In various embodiments, the present disclosure pertains to core-shell particles that comprise a porous hybrid organic-inorganic shell disposed on a surface-modified non-porous polymer particle core. In some embodiments, the present disclosure pertains to chromatographic separation devices that comprise such core-shell particles. In some embodiments, the present disclosure pertains to chromatographic methods that comprise: (a) loading a sample onto a chromatographic column comprising such core-shell particles and (b) flowing a mobile phase through the column.

In various embodiments, the present disclosure pertains to core-shell particles that comprise a porous hybrid organic-inorganic shell disposed on a surface-modified non-porous polymer particle core. In some embodiments, the present disclosure pertains to chromatographic separation devices that comprise such core-shell particles. In some embodiments, the present disclosure pertains to chromatographic methods that comprise: (a) loading a sample onto a chromatographic column comprising such core-shell particles and (b) flowing a mobile phase through the column.

A film: (a) 50 to 85 wt % polymer comprising: (i) 30 to 70 wt % hard polymer with T.sub.g from 40 to 70° C. and 40 to 80 wt % (C.sub.1-C.sub.10)alkyl (meth)acrylate; 10 to 40 wt % C.sub.3-C.sub.8 carboxylic acid; and 0 to 25 wt % hydroxyalkyl (meth)acrylate; and (ii) 30 to 70 wt % soft polymer with T.sub.g from −20 to 20 ° C. and 50 to 90 wt % (C.sub.1-C.sub.10)alkyl (meth)acrylate; 5 to 30 wt % C.sub.3-C.sub.8 carboxylic acid; and 0 to 25 wt % hydroxyalkyl (meth)acrylate;
hard T.sub.g minus soft T.sub.g is at least 30° C.; (iii) 0 to 10 wt %, of (C.sub.12-C.sub.24)alkyl (meth)acrylate polymer containing crystallizable portion with T.sub.m from 0° C. to 37° C.; (b) 10 to 40 wt % of polyethylene oxide having M.sub.w from 250,000 to 4,000,000; and (c) 0 to 10 wt % of poly(vinylpyrrolidone) having M.sub.w from 25,000 to 2,000,000.

A film: (a) 50 to 85 wt % polymer comprising: (i) 30 to 70 wt % hard polymer with T.sub.g from 40 to 70° C. and 40 to 80 wt % (C.sub.1-C.sub.10)alkyl (meth)acrylate; 10 to 40 wt % C.sub.3-C.sub.8 carboxylic acid; and 0 to 25 wt % hydroxyalkyl (meth)acrylate; and (ii) 30 to 70 wt % soft polymer with T.sub.g from −20 to 20 ° C. and 50 to 90 wt % (C.sub.1-C.sub.10)alkyl (meth)acrylate; 5 to 30 wt % C.sub.3-C.sub.8 carboxylic acid; and 0 to 25 wt % hydroxyalkyl (meth)acrylate;
hard T.sub.g minus soft T.sub.g is at least 30° C.; (iii) 0 to 10 wt %, of (C.sub.12-C.sub.24)alkyl (meth)acrylate polymer containing crystallizable portion with T.sub.m from 0° C. to 37° C.; (b) 10 to 40 wt % of polyethylene oxide having M.sub.w from 250,000 to 4,000,000; and (c) 0 to 10 wt % of poly(vinylpyrrolidone) having M.sub.w from 25,000 to 2,000,000.

A film: (a) 50 to 85 wt % polymer comprising: (i) 30 to 70 wt % hard polymer with T.sub.g from 40 to 70° C. and 40 to 80 wt % (C.sub.1-C.sub.10)alkyl (meth)acrylate; 10 to 40 wt % C.sub.3-C.sub.8 carboxylic acid; and 0 to 25 wt % hydroxyalkyl (meth)acrylate; and (ii) 30 to 70 wt % soft polymer with T.sub.g from −20 to 20 ° C. and 50 to 90 wt % (C.sub.1-C.sub.10)alkyl (meth)acrylate; 5 to 30 wt % C.sub.3-C.sub.8 carboxylic acid; and 0 to 25 wt % hydroxyalkyl (meth)acrylate;
hard T.sub.g minus soft T.sub.g is at least 30° C.; (iii) 0 to 10 wt %, of (C.sub.12-C.sub.24)alkyl (meth)acrylate polymer containing crystallizable portion with T.sub.m from 0° C. to 37° C.; (b) 10 to 40 wt % of polyethylene oxide having M.sub.w from 250,000 to 4,000,000; and (c) 0 to 10 wt % of poly(vinylpyrrolidone) having M.sub.w from 25,000 to 2,000,000.

A rubber composition includes an elastomer component, a polyvinyl pyrrolidone-based resin, and a non-water-absorbent short fiber, and includes substantially no water-absorbent fiber. The elastomer component may include an ethylene-α-olefin elastomer. The polyvinyl pyrrolidone-based resin may have a K value of 10 to 100. The non-water-absorbent short fiber may include an aliphatic polyamide short fiber.

A rubber composition includes an elastomer component, a polyvinyl pyrrolidone-based resin, and a non-water-absorbent short fiber, and includes substantially no water-absorbent fiber. The elastomer component may include an ethylene-α-olefin elastomer. The polyvinyl pyrrolidone-based resin may have a K value of 10 to 100. The non-water-absorbent short fiber may include an aliphatic polyamide short fiber.

A method includes preparing a protective film including a base film and a protective layer laminated on a surface of the base film, mounting the protective film on a semiconductor wafer having a rear surface attached to a dicing tape and a front surface positioned opposite to the rear surface, the protective layer being disposed on the front surface, irradiating the rear surface of the semiconductor wafer with a dicing laser, removing the base film of the protective film from the semiconductor wafer, dividing the semiconductor wafer into individual semiconductor chips, and removing the protective layer from the individual semiconductor chips.

A method includes preparing a protective film including a base film and a protective layer laminated on a surface of the base film, mounting the protective film on a semiconductor wafer having a rear surface attached to a dicing tape and a front surface positioned opposite to the rear surface, the protective layer being disposed on the front surface, irradiating the rear surface of the semiconductor wafer with a dicing laser, removing the base film of the protective film from the semiconductor wafer, dividing the semiconductor wafer into individual semiconductor chips, and removing the protective layer from the individual semiconductor chips.

The present invention provides thin-film forming compositions comprising an antiseptic (e.g., povidone iodine, chlorhexidine, or octenidine), a non-aqueous solvent, and a film-forming material dissolved in the non-aqueous solvent, wherein the composition yields a continuous and flexible protective film upon substantial removal of the solvent. The compositions are useful for the treatment and prevention of infections in wounds, ulcers (e.g., decubitus ulcers and stasis ulcers), cuts, or burns, or against infections from bacterial, mycobacterial, viral, fungal, or amoeba causes, as well as for prevention of such infections in appropriate clinical settings (e.g., as liquid bandages or dressings). Additionally, the compositions of this invention are also useful for the treatment of infections and as a disinfectant skin preparation for pre- and/or post-surgical operations.