Patent classifications
C08L51/085
SiCoPC blend containing phosphazene and silicone/acrylate impact modifier
The invention relates to a composition for production of a thermoplastic moulding compound, wherein the composition comprises or consists of the following constituents: A) 42% to 80% by weight of at least one polymer selected from the group consisting of aromatic polycarbonate and aromatic polyestercarbonate, B) 2% to 38% by weight of at least one polysiloxane-polycarbonate block co-condensate, C) 1% to 15% by weight of at least one rubber-modified graft polymer comprising C.1) 5% to 95% by weight based on the graft polymer C of a shell composed of at least one vinyl monomer and C.2) 95% to 5% by weight based on the graft polymer C of a graft substrate composed of silicone-acrylate composite rubber, D) 2% to 10% by weight of at least one phosphazene, E) 0% to 10% by weight of at least one additive, to the moulding compound itself, to the use of the composition or moulding compound for production of moulded articles and to the moulded articles themselves.
SiCoPC blend containing phosphazene and silicone/acrylate impact modifier
The invention relates to a composition for production of a thermoplastic moulding compound, wherein the composition comprises or consists of the following constituents: A) 42% to 80% by weight of at least one polymer selected from the group consisting of aromatic polycarbonate and aromatic polyestercarbonate, B) 2% to 38% by weight of at least one polysiloxane-polycarbonate block co-condensate, C) 1% to 15% by weight of at least one rubber-modified graft polymer comprising C.1) 5% to 95% by weight based on the graft polymer C of a shell composed of at least one vinyl monomer and C.2) 95% to 5% by weight based on the graft polymer C of a graft substrate composed of silicone-acrylate composite rubber, D) 2% to 10% by weight of at least one phosphazene, E) 0% to 10% by weight of at least one additive, to the moulding compound itself, to the use of the composition or moulding compound for production of moulded articles and to the moulded articles themselves.
POLYCARBONATE RESIN COMPOSITION
A polycarbonate resin composition comprising, 100 mass parts of (A1) a polycarbonate resin that contains a polycarbonate resin having a structural unit of the following general formula (1) and (A2) a polycarbonate resin having a structural unit of the general formula (2) in a mass ratio (A1)/(A2) of 100/0 to 10/90; 3 to 20 mass parts of a phosphorus flame retardant (B); 2 to 20 mass parts of a silicone flame retardant (C); and 3 to 100 mass parts of an inorganic filler (D), wherein the phosphorus flame retardant (B) is a phosphazene compound and/or a condensed phosphate ester,
[C1]
##STR00001##
POLYCARBONATE RESIN COMPOSITION
A polycarbonate resin composition comprising, 100 mass parts of (A1) a polycarbonate resin that contains a polycarbonate resin having a structural unit of the following general formula (1) and (A2) a polycarbonate resin having a structural unit of the general formula (2) in a mass ratio (A1)/(A2) of 100/0 to 10/90; 3 to 20 mass parts of a phosphorus flame retardant (B); 2 to 20 mass parts of a silicone flame retardant (C); and 3 to 100 mass parts of an inorganic filler (D), wherein the phosphorus flame retardant (B) is a phosphazene compound and/or a condensed phosphate ester,
[C1]
##STR00001##
POLYMERIZABLE ABSORBERS OF UV AND HIGH ENERGY VISIBLE LIGHT
Described are polymerizable high energy light absorbing compounds of formula I:
##STR00001##
wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, R.sup.6, R.sup.7, R.sup.8, R.sup.9, and X are as described herein. The compounds absorb various wavelengths of ultraviolet and/or high energy visible light and are suitable for incorporation in various products, such as biomedical devices and ophthalmic devices.
POLYORGANOSILOXANE-CONTAINING POLYMER PARTICLE GROUP, COMPOSITION, RESIN COMPOSITION, AND MOLDED BODY
Polyorganosiloxane-containing polymer particles comprising: a polymer (A) comprising a polyorganosiloxane (A1) and a first vinyl polymer (A2); and a second vinyl polymer (B), wherein a proportion of particles satisfying formula (1) is less than 60%:
M/L>0.1 (1),
wherein L is a diameter of each particle of the polyorganosiloxane-containing polymer particles, as determined in an observation using a transmission electron microscope with respect to a cross section of a resin piece obtained by dispersing the polyorganosiloxane-containing polymer particles in a resin, and M is a maximum domain length of the polyorganosiloxane (A1) in the observation.
POLYORGANOSILOXANE-CONTAINING POLYMER PARTICLE GROUP, COMPOSITION, RESIN COMPOSITION, AND MOLDED BODY
Polyorganosiloxane-containing polymer particles comprising: a polymer (A) comprising a polyorganosiloxane (A1) and a first vinyl polymer (A2); and a second vinyl polymer (B), wherein a proportion of particles satisfying formula (1) is less than 60%:
M/L>0.1 (1),
wherein L is a diameter of each particle of the polyorganosiloxane-containing polymer particles, as determined in an observation using a transmission electron microscope with respect to a cross section of a resin piece obtained by dispersing the polyorganosiloxane-containing polymer particles in a resin, and M is a maximum domain length of the polyorganosiloxane (A1) in the observation.
Conductive plastic and application thereof
The present invention discloses a conductive plastic, based on the total mass of the conductive plastic, which includes: a resin with a low melting point 42%-54%; a toughened resin 4%-10%; carbon black 33%-47%; a dispersant 1%-3%; wherein, the toughened resin is a polymer of acrylic acid and siloxane; and use thereof. The conductive plastic of the present invention has a low melting temperature and high conductive performance, and is suitable for a wire cable shielding layer.
Conductive plastic and application thereof
The present invention discloses a conductive plastic, based on the total mass of the conductive plastic, which includes: a resin with a low melting point 42%-54%; a toughened resin 4%-10%; carbon black 33%-47%; a dispersant 1%-3%; wherein, the toughened resin is a polymer of acrylic acid and siloxane; and use thereof. The conductive plastic of the present invention has a low melting temperature and high conductive performance, and is suitable for a wire cable shielding layer.
THERMOPLASTIC RESIN COMPOSITION FOR HIGH-BRIGHTNESS UNPAINTED METALLIC MATERIAL AND A MOLDED ARTICLE INCLUDING THE SAME
Disclosed are a thermoplastic resin composition for a high-brightness unpainted metallic material that has an excellent impact strength, chemical resistance, and heat resistance and exhibits an excellent metallic texture, and a molded article including the same.
The thermoplastic resin composition suitably includes a polycarbonate resin; a first copolymer; a polyester resin; a copolymer having a core-shell structure and having, as a core, one or more rubber polymers selected from the group consisting of a diene-based rubber polymer, an acrylic rubber polymer, and a silicone-based rubber polymer; a heat resistant component including one or more selected from the group consisting of N-phenyl maleimide, a vinyl aromatic compound, and maleic anhydride; and metal particles.