or more nucleophilic groups; and c) one or more polymers having electrophilic groups; wherein the electrophilic groups have reacted with the nucleophilic groups and at least a portion of the one or more copolymers containing nucleophilic groups are bonded to at least a portion of the one or more thermoplastic elastomers containing one or more nucleophilic groups by at least a portion of the one or more polymers having electrophilic groups.