Methods, systems, and devices are disclosed for fabricating 3D piezoelectric materials. In one aspect, a method includes photopolymerizing a selected portion of a two dimensional plane in a sample of a photolabile polymer solution containing piezoelectric nanoparticles to form a layer of a piezoelectric material, the photopolymerizing including directing light from a light source based on a pattern design in the selected portion of the photolabile polymer solution; and moving one or both of the sample and the directed light to photopolymerize another selected portion of another two dimensional plane in the sample to form another layer of the piezoelectric material.

Methods, systems, and devices are disclosed for fabricating 3D piezoelectric materials. In one aspect, a method includes photopolymerizing a selected portion of a two dimensional plane in a sample of a photolabile polymer solution containing piezoelectric nanoparticles to form a layer of a piezoelectric material, the photopolymerizing including directing light from a light source based on a pattern design in the selected portion of the photolabile polymer solution; and moving one or both of the sample and the directed light to photopolymerize another selected portion of another two dimensional plane in the sample to form another layer of the piezoelectric material.

Provided is a resin composition that has high moisture resistance reliability after curing (particularly, high shear strength after a moisture resistance test), is curable at low temperature, and has light curing properties and heat curing properties. There are also provided an adhesive agent containing this resin composition, a cured product of the resin composition, a semiconductor device containing this cured product, and an electronic component containing the semiconductor device. The resin composition includes (A) a multifunctional (meth)acrylate resin, (B) a multifunctional thiol resin, and (C) a calcium carbonate filler having a purity of 99% or more. The component (B) preferably contains a multifunctional thiol resin having no ester bond in the molecule. The resin composition more preferably further contains talc.

Provided is a resin composition that has high moisture resistance reliability after curing (particularly, high shear strength after a moisture resistance test), is curable at low temperature, and has light curing properties and heat curing properties. There are also provided an adhesive agent containing this resin composition, a cured product of the resin composition, a semiconductor device containing this cured product, and an electronic component containing the semiconductor device. The resin composition includes (A) a multifunctional (meth)acrylate resin, (B) a multifunctional thiol resin, and (C) a calcium carbonate filler having a purity of 99% or more. The component (B) preferably contains a multifunctional thiol resin having no ester bond in the molecule. The resin composition more preferably further contains talc.

A resin powder for solid freeform fabrication includes resin particles having a significantly pillar-like form including resin particles having a concave portion on the circumferential side surface.

A resin powder for solid freeform fabrication includes resin particles having a significantly pillar-like form including resin particles having a concave portion on the circumferential side surface.

An object of the present invention is to provide a coating composition capable of forming a coating film which can maintain its appearance and gloss over a long period and which has high film hardness and high flexibility and exhibits excellent adhesion with respect to an epoxy resin anticorrosive coating film. An acrylic polysiloxane resin coating composition of the invention includes (A) a silicone resin, (B) a compound having one or more functional groups capable of undergoing Michael addition reaction with an unsaturated double bond in an acryloyloxy group, and having one or more alkoxy groups bonded to silicon, (C) a trifunctional or polyfunctional aliphatic urethane acrylate oligomer having a cyclic structure, and (D) a bifunctional acrylate monomer having no ether structures (except an ether structure in an acryloyloxy group) and no aromatic rings, the mass ratio of the total amount of (A) and (B) to the total amount of any acrylate oligomer(s) and any acrylate monomer(s) being 40:60 to 70:30.

An object of the present invention is to provide a coating composition capable of forming a coating film which can maintain its appearance and gloss over a long period and which has high film hardness and high flexibility and exhibits excellent adhesion with respect to an epoxy resin anticorrosive coating film. An acrylic polysiloxane resin coating composition of the invention includes (A) a silicone resin, (B) a compound having one or more functional groups capable of undergoing Michael addition reaction with an unsaturated double bond in an acryloyloxy group, and having one or more alkoxy groups bonded to silicon, (C) a trifunctional or polyfunctional aliphatic urethane acrylate oligomer having a cyclic structure, and (D) a bifunctional acrylate monomer having no ether structures (except an ether structure in an acryloyloxy group) and no aromatic rings, the mass ratio of the total amount of (A) and (B) to the total amount of any acrylate oligomer(s) and any acrylate monomer(s) being 40:60 to 70:30.

The invention relates to a process for preparing a thermoplastic resin comprising the following steps: a) mixing: a thermoplastic copolyester (A) having a shore A hardness of less than 95; and a silicone elastomer (B) comprising a polydiorganosiloxane gum having a plasticity of at least 30 and having on average at least 2 alkenyl groups per polymeric chain and optionally a reinforcing agent in the range of 0 to 50 wt % based on the weight of the polydiorganosiloxane gum; and a radical initiator (C) in an amount of 0.01 to 5 wt % based on the weight of the silicone elastomer; and optionally an adhesion additive (D); wherein the weight ratio of the silicone elastomer to the thermoplastic copolyester (B:A) is from 15:85 to 99.5:0.5; b) dynamically vulcanizing the silicone elastomer in the thermoplastic copolyester at an elevated temperature. The invention also relates to a thermoplastic resin itself.

The invention relates to a process for preparing a thermoplastic resin comprising the following steps: a) mixing: a thermoplastic copolyester (A) having a shore A hardness of less than 95; and a silicone elastomer (B) comprising a polydiorganosiloxane gum having a plasticity of at least 30 and having on average at least 2 alkenyl groups per polymeric chain and optionally a reinforcing agent in the range of 0 to 50 wt % based on the weight of the polydiorganosiloxane gum; and a radical initiator (C) in an amount of 0.01 to 5 wt % based on the weight of the silicone elastomer; and optionally an adhesion additive (D); wherein the weight ratio of the silicone elastomer to the thermoplastic copolyester (B:A) is from 15:85 to 99.5:0.5; b) dynamically vulcanizing the silicone elastomer in the thermoplastic copolyester at an elevated temperature. The invention also relates to a thermoplastic resin itself.