Disclosed herein is a mud material comprising a refractory raw material, an organic binder, and a curing agent, wherein part or all of the organic binder is a novolac-type phenol resin, part or all of the curing agent is a methylene donor, and wherein the methylene donor is at least one selected from the group consisting of hexa(methoxymethyl)melamine and hexamethoxymethylolmelamine.

In one embodiment, an alkylphenol copolymer is disclosed wherein the copolymer comprises at least one alkylphenol monomer and the alkylphenol copolymer exhibits the following: an oscillation displacement Θ of greater than 0 at a temperature of −5° C. in a first oscillation temperature sweep and an oscillation displacement Θ in a second oscillation temperature sweep within 25% of the oscillation displacement Θ in the first oscillation temperature sweep at a temperature of −5° C. In a further embodiment, a petroleum composition is disclosed wherein the composition comprises a petroleum source and a macromolecular compound wherein the macromolecular compound exhibits the following: an oscillation displacement Θ of greater than 0 at a temperature of −10° C. in a first oscillation temperature sweep, and an oscillation displacement Θ in a second oscillation temperature sweep within 25% of the oscillation displacement Θ in the first oscillation temperature sweep at a temperature of −10° C.

In one embodiment, an alkylphenol copolymer is disclosed wherein the copolymer comprises at least one alkylphenol monomer and the alkylphenol copolymer exhibits the following: an oscillation displacement Θ of greater than 0 at a temperature of −5° C. in a first oscillation temperature sweep and an oscillation displacement Θ in a second oscillation temperature sweep within 25% of the oscillation displacement Θ in the first oscillation temperature sweep at a temperature of −5° C. In a further embodiment, a petroleum composition is disclosed wherein the composition comprises a petroleum source and a macromolecular compound wherein the macromolecular compound exhibits the following: an oscillation displacement Θ of greater than 0 at a temperature of −10° C. in a first oscillation temperature sweep, and an oscillation displacement Θ in a second oscillation temperature sweep within 25% of the oscillation displacement Θ in the first oscillation temperature sweep at a temperature of −10° C.

A wet friction material includes a base including a matrix of fibers and filler particles embedded in the matrix of fibers; a binder embedded in an interior of the base; and a quaternary ammonium salt containing coating on an outer surface of the base. The quaternary ammonium salt containing coating can include a quaternary ammonium salt and a solution binder.

A wet friction material includes a base including a matrix of fibers and filler particles embedded in the matrix of fibers; a binder embedded in an interior of the base; and a quaternary ammonium salt containing coating on an outer surface of the base. The quaternary ammonium salt containing coating can include a quaternary ammonium salt and a solution binder.

A wet friction material includes a base including a matrix of fibers and filler particles embedded in the matrix of fibers; a binder embedded in an interior of the base; and a quaternary ammonium salt containing coating on an outer surface of the base. The quaternary ammonium salt containing coating can include a quaternary ammonium salt and a solution binder.

A seal material for a semiconductor manufacturing device is made of a rubber composition containing fluororubber and phenol resin powder. The content of the phenol resin powder is 1 part by mass or more and 50 parts by mass or less with respect to 100 parts by mass of the fluororubber. The average particle size of the phenol resin powder is 1 μm or more and 20 μm or less.

A hard mask-forming composition which forms a hard mask used in lithography, including: a resin containing an aromatic ring and a polar group; and a compound containing at least one of an oxazine ring fused to an aromatic ring, and a fluorene ring.

A resist underlayer composition and a method of forming patterns using a resist underlayer composition, the resist underlayer composition including a polymer, the polymer including a structural unit that is a reaction product of an isocyanurate compound, the isocyanurate compound having at least one thiol group thereon, and a solvent.

A resist underlayer composition and a method of forming patterns using a resist underlayer composition, the resist underlayer composition including a polymer, the polymer including a structural unit that is a reaction product of an isocyanurate compound, the isocyanurate compound having at least one thiol group thereon, and a solvent.