Provided are a resin composition including a coloring material, a resin, and a solvent, in which, in a case where a film having a thickness of 0.60 μm is formed by heating the resin composition at 200° C. for 30 minutes, a thickness of the film after performing a heating treatment of the film at 300° C. for 5 hours in a nitrogen atmosphere is 70% or more of a thickness of the film before the heating treatment; a film formed of the resin composition; a color filter; a solid-state imaging element; and an image display device.

A material from which a cured film exhibiting high solvent resistance, liquid crystal-alignment performance, heat resistance and high transparency can be formed. A composition for forming a thermoset film having photo alignment properties, the composition comprising: a component (A) that is an acrylic copolymer having a photodimerizing moiety and a thermal cross-linking moiety; a component (B) that is an acrylic polymer having at least one of a C.sub.2-5 alkyl ester group and a C.sub.2-5 hydroxyalkyl ester group and at least one of a carboxy group and a phenolic hydroxy group; and a component (C) that is a cross-linking agent.

The present invention relates to a continuous process for preparing a comb polymer, without organic solvent, by esterification and/or amidification of an acidic homopolymer or copolymer, which consists in performing the esterification and/or amidification of said homopolymer/copolymer by reaction at elevated temperature in the mixing and transportation zone of a tubular reactor, optionally equipped with a water removal system, in the presence of at least one poly(alkylene glycol) in solid or molten form and of an antioxidant, said esterification and/or amidification taking place at a temperature greater than or equal to 170° C.

The present invention relates to a continuous process for preparing a comb polymer, without organic solvent, by esterification and/or amidification of an acidic homopolymer or copolymer, which consists in performing the esterification and/or amidification of said homopolymer/copolymer by reaction at elevated temperature in the mixing and transportation zone of a tubular reactor, optionally equipped with a water removal system, in the presence of at least one poly(alkylene glycol) in solid or molten form and of an antioxidant, said esterification and/or amidification taking place at a temperature greater than or equal to 170° C.

Provided is a thermosetting resin composition, which can be used as underfill for obtaining favorable solder connectivity while suppressing the formation of voids in the case of treating under heating conditions required by the underfill in a semiconductor chip thermocompression bonding step using the thermal compression bonding technique. The thermosetting resin composition contains a thermosetting resin, a curing agent and a fluxing agent, and the temperature at which the rate of temperature change of viscosity when temperature is increased according to a prescribed heating profile reaches 30 Pa.Math.s/° C. is 200° C. to 250° C.

Provided is a thermosetting resin composition, which can be used as underfill for obtaining favorable solder connectivity while suppressing the formation of voids in the case of treating under heating conditions required by the underfill in a semiconductor chip thermocompression bonding step using the thermal compression bonding technique. The thermosetting resin composition contains a thermosetting resin, a curing agent and a fluxing agent, and the temperature at which the rate of temperature change of viscosity when temperature is increased according to a prescribed heating profile reaches 30 Pa.Math.s/° C. is 200° C. to 250° C.

The present invention relates to an anticorrosive coating composition comprising an epoxy resin (a), a curing agent (b), an amide wax (c), and a liquid acrylic polymer (d) including a structural unit derived from an acrylate having an alkyl group of 4 to 18 carbon atoms. The anticorrosive coating composition of the present invention can form an anticorrosive coating film that is excellent adhesion to a metal substrate, anticorrosive properties and so on.

The present invention relates to an anticorrosive coating composition comprising an epoxy resin (a), a curing agent (b), an amide wax (c), and a liquid acrylic polymer (d) including a structural unit derived from an acrylate having an alkyl group of 4 to 18 carbon atoms. The anticorrosive coating composition of the present invention can form an anticorrosive coating film that is excellent adhesion to a metal substrate, anticorrosive properties and so on.

Provided is a process for forming an antimicrobial polymer composition comprising: contacting together at least one initiator, at least one promoter, at least one reductant, and at least one monomer, under emulsion polymerization conditions to form a base polymer; and mixing with the base polymer an antimicrobial complex; wherein the at least one initiator is a peroxidic compound and the at least one reductant is an ascorbic compound.

Provided is a process for forming an antimicrobial polymer composition comprising: contacting together at least one initiator, at least one promoter, at least one reductant, and at least one monomer, under emulsion polymerization conditions to form a base polymer; and mixing with the base polymer an antimicrobial complex; wherein the at least one initiator is a peroxidic compound and the at least one reductant is an ascorbic compound.