Described herein are polyamide foam particles including a polymer mixture including: (A) from 25 to 95 wt.-% of at least one polyamide, which is different from a copolyamide (B); and (B) from 5 to 75 wt.-% of at least one copolyamide prepared by polymerizing the following components: (B1) from 15 to 84 wt.-% of at least one lactam; and (B2) from 16 to 85 wt.-% of monomer mixture (M) including; (M1) at least one C.sub.32-C.sub.40 dimer acid; and (M2) at least one C.sub.4-C.sub.12 diamine; where the sum of the components (B1) and (B2) are 100 wt.-%. Also described herein is a process for preparing such polyamide foam particles and polyamide particle foam moldings obtainable by steam-chest molding.

Described herein are polyamide foam particles including a polymer mixture including: (A) from 25 to 95 wt.-% of at least one polyamide, which is different from a copolyamide (B); and (B) from 5 to 75 wt.-% of at least one copolyamide prepared by polymerizing the following components: (B1) from 15 to 84 wt.-% of at least one lactam; and (B2) from 16 to 85 wt.-% of monomer mixture (M) including; (M1) at least one C.sub.32-C.sub.40 dimer acid; and (M2) at least one C.sub.4-C.sub.12 diamine; where the sum of the components (B1) and (B2) are 100 wt.-%. Also described herein is a process for preparing such polyamide foam particles and polyamide particle foam moldings obtainable by steam-chest molding.

Described herein are polyamide foam particles including a polymer mixture including: (A) from 25 to 95 wt.-% of at least one polyamide, which is different from a copolyamide (B); and (B) from 5 to 75 wt.-% of at least one copolyamide prepared by polymerizing the following components: (B1) from 15 to 84 wt.-% of at least one lactam; and (B2) from 16 to 85 wt.-% of monomer mixture (M) including; (M1) at least one C.sub.32-C.sub.40 dimer acid; and (M2) at least one C.sub.4-C.sub.12 diamine; where the sum of the components (B1) and (B2) are 100 wt.-%. Also described herein is a process for preparing such polyamide foam particles and polyamide particle foam moldings obtainable by steam-chest molding.

The instant invention provides a curable formulation suitable for laminating adhesive applications, and laminating adhesives made therefrom. The curable formulation suitable for laminating adhesive applications according to the present invention comprises a) a blend comprising i) an epoxy terminated polyester and at least one of ii) a maleate (poly) ester or iii) a diacrylate terminated oligomer or polymer and b) an aliphatic amine curing agent.

The instant invention provides a curable formulation suitable for laminating adhesive applications, and laminating adhesives made therefrom. The curable formulation suitable for laminating adhesive applications according to the present invention comprises a) a blend comprising i) an epoxy terminated polyester and at least one of ii) a maleate (poly) ester or iii) a diacrylate terminated oligomer or polymer and b) an aliphatic amine curing agent.

Disclosed herein is a thermoplastic molding composition, including a) 39.9 to 99.9 wt % of at least one thermoplastic polyamide as component A, b) 0.1 to 10 wt % of at least one plasticizer of the general formula (1)

R.sub.1—O—(CH.sub.2CH.sub.2—O—).sub.nR.sub.2  (1) with n=1 to 10 R.sub.1, R.sub.2 independently H, C.sub.1-12-alkyl, phenyl or tolyl, having a boiling point of more than 250° C., as component B, c) 0 to 45 wt % of at least one elastomeric polymer as component C, d) 0 to 60 wt % of at least one fibrous and/or particulate filler as component D, and e) 0 to 25 wt % of further additives as component E,
where the total of wt % of components A to E is 100 wt %.

Disclosed herein is a thermoplastic molding composition, including a) 39.9 to 99.9 wt % of at least one thermoplastic polyamide as component A, b) 0.1 to 10 wt % of at least one plasticizer of the general formula (1)

R.sub.1—O—(CH.sub.2CH.sub.2—O—).sub.nR.sub.2  (1) with n=1 to 10 R.sub.1, R.sub.2 independently H, C.sub.1-12-alkyl, phenyl or tolyl, having a boiling point of more than 250° C., as component B, c) 0 to 45 wt % of at least one elastomeric polymer as component C, d) 0 to 60 wt % of at least one fibrous and/or particulate filler as component D, and e) 0 to 25 wt % of further additives as component E,
where the total of wt % of components A to E is 100 wt %.

The invention relates to an encapsulation composition for the storage or the confinement of waste which is toxic to health and/or the environment, comprising a resin composition containing at least one epoxy resin, and a hardening composition containing at least one polyamidoamine and at least one aromatic polyamine, said encapsulation composition having an aromaticity rate which is equal to, or higher than, 35%. The invention also relates to the use of said composition for encapsulating said waste.

The invention relates to an encapsulation composition for the storage or the confinement of waste which is toxic to health and/or the environment, comprising a resin composition containing at least one epoxy resin, and a hardening composition containing at least one polyamidoamine and at least one aromatic polyamine, said encapsulation composition having an aromaticity rate which is equal to, or higher than, 35%. The invention also relates to the use of said composition for encapsulating said waste.

The invention relates to an encapsulation composition for the storage or the confinement of waste which is toxic to health and/or the environment, comprising a resin composition containing at least one epoxy resin, and a hardening composition containing at least one polyamidoamine and at least one aromatic polyamine, said encapsulation composition having an aromaticity rate which is equal to, or higher than, 35%. The invention also relates to the use of said composition for encapsulating said waste.