The present disclosure relates to an additive manufacturing (AM) method for making a three-dimensional (3D) object, comprising a) depositing successive layers of a powdered material (M), at least partially recycled, comprising at least one poly(ether ketone ketone) (PEKK), having a phosphorus content of more than 30 ppm, as measured by Inductively Coupled Plasma Optical Emission Spectrometry (ICP-OES), and b) selectively sintering each layer prior to deposition of the subsequent layer.

The present invention is a low dielectric silica powder, which has an average particle size of 0.1 to 30 μm and a dielectric loss tangent of 0.0005 or less at 10 GHz. An object is to provide: a silica powder with an extremely small dielectric loss tangent; a resin composition containing the same; and a method for manufacturing a silica powder with a low dielectric loss tangent and strong adhesion at the interface to resin.

The present invention is a low dielectric silica powder, which has an average particle size of 0.1 to 30 μm and a dielectric loss tangent of 0.0005 or less at 10 GHz. An object is to provide: a silica powder with an extremely small dielectric loss tangent; a resin composition containing the same; and a method for manufacturing a silica powder with a low dielectric loss tangent and strong adhesion at the interface to resin.

A transparent adhesive composition including an epoxy resin (A), an epoxy resin-curing agent (B), and a phenoxy resin (C), wherein the epoxy resin-curing agent (B) satisfies the following (1) and (2): (1) the epoxy resin-curing agent (B) is in a powdery form and has a particle diameter (d90) at 90% cumulative distribution frequency of 2.0 μm or less; and (2) the epoxy resin-curing agent (B) has solubility in 100 g of methyl ethyl ketone at 25° C. of 0.1 g or less; a film-shaped transparent adhesive processed therefrom; a method of producing a transparent adhesive cured layer-attached member by using the film-shaped transparent adhesive; a method of producing an electronic component; and an electronic component.

A transparent adhesive composition including an epoxy resin (A), an epoxy resin-curing agent (B), and a phenoxy resin (C), wherein the epoxy resin-curing agent (B) satisfies the following (1) and (2): (1) the epoxy resin-curing agent (B) is in a powdery form and has a particle diameter (d90) at 90% cumulative distribution frequency of 2.0 μm or less; and (2) the epoxy resin-curing agent (B) has solubility in 100 g of methyl ethyl ketone at 25° C. of 0.1 g or less; a film-shaped transparent adhesive processed therefrom; a method of producing a transparent adhesive cured layer-attached member by using the film-shaped transparent adhesive; a method of producing an electronic component; and an electronic component.

Provided is a bone fixation material that does not deteriorate in properties even by an electron beam sterilization treatment performed before or during use as a bone fixation material, has fatigue resistance, wear resistance, and dimensional stability at excellent levels, also has biocompatibility, and offers excellent osteoconnectivity. The bone fixation material according to the present invention includes a nonwoven fabric made of PEEK fibers. The bone fixation material according to the present invention preferably has an average pore size of 3 to 280 μm and preferably has a porosity of 15% to 70%. The PEEK fibers preferably have an average fiber diameter of 10 μm or less.

Provided is a bone fixation material that does not deteriorate in properties even by an electron beam sterilization treatment performed before or during use as a bone fixation material, has fatigue resistance, wear resistance, and dimensional stability at excellent levels, also has biocompatibility, and offers excellent osteoconnectivity. The bone fixation material according to the present invention includes a nonwoven fabric made of PEEK fibers. The bone fixation material according to the present invention preferably has an average pore size of 3 to 280 μm and preferably has a porosity of 15% to 70%. The PEEK fibers preferably have an average fiber diameter of 10 μm or less.

A thermoplastic polyester resin composition includes a thermoplastic polyester resin (A), an epoxy compound (B) having an epoxy equivalent of from 200 to 3,000 g/eq, and a hydroxy group-containing resin (C) having a number average molecular weight of from 2,000 to 500,000 and a halogen element content of 1,000 ppm or less, wherein the epoxy compound (B) is blended in an amount of from 0.05 to 10 parts by weight with respect to 100 parts by weight in total of 70 to 99.9 parts by weight of the thermoplastic polyester resin (A) and 0.1 to 30 parts by weight of the hydroxy group-containing resin (C). The thermoplastic resin composition and a molded article achieve both long-term hydrolysis resistance and heat aging resistance at a high level, and can further suppress bleed-out to the surface of the molded article during heat-dry and heat-moisture treatments.

A thermoplastic polyester resin composition includes a thermoplastic polyester resin (A), an epoxy compound (B) having an epoxy equivalent of from 200 to 3,000 g/eq, and a hydroxy group-containing resin (C) having a number average molecular weight of from 2,000 to 500,000 and a halogen element content of 1,000 ppm or less, wherein the epoxy compound (B) is blended in an amount of from 0.05 to 10 parts by weight with respect to 100 parts by weight in total of 70 to 99.9 parts by weight of the thermoplastic polyester resin (A) and 0.1 to 30 parts by weight of the hydroxy group-containing resin (C). The thermoplastic resin composition and a molded article achieve both long-term hydrolysis resistance and heat aging resistance at a high level, and can further suppress bleed-out to the surface of the molded article during heat-dry and heat-moisture treatments.

The present invention relates to a composition for bonded magnets having good hot water resistance and a method of manufacturing the composition. The method of manufacturing a composition for bonded magnets includes: obtaining a first kneaded mixture by kneading a rare earth-iron-nitrogen-based magnetic powder and an acid-modified polypropylene resin; and obtaining a second kneaded mixture by kneading the first kneaded mixture with a polypropylene resin and an amorphous resin having a glass transition temperature of 120° C. or higher and 250° C. or lower, wherein, with respect to 100 parts by weight of the rare earth-iron-nitrogen-based magnetic powder, the amount of the acid-modified polypropylene resin is 3.5 parts by weight or greater and less than 10.4 parts by weight, and the total amount of the polypropylene resin and the amorphous resin is 0.35 part by weight or greater and less than 3.88 parts by weight.