Provided are a binder composition for a secondary battery, a negative electrode including the same, and a secondary battery including the same. More particularly, the binder composition for a secondary battery having a three-dimensional structure, which is prepared by mixing a copolymer having specific repeating units and a polymer-type additive containing nitrogen (N) bonded to two or three carbons (C) in the repeating unit, has excellent mechanical properties and may effectively improve a binding force. The negative electrode and the secondary battery including the binder composition for a secondary battery effectively suppress expansion of a negative electrode to manufacture a secondary battery having excellent charge/discharge cycle characteristics and battery performance.

The present invention relates to silver ink for printing a three dimensional microstructure and a 3D printing method using the same. The present invention provides a method for printing a 3-dimensional silver structure pattern, the method including: a step of providing a nozzle with liquid ink including capped silver nanoparticles and exhibiting Newtonian fluid behavior; a step of forming, at a predetermined point on a substrate, a meniscus of the liquid ink with ink extruded from the nozzle; a step of allowing the ink of the nozzle to be extruded by means of the surface tension of the meniscus while moving the nozzle along a path in a direction perpendicular to the substrate, in a direction parallel to the substrate, or according to a combination of said directions; and a step of forming a silver structure pattern corresponding to the movement path of the nozzle by evaporating a solvent from the extruded ink from the region closer to the substrate. The present invention can provide a 3D printing method based on direct ink printing that is suitable for application to 3D printing electronic technology.

The present invention relates to silver ink for printing a three dimensional microstructure and a 3D printing method using the same. The present invention provides a method for printing a 3-dimensional silver structure pattern, the method including: a step of providing a nozzle with liquid ink including capped silver nanoparticles and exhibiting Newtonian fluid behavior; a step of forming, at a predetermined point on a substrate, a meniscus of the liquid ink with ink extruded from the nozzle; a step of allowing the ink of the nozzle to be extruded by means of the surface tension of the meniscus while moving the nozzle along a path in a direction perpendicular to the substrate, in a direction parallel to the substrate, or according to a combination of said directions; and a step of forming a silver structure pattern corresponding to the movement path of the nozzle by evaporating a solvent from the extruded ink from the region closer to the substrate. The present invention can provide a 3D printing method based on direct ink printing that is suitable for application to 3D printing electronic technology.

A hybrid expandable composition that provides improved expansion and loft properties is disclosed. The hybrid expandable composition is particularly useful in providing insulation and/or cushion to substrates.

A hybrid expandable composition that provides improved expansion and loft properties is disclosed. The hybrid expandable composition is particularly useful in providing insulation and/or cushion to substrates.

The present application discloses a novel plasticizer formulation comprising bis(2-(2-butoxyethoxy)ethyl) terephthalate, bis(2-ethylhexyl) terephthalate, and optionally tris(2-ethylhexyl) benzene-1,2,4-tricarboxylate. The plasticizer formulation is suitable medium to high temperature applications such as wire and cable insulation and jacketing.

The present application discloses a novel plasticizer formulation comprising bis(2-(2-butoxyethoxy)ethyl) terephthalate, bis(2-ethylhexyl) terephthalate, and optionally tris(2-ethylhexyl) benzene-1,2,4-tricarboxylate. The plasticizer formulation is suitable medium to high temperature applications such as wire and cable insulation and jacketing.

The present application discloses plasticizer compositions comprising: (I) a compound of formula I: wherein R.sup.1, R.sup.2, and n are defined herein. The application also discloses resin compositions comprising the compound of formula I.

##STR00001##

The present application discloses plasticizer compositions comprising: (I) a compound of formula I: wherein R.sup.1, R.sup.2, and n are defined herein. The application also discloses resin compositions comprising the compound of formula I.

##STR00001##

A liquid additive delivery composition for introducing an additive into a curable silicone composition may include a liquid carrier and at least one additive. The liquid carrier may include one or both of polyvinyl acetate or polyvinyl alcohol.