Patent classifications
C08L53/025
Resin Sheet and Circuit Board Material Using the Same
A resin sheet is provided having low dielectric properties, and a circuit board material using such a sheet. The resin sheet includes a resin layer containing a cyclic polyolefin resin copolymer having a crystal melting peak temperature of less than 100° C., the resin sheet having a dielectric loss tangent at 12 GHz of less than 0.005.
Resin Sheet and Circuit Board Material Using the Same
A resin sheet is provided having low dielectric properties, and a circuit board material using such a sheet. The resin sheet includes a resin layer containing a cyclic polyolefin resin copolymer having a crystal melting peak temperature of less than 100° C., the resin sheet having a dielectric loss tangent at 12 GHz of less than 0.005.
Damping thermoplastic olefin elastomers
A thermoplastic elastomer compound includes polyolefin elastomer, high softening point tackifier, and, optionally, styrenic block copolymer. When styrenic block copolymer is present, the weight ratio of polyolefin elastomer to styrenic block copolymer is no less than about 1:1. The polyolefin elastomer has a POE Tan Delta Peak Temperature, the styrenic block copolymer has a SBC Tan Delta Peak Temperature, and the thermoplastic elastomer compound has a Compound Tan Delta Peak Temperature. The Compound Tan Delta Peak Temperature is greater than the POE Tan Delta Peak Temperature. When styrenic block copolymer is present, Compound Tan Delta Peak Temperature is also greater than the SBC Tan Delta Peak Temperature. The thermoplastic elastomer compound exhibits useful damping properties at or above room temperature and can be formed into plastic articles, including foamed plastic articles and/or crosslinked plastic articles, which can be useful for a variety of damping applications.
Damping thermoplastic olefin elastomers
A thermoplastic elastomer compound includes polyolefin elastomer, high softening point tackifier, and, optionally, styrenic block copolymer. When styrenic block copolymer is present, the weight ratio of polyolefin elastomer to styrenic block copolymer is no less than about 1:1. The polyolefin elastomer has a POE Tan Delta Peak Temperature, the styrenic block copolymer has a SBC Tan Delta Peak Temperature, and the thermoplastic elastomer compound has a Compound Tan Delta Peak Temperature. The Compound Tan Delta Peak Temperature is greater than the POE Tan Delta Peak Temperature. When styrenic block copolymer is present, Compound Tan Delta Peak Temperature is also greater than the SBC Tan Delta Peak Temperature. The thermoplastic elastomer compound exhibits useful damping properties at or above room temperature and can be formed into plastic articles, including foamed plastic articles and/or crosslinked plastic articles, which can be useful for a variety of damping applications.
Thermoplastic elastomer composition
A thermoplastic elastomer composition possessing a good combination of elastic recovery, tear strength at 25° C., stress relaxation and reduced (improved) anisotropy, which is based on a hydrogenated block copolymer (A), a thermoplastic resin (B), a rubber softener (C) and a polyolefin elastomer (D), of specified types and proportions, and which is suitable for use in a variety of film and sheet applications.
Thermoplastic elastomer composition
A thermoplastic elastomer composition possessing a good combination of elastic recovery, tear strength at 25° C., stress relaxation and reduced (improved) anisotropy, which is based on a hydrogenated block copolymer (A), a thermoplastic resin (B), a rubber softener (C) and a polyolefin elastomer (D), of specified types and proportions, and which is suitable for use in a variety of film and sheet applications.
Thermoplastic elastomer composition for weather strip material and weather strip
Provided is a thermoplastic elastomer composition for a weather strip material which is used for obtaining a molded product which has excellent adhesiveness to both a thermoplastic elastomer adherend and a crystalline ethylene resin adherend and also has excellent heat resistance at a fused portion. The thermoplastic elastomer composition for a weather strip material according to the disclosure contains: an ethylene-α-olefin copolymer rubber (A); an α-olefin crystalline thermoplastic resin (B) having a melting point of 140° C. or higher; an olefin block copolymer (C) obtained by hydrogenating a block copolymer which has a conjugated diene polymer block with a 1,2-vinyl bond content of 25 mol % or less at both ends and also has a conjugated diene polymer block with a 1,2-vinyl bond content of more than 25 mol % in the middle; and a crystalline ethylene resin (D).
Thermoplastic elastomer composition for weather strip material and weather strip
Provided is a thermoplastic elastomer composition for a weather strip material which is used for obtaining a molded product which has excellent adhesiveness to both a thermoplastic elastomer adherend and a crystalline ethylene resin adherend and also has excellent heat resistance at a fused portion. The thermoplastic elastomer composition for a weather strip material according to the disclosure contains: an ethylene-α-olefin copolymer rubber (A); an α-olefin crystalline thermoplastic resin (B) having a melting point of 140° C. or higher; an olefin block copolymer (C) obtained by hydrogenating a block copolymer which has a conjugated diene polymer block with a 1,2-vinyl bond content of 25 mol % or less at both ends and also has a conjugated diene polymer block with a 1,2-vinyl bond content of more than 25 mol % in the middle; and a crystalline ethylene resin (D).
RESIN COMPOSITION AND MOLDED BODY
A resin composition containing an ethylene-vinyl acetate copolymer (I) and a hydrogenated block copolymer (II), wherein the hydrogenated block copolymer (II) is a hydrogenated product of a block copolymer (P) containing a polymer block (A) containing a structural unit derived from an aromatic vinyl compound and a polymer block (B) containing 1 to 100% by mass of a structural unit (b1) derived from farnesene and 99 to 0% by mass of a structural unit (b2) derived from a conjugated diene other than farnesene, wherein the hydrogenation rate of carbon-carbon double bonds in the structural unit derived from a conjugated diene in the block copolymer (P) is 70 mol % or more, and in the resin composition, the content of the ethylene-vinyl acetate copolymer (I) is 40 to 95% by mass and the content of the hydrogenated block copolymer (II) is 5 to 60% by mass.
RESIN COMPOSITION AND MOLDED BODY
A resin composition containing an ethylene-vinyl acetate copolymer (I) and a hydrogenated block copolymer (II), wherein the hydrogenated block copolymer (II) is a hydrogenated product of a block copolymer (P) containing a polymer block (A) containing a structural unit derived from an aromatic vinyl compound and a polymer block (B) containing 1 to 100% by mass of a structural unit (b1) derived from farnesene and 99 to 0% by mass of a structural unit (b2) derived from a conjugated diene other than farnesene, wherein the hydrogenation rate of carbon-carbon double bonds in the structural unit derived from a conjugated diene in the block copolymer (P) is 70 mol % or more, and in the resin composition, the content of the ethylene-vinyl acetate copolymer (I) is 40 to 95% by mass and the content of the hydrogenated block copolymer (II) is 5 to 60% by mass.