A resin composition contains a (A) thermoplastic component, a (B) thermosetting component, and a (C) inorganic filler, 5%-weight-reduction temperature of a hardened substance of the resin composition being 440 degrees C. or more.

Provided is a thermosetting resin composition including an epoxy resin and thermally conductive particles. A thermal conductivity λ.sub.200 at 200° C. of a cured product obtained by heating the thermosetting resin composition at 200° C. for 90 minutes is 12 W/(m.Math.K) or higher. In addition, a volume resistivity R.sub.200 of the cured product at 200° C. is preferably 1.0×10.sup.10 Ω.Math.m or more. In addition, a resin sheet using this thermosetting resin composition is provided. Furthermore, a metal base substrate using this thermosetting resin composition is provided.

Provided is a thermosetting resin composition including an epoxy resin and thermally conductive particles. A thermal conductivity λ.sub.200 at 200° C. of a cured product obtained by heating the thermosetting resin composition at 200° C. for 90 minutes is 12 W/(m.Math.K) or higher. In addition, a volume resistivity R.sub.200 of the cured product at 200° C. is preferably 1.0×10.sup.10 Ω.Math.m or more. In addition, a resin sheet using this thermosetting resin composition is provided. Furthermore, a metal base substrate using this thermosetting resin composition is provided.

The present invention relates to novel polyaryl ether ketone copolymers, a method for their preparation, polymer compositions including the same and shaped articles manufactured from said polymer compositions.

The present invention relates to novel polyaryl ether ketone copolymers, a method for their preparation, polymer compositions including the same and shaped articles manufactured from said polymer compositions.

[Problem] Provided is a resin composition, resin sheet, prepreg and printed wiring board capable of obtaining excellent low permittivity, low dielectric loss tangent, flexibility and peel strength.

[Solution Means] A resin composition containing (A) a maleimide compound exhibiting a relative permittivity of lower than 2.7, (B) a polyphenylene ether compound represented by general formula (1) below and having a number-average molecular weight of 1000 to 7000, and (C) a block copolymer with a styrene skeleton. In general formula (1), X represents an aryl group, —(Y—O)n.sub.2- represents a polyphenylene ether portion, R.sub.1, R.sub.2 and R.sub.3 each independently represent a hydrogen atom or an alkyl, alkenyl or alkynyl group, n.sub.2 represents an integer of 1 to 100, n.sub.1 represents an integer of 1 to 6 and n.sub.3 represents an integer of 1 to 4.

##STR00001##

[Problem] Provided is a resin composition, resin sheet, prepreg and printed wiring board capable of obtaining excellent low permittivity, low dielectric loss tangent, flexibility and peel strength.

[Solution Means] A resin composition containing (A) a maleimide compound exhibiting a relative permittivity of lower than 2.7, (B) a polyphenylene ether compound represented by general formula (1) below and having a number-average molecular weight of 1000 to 7000, and (C) a block copolymer with a styrene skeleton. In general formula (1), X represents an aryl group, —(Y—O)n.sub.2- represents a polyphenylene ether portion, R.sub.1, R.sub.2 and R.sub.3 each independently represent a hydrogen atom or an alkyl, alkenyl or alkynyl group, n.sub.2 represents an integer of 1 to 100, n.sub.1 represents an integer of 1 to 6 and n.sub.3 represents an integer of 1 to 4.

##STR00001##

A thermoplastic resin composition of the present invention comprises: about 5 wt % to about 35 wt % of a modified polyaryletherketone resin comprising a repeat unit represented by chemical formula 1; about 5 wt % to about 35 wt % of a polyether ether ketone resin; about 20 wt % to about 40 wt % of a polyphenylsulfone resin; and about 15 wt % to about 50 wt % of glass fibers. The thermoplastic resin composition has good properties in terms of adhesion to metals, impact resistance, and so on.

A thermoplastic resin composition of the present invention comprises: about 5 wt % to about 35 wt % of a modified polyaryletherketone resin comprising a repeat unit represented by chemical formula 1; about 5 wt % to about 35 wt % of a polyether ether ketone resin; about 20 wt % to about 40 wt % of a polyphenylsulfone resin; and about 15 wt % to about 50 wt % of glass fibers. The thermoplastic resin composition has good properties in terms of adhesion to metals, impact resistance, and so on.

A thermoplastic resin composition of the present invention comprises: about 5 wt % to about 35 wt % of a modified polyaryletherketone resin comprising a repeat unit represented by chemical formula 1; about 5 wt % to about 35 wt % of a polyether ether ketone resin; about 20 wt % to about 40 wt % of a polyphenylsulfone resin; and about 15 wt % to about 50 wt % of glass fibers. The thermoplastic resin composition has good properties in terms of adhesion to metals, impact resistance, and so on.