Conventionally, a photocurable composition to which an ultraviolet absorber is added is difficult to form a colorless and transparent cured resin because the ultraviolet absorber itself is colored, and thus the photocurable composition is hardly to be used in a display apparatus required for colorlessness and transparency. Provided is a photocurable composition including a specific compound, wherein a light transmittance of 385 nm is 50% or less and a yellowness index is 3.0 or less in a state in which a cured resin having a thickness of 200 m or less is interposed between alkali free glass plates each having a thickness of 0.7 mm.

Conventionally, a photocurable composition to which an ultraviolet absorber is added is difficult to form a colorless and transparent cured resin because the ultraviolet absorber itself is colored, and thus the photocurable composition is hardly to be used in a display apparatus required for colorlessness and transparency. Provided is a photocurable composition including a specific compound, wherein a light transmittance of 385 nm is 50% or less and a yellowness index is 3.0 or less in a state in which a cured resin having a thickness of 200 m or less is interposed between alkali free glass plates each having a thickness of 0.7 mm.

A composition includes a near infrared absorbing pigment, a compound represented by Formula (1), a primary to tertiary amine compound having a molecular weight of 500 or less and a boiling point of 300 C. or lower, a resin, and a solvent, in which the compound represented by Formula (1) has a solubility in propylene glycol methyl ether acetate at 25 C. of 0.1 g/L or higher, and a content of the amine compound in a total solid content of the composition is 10 to 5000 mass ppm.

P.sup.1L.sup.1-(X.sup.1).sub.n).sub.m(1)

A composition includes a near infrared absorbing pigment, a compound represented by Formula (1), a primary to tertiary amine compound having a molecular weight of 500 or less and a boiling point of 300 C. or lower, a resin, and a solvent, in which the compound represented by Formula (1) has a solubility in propylene glycol methyl ether acetate at 25 C. of 0.1 g/L or higher, and a content of the amine compound in a total solid content of the composition is 10 to 5000 mass ppm.

P.sup.1L.sup.1-(X.sup.1).sub.n).sub.m(1)

A cadmium free quantum dot including a semiconductor nanocrystal core and a semiconductor nanocrystal shell disposed on the core, wherein the quantum dot does not include cadmium and includes indium and zinc, the quantum dot has a maximum photoluminescence peak in a red light wavelength region, a full width at half maximum (FWHM) of the maximum photoluminescence peak is less than or equal to about 40 nanometers (nm), an ultraviolet-visible (UV-Vis) absorption spectrum of the quantum dot includes a valley between about 450 nm to a center wavelength of a first absorption peak, and a valley depth (VD) defined by the following equation is greater than or equal to about 0.2, a quantum dot polymer composite including the same, and a display device including the quantum dot-polymer composite:

(Abs.sub.firstAbs.sub.valley)/Abs.sub.first=VD.

A cadmium free quantum dot including a semiconductor nanocrystal core and a semiconductor nanocrystal shell disposed on the core, wherein the quantum dot does not include cadmium and includes indium and zinc, the quantum dot has a maximum photoluminescence peak in a red light wavelength region, a full width at half maximum (FWHM) of the maximum photoluminescence peak is less than or equal to about 40 nanometers (nm), an ultraviolet-visible (UV-Vis) absorption spectrum of the quantum dot includes a valley between about 450 nm to a center wavelength of a first absorption peak, and a valley depth (VD) defined by the following equation is greater than or equal to about 0.2, a quantum dot polymer composite including the same, and a display device including the quantum dot-polymer composite:

(Abs.sub.firstAbs.sub.valley)/Abs.sub.first=VD.

Disclosed herein is a resin composition, comprising: a crosslinking agent, its prepolymer, or a combination thereof; and a first unsaturated bond-containing resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board and achieve improvement in at least one, more or all properties including volatile content of prepreg, stickiness of prepreg, resin filling property of prepreg, glass transition temperature, dimensional stability under heat, T288 thermal resistance, thermal resistance after moisture absorption, dielectric constant and dissipation factor.

Disclosed herein is a resin composition, comprising: a crosslinking agent, its prepolymer, or a combination thereof; and a first unsaturated bond-containing resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board and achieve improvement in at least one, more or all properties including volatile content of prepreg, stickiness of prepreg, resin filling property of prepreg, glass transition temperature, dimensional stability under heat, T288 thermal resistance, thermal resistance after moisture absorption, dielectric constant and dissipation factor.

The invention relates to a curable composition comprising: a) at least one polymer having at least one silicon-containing group of formula Si(R.sup.1).sub.k(Y).sub.3-k as defined herein; b) at least one titanium complex of formula TiL(OR.sup.3).sub.2 wherein each R.sup.3 is independently selected from a C.sub.1-20 alkyl or aryl which may optionally contain one or more heteroatoms, preferably selected from silicon, sulfur, nitrogen or oxygen atoms, wherein preferably R.sup.3 is selected from n-butyl or isopropyl, and L is a deprotonated, tridentate ligand, and c) optionally at least one compound which has a hydrolyzable silicon-containing group and a weight average molecular weight in the range of 100 to 1000 g/mol, preparations containing these compositions and use thereof.

The invention relates to a curable composition comprising: a) at least one polymer having at least one silicon-containing group of formula Si(R.sup.1).sub.k(Y).sub.3-k as defined herein; b) at least one titanium complex of formula TiL(OR.sup.3).sub.2 wherein each R.sup.3 is independently selected from a C.sub.1-20 alkyl or aryl which may optionally contain one or more heteroatoms, preferably selected from silicon, sulfur, nitrogen or oxygen atoms, wherein preferably R.sup.3 is selected from n-butyl or isopropyl, and L is a deprotonated, tridentate ligand, and c) optionally at least one compound which has a hydrolyzable silicon-containing group and a weight average molecular weight in the range of 100 to 1000 g/mol, preparations containing these compositions and use thereof.