C08L33/06

CROSSLINKABLE COMPOSITION COMPRISING A MONO(METH)ACRYLATE HAVING A 1,3 DIOXOLANE RING
20230073050 · 2023-03-09 ·

The present invention relates to a crosslinkable composition comprising a mono(meth)acrylate comprising a 1,3-dioxolane ring, another mono(meth)acrylate and also a (meth)acrylated oligomer. The invention also relates to a process for producing a crosslinked product, in particular a 3D object, from this composition, and also to the use of this composition for obtaining an ink, a coating, a sealant, an adhesive, a molded material, an inking plate or a 3D object. The invention further relates to the use of a mono(meth)acrylate having a 1,3-dioxolane ring in a composition for 3D printing.

ADHESIVE COMPOSITION AND FILM-LIKE ADHESIVE, AND SEMICONDUCTOR PACKAGE USING FILM-LIKE ADHESIVE AND PRODUCING METHOD THEREOF
20230108567 · 2023-04-06 · ·

An adhesive composition containing an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and an inorganic filler (D), in which the phenoxy resin (C) has an elastic modulus of 500 MPa or more at 25° C., a proportion of the phenoxy resin (C) in a total content of the epoxy resin (A) and the phenoxy resin (C) is 10 to 60 mass%, a nanoindentation hardness at 25° C. of a film-like adhesive before curing formed using the adhesive composition is 0.10 MPa or more, and the Young’s modulus at 25° C. of a film-like adhesive before curing formed using the adhesive composition is 100 MPa or more; a film-like adhesive using the adhesive composition; and a semiconductor package using the film-like adhesive and a producing method thereof.

ADHESIVE COMPOSITION AND FILM-LIKE ADHESIVE, AND SEMICONDUCTOR PACKAGE USING FILM-LIKE ADHESIVE AND PRODUCING METHOD THEREOF
20230108567 · 2023-04-06 · ·

An adhesive composition containing an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and an inorganic filler (D), in which the phenoxy resin (C) has an elastic modulus of 500 MPa or more at 25° C., a proportion of the phenoxy resin (C) in a total content of the epoxy resin (A) and the phenoxy resin (C) is 10 to 60 mass%, a nanoindentation hardness at 25° C. of a film-like adhesive before curing formed using the adhesive composition is 0.10 MPa or more, and the Young’s modulus at 25° C. of a film-like adhesive before curing formed using the adhesive composition is 100 MPa or more; a film-like adhesive using the adhesive composition; and a semiconductor package using the film-like adhesive and a producing method thereof.

THERMALLY EXPANDABLE FIRE-RESISTANT RESIN COMPOSITION AND THERMALLY EXPANDABLE FIRE-RESISTANT SHEET
20220315742 · 2022-10-06 ·

A thermally expandable fire-resistant resin composition contains a vinyl resin, a nitrogen-containing foaming agent, a phosphorus flame retardant, a polyhydric alcohol, titanium dioxide, and a straight-chain acrylic polymer. The straight-chain acrylic polymer has a weight-average molecular weight within a range of greater than or equal to 4,000,000 and less than or equal to 20,000,000.

THERMALLY EXPANDABLE FIRE-RESISTANT RESIN COMPOSITION AND THERMALLY EXPANDABLE FIRE-RESISTANT SHEET
20220315742 · 2022-10-06 ·

A thermally expandable fire-resistant resin composition contains a vinyl resin, a nitrogen-containing foaming agent, a phosphorus flame retardant, a polyhydric alcohol, titanium dioxide, and a straight-chain acrylic polymer. The straight-chain acrylic polymer has a weight-average molecular weight within a range of greater than or equal to 4,000,000 and less than or equal to 20,000,000.

MULTI-PIECE SOLID GOLF BALL
20230108744 · 2023-04-06 · ·

In a multi-piece solid golf ball having a core, an envelope layer, an intermediate layer and a cover, the core is formed of a rubber composition, the envelope layer, intermediate layer and cover are each formed of a single layer of resin material; the hardness relationship among the layers, in terms of Shore C hardness values, satisfies the following two conditions:


material hardness of cover>material hardness of intermediate layer, and


material hardness of envelope layer≥surface hardness of core; and

the thickness relationship among the layers satisfies the following condition:


(cover thickness intermediate layer thickness)<envelope layer thickness.

This ball serves as a distance ball which enables a superior distance to be achieved on full shots with a driver and with irons.

MULTI-PIECE SOLID GOLF BALL
20230108744 · 2023-04-06 · ·

In a multi-piece solid golf ball having a core, an envelope layer, an intermediate layer and a cover, the core is formed of a rubber composition, the envelope layer, intermediate layer and cover are each formed of a single layer of resin material; the hardness relationship among the layers, in terms of Shore C hardness values, satisfies the following two conditions:


material hardness of cover>material hardness of intermediate layer, and


material hardness of envelope layer≥surface hardness of core; and

the thickness relationship among the layers satisfies the following condition:


(cover thickness intermediate layer thickness)<envelope layer thickness.

This ball serves as a distance ball which enables a superior distance to be achieved on full shots with a driver and with irons.

Method for preparing superabsorbent polymer, and superabsorbent polymer prepared thereby

The present invention relates to a method for preparing a superabsorbent polymer, and a superabsorbent polymer prepared thereby. A superabsorbent polymer prepared by the preparation method exhibits minimized deterioration of physical properties after being pulverized, and thus basic absorbance performance is excellent and an excellent liquid permeability and absorbance rate can be exhibited.

Method for preparing superabsorbent polymer, and superabsorbent polymer prepared thereby

The present invention relates to a method for preparing a superabsorbent polymer, and a superabsorbent polymer prepared thereby. A superabsorbent polymer prepared by the preparation method exhibits minimized deterioration of physical properties after being pulverized, and thus basic absorbance performance is excellent and an excellent liquid permeability and absorbance rate can be exhibited.

Additive for epoxy adhesive and epoxy adhesive composition for construction including same

In an additive for an epoxy adhesive and an epoxy adhesive composition for construction including same, the additive for an epoxy adhesive is formed by atomic transfer radical polymerization (ATRP) of a polyacrylate of which one terminal is halogenated, as an arm-polymer, and a diacrylate-based compound or a dimethacrylate-based compound, as a cross-linker, and comprises a star polymer of a star-shape having a core/shell structure including a core formed by the polymerization of the cross-linker and a shell formed by a portion of the arm-polymer.