Provided is a binder composition for lithium ion secondary battery electrode-use that reduces internal resistance of a lithium ion secondary battery while also providing the lithium ion secondary battery with excellent life characteristics. The binder composition contains a copolymer X and a solvent. The copolymer X is obtained from a monomer composition X that contains at least 20.0 mass % and no greater than 75.0 mass % of an ethylenically unsaturated carboxylic acid compound (A) composed of either or both of an ethylenically unsaturated carboxylic acid and an ethylenically unsaturated carboxylic acid salt, and at least 20.0 mass % and no greater than 75.0 mass % of a copolymerizable compound (B) that has an ethylenically unsaturated bond and a solubility of at least 7 g in 100 g of water at 20° C. The copolymer X has a degree of swelling in electrolysis solution of less than 120 mass %.

A die-formed chamfered plastic floor and a preparation method thereof are disclosed. The method includes: mixing raw materials for preparing a plastic floor matrix to obtain a mixed material; subjecting the mixed material to an extrusion, a laminating-embossing treatment, a die forming-chamfering treatment, a coating with an ultraviolet curable paint, a slicing, and a tenoning in sequence, to obtain the die-formed chamfered plastic floor. In the disclosure, a die forming-chamfering treatment is set between a laminating-embossing treatment and a coating with an ultraviolet curable paint, and thereby a chamfer embossing could be formed on the surface of the workpiece through pressing.

A die-formed chamfered plastic floor and a preparation method thereof are disclosed. The method includes: mixing raw materials for preparing a plastic floor matrix to obtain a mixed material; subjecting the mixed material to an extrusion, a laminating-embossing treatment, a die forming-chamfering treatment, a coating with an ultraviolet curable paint, a slicing, and a tenoning in sequence, to obtain the die-formed chamfered plastic floor. In the disclosure, a die forming-chamfering treatment is set between a laminating-embossing treatment and a coating with an ultraviolet curable paint, and thereby a chamfer embossing could be formed on the surface of the workpiece through pressing.

The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 μm or less.

The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 μm or less.

A dielectric polymeric composition comprising a polymeric matrix comprising structural units derived from a polymerizable vinyl monomer; an ionic liquid comprising an organic cation and a balancing anion, wherein the ionic liquid is miscible or partially miscible with the polymerizable vinyl monomer, and wherein the concentration of ionic liquid in dielectric polymeric composition ranges from 0.5 to 30 wt. %; and less than 10 ppm of unreacted polymerizable vinyl monomer, based on the total weight of the composition, wherein an amount of unreacted polymerizable vinyl monomer in the composition is measured via HPLC. The polymeric matrix further comprises structural units derived from a polymerizable co-monomer comprising a functional group that has the ability to form hydrogen bonds within the polymeric matrix. The polymeric matrix further comprises a crosslinking agent, and wherein the polymeric matrix comprises covalent crosslinks between the crosslinking agent and the structural units derived from the polymerizable vinyl monomer.

A dielectric polymeric composition comprising a polymeric matrix comprising structural units derived from a polymerizable vinyl monomer; an ionic liquid comprising an organic cation and a balancing anion, wherein the ionic liquid is miscible or partially miscible with the polymerizable vinyl monomer, and wherein the concentration of ionic liquid in dielectric polymeric composition ranges from 0.5 to 30 wt. %; and less than 10 ppm of unreacted polymerizable vinyl monomer, based on the total weight of the composition, wherein an amount of unreacted polymerizable vinyl monomer in the composition is measured via HPLC. The polymeric matrix further comprises structural units derived from a polymerizable co-monomer comprising a functional group that has the ability to form hydrogen bonds within the polymeric matrix. The polymeric matrix further comprises a crosslinking agent, and wherein the polymeric matrix comprises covalent crosslinks between the crosslinking agent and the structural units derived from the polymerizable vinyl monomer.

The present disclosure relates to an aqueous fire-retardant composition comprising particles dispersed in an aqueous phase, wherein the particles comprise a fire-retardant brominated epoxy polymer and an organic polymer comprising ionic dispersing groups. The present disclosure further relates to an aqueous fire-retardant coating composition comprising such fire-retardant composition, and to a substrate coated with a coating deposited from such coating composition.

The present disclosure relates to an aqueous fire-retardant composition comprising particles dispersed in an aqueous phase, wherein the particles comprise a fire-retardant brominated epoxy polymer and an organic polymer comprising ionic dispersing groups. The present disclosure further relates to an aqueous fire-retardant coating composition comprising such fire-retardant composition, and to a substrate coated with a coating deposited from such coating composition.

An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications and is excellent in elastic modulus, strength, and pot life.

The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (3): [A]: epoxy resin [B]: polyamine curing agent, and [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin, and (1): at least a part of the component [C] has two or more alcoholic hydroxyl groups in the molecule. (2): the ratio C/E of the amount by mole, E, for epoxy groups of the component [A] to the amount by mole, C, of the component [C] satisfying the condition (1) is 0.01 or more and 0.20 or less. (3): the viscosity at 70° C. for 2 hours is 5.0 times or less the initial viscosity at 70° C.