A polyether electrical-resistance adjusting agent of the present invention comprises a polymer that contains 10 to 60 mol % of a structural unit derived from an epihalohydrin (a), 30 to 89 mol % of a structural unit derived from an alkylene oxide (b), and 1 to 15 mol % of a structural unit derived from an ethylenically unsaturated group-containing monomer (c), and that has a weight-average molecular weight of 1,300,000 or less.

A polyether electrical-resistance adjusting agent of the present invention comprises a polymer that contains 10 to 60 mol % of a structural unit derived from an epihalohydrin (a), 30 to 89 mol % of a structural unit derived from an alkylene oxide (b), and 1 to 15 mol % of a structural unit derived from an ethylenically unsaturated group-containing monomer (c), and that has a weight-average molecular weight of 1,300,000 or less.

A highly damping homogenous elastomeric polymer blend. The elastomeric polymer blend comprises from about 50% to about 95 wt % epihalohydrin and from about 5% to about 50 wt % polymethylmethacrylate. The blend is homogenous and has a vertical rebound between 0 and about 10% and a Tg between about −20° C. and about 45° C. when measured by rheology.

A highly damping homogenous elastomeric polymer blend. The elastomeric polymer blend comprises from about 50% to about 95 wt % epihalohydrin and from about 5% to about 50 wt % polymethylmethacrylate. The blend is homogenous and has a vertical rebound between 0 and about 10% and a Tg between about −20° C. and about 45° C. when measured by rheology.

A highly damping homogenous elastomeric polymer blend. The elastomeric polymer blend comprises from about 50% to about 95 wt % epihalohydrin and from about 5% to about 50 wt % polymethylmethacrylate. The blend is homogenous and has a vertical rebound between 0 and about 10% and a Tg between about −20° C. and about 45° C. when measured by rheology.

An aqueous electrolytic composition and a process for electrodeposition of copper on a dielectric or semiconductor base structure using the aqueous electrolytic compostion. The process includes (i) contacting a metalizing substrate comprising a seminal conductive layer on the base structure with an aqueous electrolytic deposition composition; and (ii) supplying electrical current to the electrolytic deposition composition to deposit copper on the substrate. The aqueous electrolytic composition comprises: (a) copper ions; (b) an acid; (c) a suppressor; and (d) a quaternized poly(epihalohydrin) comprising n repeating units corresponding to structure 1N and p repeating units corresponding to structure 1P:

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An aqueous electrolytic composition and a process for electrodeposition of copper on a dielectric or semiconductor base structure using the aqueous electrolytic compostion. The process includes (i) contacting a metalizing substrate comprising a seminal conductive layer on the base structure with an aqueous electrolytic deposition composition; and (ii) supplying electrical current to the electrolytic deposition composition to deposit copper on the substrate. The aqueous electrolytic composition comprises: (a) copper ions; (b) an acid; (c) a suppressor; and (d) a quaternized poly(epihalohydrin) comprising n repeating units corresponding to structure 1N and p repeating units corresponding to structure 1P:

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A liquid epoxy resin composition is provided. In preferred embodiments, the liquid epoxy resin composition is free of bisphenol A, bisphenol F, and bisphenol S, including epoxides thereof, and is useful in preparing a polyether polymer having utility in coating compositions, including, e.g., coating compositions for use on food or beverage containers.

A liquid epoxy resin composition is provided. In preferred embodiments, the liquid epoxy resin composition is free of bisphenol A, bisphenol F, and bisphenol S, including epoxides thereof, and is useful in preparing a polyether polymer having utility in coating compositions, including, e.g., coating compositions for use on food or beverage containers.

A curable composition including (A) a compound having two or more alkenyl groups and a perfluoro(poly)ether group in one molecule, wherein the perfluoro(poly)ether group is represented by formula: —(OC.sub.6F.sub.12).sub.a—(OC.sub.5F.sub.10).sub.b—(OC.sub.4F.sub.8).sub.c—(OC.sub.3X.sup.10.sub.6).sub.d—(OC.sub.2F.sub.4).sub.e—(OCF.sub.2).sub.f—, a, b, c and d are each independently an integer of 0 to 30, e and f are each independently an integer of 1 to 200, the sum of a, b, c, d, e and f is at least 5, the occurrence order of the respective repeating units in parentheses with the subscript a, b, c, d, e or f is not limited in the formula, a ratio of e to f is 1.0 or more, and each X.sup.10 , at each occurrence, is independently a hydrogen atom, a fluorine atom or a chlorine atom, (B) an organosilicon compound which has two or more hydrogen atoms each bonding to a silicon atom, in one molecule, and (C) a catalyst.