C08L61/06

Thermally Stable Macromolecular Compound and Petroleum Composition Including the Same

In one embodiment, an alkylphenol copolymer is disclosed wherein the copolymer comprises at least one alkylphenol monomer and the alkylphenol copolymer exhibits the following: an oscillation displacement Θ of greater than 0 at a temperature of −5° C. in a first oscillation temperature sweep and an oscillation displacement Θ in a second oscillation temperature sweep within 25% of the oscillation displacement Θ in the first oscillation temperature sweep at a temperature of −5° C. In a further embodiment, a petroleum composition is disclosed wherein the composition comprises a petroleum source and a macromolecular compound wherein the macromolecular compound exhibits the following: an oscillation displacement Θ of greater than 0 at a temperature of −10° C. in a first oscillation temperature sweep, and an oscillation displacement Θ in a second oscillation temperature sweep within 25% of the oscillation displacement Θ in the first oscillation temperature sweep at a temperature of −10° C.

Thermally Stable Macromolecular Compound and Petroleum Composition Including the Same

In one embodiment, an alkylphenol copolymer is disclosed wherein the copolymer comprises at least one alkylphenol monomer and the alkylphenol copolymer exhibits the following: an oscillation displacement Θ of greater than 0 at a temperature of −5° C. in a first oscillation temperature sweep and an oscillation displacement Θ in a second oscillation temperature sweep within 25% of the oscillation displacement Θ in the first oscillation temperature sweep at a temperature of −5° C. In a further embodiment, a petroleum composition is disclosed wherein the composition comprises a petroleum source and a macromolecular compound wherein the macromolecular compound exhibits the following: an oscillation displacement Θ of greater than 0 at a temperature of −10° C. in a first oscillation temperature sweep, and an oscillation displacement Θ in a second oscillation temperature sweep within 25% of the oscillation displacement Θ in the first oscillation temperature sweep at a temperature of −10° C.

SYSTEM AND METHOD FOR MANUFACTURING PARTICLE BOARD FROM WASTE-WOOD POWDERS AND ITS COMPOSITION THEREOF

The system comprises a grinder for crushing and pulverizing waste phenolic polymer material, wood fiber and porous material to form a powder; a homogenizer for mixing waste phenolic polymer material powder uniformly with resin for bonding the powder of the waste phenolic polymer material, wherein resin is added for bonding the powder of the waste phenolic polymer material, the powder of wood fiber and powder of porous material; a mixing chamber for mixing powder of waste phenolic polymer material, wood fiber and porous material uniformly; a pressing device for applying one of the methods of hot pressing, cold pressing, injection by an injection machine, extrusion by an extruder, or foaming of the obtained mixture to form desired solid material; and an analysis unit for determining a physical and mechanical properties of these boards using a series of tests such as compressive, tensile, flexural, thickness swelling, water absorption, and moisture content.

SYSTEM AND METHOD FOR MANUFACTURING PARTICLE BOARD FROM WASTE-WOOD POWDERS AND ITS COMPOSITION THEREOF

The system comprises a grinder for crushing and pulverizing waste phenolic polymer material, wood fiber and porous material to form a powder; a homogenizer for mixing waste phenolic polymer material powder uniformly with resin for bonding the powder of the waste phenolic polymer material, wherein resin is added for bonding the powder of the waste phenolic polymer material, the powder of wood fiber and powder of porous material; a mixing chamber for mixing powder of waste phenolic polymer material, wood fiber and porous material uniformly; a pressing device for applying one of the methods of hot pressing, cold pressing, injection by an injection machine, extrusion by an extruder, or foaming of the obtained mixture to form desired solid material; and an analysis unit for determining a physical and mechanical properties of these boards using a series of tests such as compressive, tensile, flexural, thickness swelling, water absorption, and moisture content.

SYSTEM AND METHOD FOR MANUFACTURING PARTICLE BOARD FROM WASTE-WOOD POWDERS AND ITS COMPOSITION THEREOF

The system comprises a grinder for crushing and pulverizing waste phenolic polymer material, wood fiber and porous material to form a powder; a homogenizer for mixing waste phenolic polymer material powder uniformly with resin for bonding the powder of the waste phenolic polymer material, wherein resin is added for bonding the powder of the waste phenolic polymer material, the powder of wood fiber and powder of porous material; a mixing chamber for mixing powder of waste phenolic polymer material, wood fiber and porous material uniformly; a pressing device for applying one of the methods of hot pressing, cold pressing, injection by an injection machine, extrusion by an extruder, or foaming of the obtained mixture to form desired solid material; and an analysis unit for determining a physical and mechanical properties of these boards using a series of tests such as compressive, tensile, flexural, thickness swelling, water absorption, and moisture content.

RESIN COMPOSITION, ANTI-ETCHING LAYER AND ETCHING METHOD

A resin composition, an anti-etching layer and an etching method are provided. The resin composition includes a resin (A), a crosslinking agent (B), a surfactant (C), and a solvent (D). The resin (A) includes a hydroxyl type polystyrene resin (A-1), a hydroxyl type phenolic resin (A-2), a polyhydroxy phenol resin (A-3), or a combination thereof. The crosslinking agent (B) includes a structure of novolac epoxy resin type (B-1), polymethyl methacrylate type (B-2), maleimide type (B-3) or hyperbranched oligomer (B-4).

Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin composition

The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 μm or less.

Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin composition

The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 μm or less.

Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, and black matrix

A black photosensitive resin composition comprising (A) an acid crosslinkable group-containing silicone resin, (B) carbon black, and (C) a photoacid generator is coated onto a substrate to form a photosensitive resin coating which has improved reliability with respect to adhesion and crack resistance, resolution and flexibility while maintaining satisfactory light shielding properties.

Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, and black matrix

A black photosensitive resin composition comprising (A) an acid crosslinkable group-containing silicone resin, (B) carbon black, and (C) a photoacid generator is coated onto a substrate to form a photosensitive resin coating which has improved reliability with respect to adhesion and crack resistance, resolution and flexibility while maintaining satisfactory light shielding properties.