C08L33/20

THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE
20180002522 · 2018-01-04 ·

The present invention relates to a thermoplastic resin composition and a molded article manufactured thereofrom. In accordance with the present invention, a thermoplastic resin composition providing higher chemical resistance with respect to a blowing agent while providing the same impact strength, gloss, and vacuum moldability as existing resin compositions when used to produce an inner case of a refrigerator, and a molded article manufactured from the same are provided.

THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE
20180002522 · 2018-01-04 ·

The present invention relates to a thermoplastic resin composition and a molded article manufactured thereofrom. In accordance with the present invention, a thermoplastic resin composition providing higher chemical resistance with respect to a blowing agent while providing the same impact strength, gloss, and vacuum moldability as existing resin compositions when used to produce an inner case of a refrigerator, and a molded article manufactured from the same are provided.

BINDER COMPOSITION FOR NON-AQUEOUS SECONDARY BATTERY ELECTRODE, SLURRY COMPOSITION FOR NON-AQUEOUS SECONDARY BATTERY ELECTRODE, ELECTRODE FOR NON-AQUEOUS SECONDARY BATTERY, AND NON-AQUEOUS SECONDARY BATTERY
20230006210 · 2023-01-05 · ·

A binder composition for a non-aqueous secondary battery electrode contains a specific binder component, a plasticizer, and an organic solvent. The binder component includes an insoluble polymer that includes a (meth)acrylic acid ester monomer unit and an ethylenically unsaturated acid monomer unit and a highly soluble polymer that includes, in specific content ratios, a nitrile group-containing monomer unit and either or both of an amide group-containing monomer unit and a (meth)acrylic acid ester monomer unit having an alkyl chain carbon number of not less than 1 and not more than 6.

BINDER COMPOSITION FOR NON-AQUEOUS SECONDARY BATTERY ELECTRODE, SLURRY COMPOSITION FOR NON-AQUEOUS SECONDARY BATTERY ELECTRODE, ELECTRODE FOR NON-AQUEOUS SECONDARY BATTERY, AND NON-AQUEOUS SECONDARY BATTERY
20230006210 · 2023-01-05 · ·

A binder composition for a non-aqueous secondary battery electrode contains a specific binder component, a plasticizer, and an organic solvent. The binder component includes an insoluble polymer that includes a (meth)acrylic acid ester monomer unit and an ethylenically unsaturated acid monomer unit and a highly soluble polymer that includes, in specific content ratios, a nitrile group-containing monomer unit and either or both of an amide group-containing monomer unit and a (meth)acrylic acid ester monomer unit having an alkyl chain carbon number of not less than 1 and not more than 6.

Additive for fiber strengthening

Compositions that include a polymer and an aldaric acid, such as glucaric acid, are disclosed. The compositions may include polyvinyl alcohol and glucaric acid. The compositions may also include polyacrylonitrile and glucaric acid. In addition, the compositions may further include lignin. Also disclosed are fibers including the compositions, methods of making the fibers, and uses of the fibers.

Additive for fiber strengthening

Compositions that include a polymer and an aldaric acid, such as glucaric acid, are disclosed. The compositions may include polyvinyl alcohol and glucaric acid. The compositions may also include polyacrylonitrile and glucaric acid. In addition, the compositions may further include lignin. Also disclosed are fibers including the compositions, methods of making the fibers, and uses of the fibers.

Additive for fiber strengthening

Compositions that include a polymer and an aldaric acid, such as glucaric acid, are disclosed. The compositions may include polyvinyl alcohol and glucaric acid. The compositions may also include polyacrylonitrile and glucaric acid. In addition, the compositions may further include lignin. Also disclosed are fibers including the compositions, methods of making the fibers, and uses of the fibers.

Foam molding masterbatch, and molded foam article
11560459 · 2023-01-24 · ·

The present invention aims to provide a masterbatch for foam molding which can be suitably used in molding involving high shear force or molding requiring low molding temperature and which can provide a foam molded article having a high expansion ratio and good appearance quality. The present invention also aims to provide a foam molded article formed from the masterbatch for foam molding. Provided is a masterbatch for foam molding, containing: a base resin; and a thermally expandable microcapsule, the masterbatch having a true specific gravity of 0.80 g/cm.sup.3 or more and a Mooney viscosity ML 1+4 (100° C.) of 20 to 90, the base resin containing an EPDM resin, the masterbatch containing the thermally expandable microcapsule in an amount of 40 to 300 parts by weight relative to 100 parts by weight of the base resin.

Foam molding masterbatch, and molded foam article
11560459 · 2023-01-24 · ·

The present invention aims to provide a masterbatch for foam molding which can be suitably used in molding involving high shear force or molding requiring low molding temperature and which can provide a foam molded article having a high expansion ratio and good appearance quality. The present invention also aims to provide a foam molded article formed from the masterbatch for foam molding. Provided is a masterbatch for foam molding, containing: a base resin; and a thermally expandable microcapsule, the masterbatch having a true specific gravity of 0.80 g/cm.sup.3 or more and a Mooney viscosity ML 1+4 (100° C.) of 20 to 90, the base resin containing an EPDM resin, the masterbatch containing the thermally expandable microcapsule in an amount of 40 to 300 parts by weight relative to 100 parts by weight of the base resin.

RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION, AND INSULATED ELECTRICAL WIRE

The resin composition according to one aspect is a resin composition containing a polyamic acid and a solvent, wherein the polyamic acid has a repeating unit represented by the following general formula (1) in a molecular chain, and the molecular chain has a structure represented by the following general formula (2) at one end or both ends. The proportion of the structure represented by the following general formula (2) relative to 1 mol of the repeating unit represented by the following general formula (1) is 0.001 mol or more and 0.1 mol or less. In the following general formulas, R.sup.1 is a tetravalent organic group; R.sup.2 is a divalent organic group; and R.sup.3 is an organic group having 15 or less carbon atoms.

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