Self-limiting electrospray compositions including a non-charge-dissipative component and/or a charge-dissipative component. Self-limiting electrospray composition including a plurality of charge-dissipative components and excluding a non-charge-dissipative component. Methods for forming layers of self-limiting thickness. Methods for determining a conductivity of a material. Methods for repairing a flaw in a layer on a surface of an object.

Self-limiting electrospray compositions including a non-charge-dissipative component and/or a charge-dissipative component. Self-limiting electrospray composition including a plurality of charge-dissipative components and excluding a non-charge-dissipative component. Methods for forming layers of self-limiting thickness. Methods for determining a conductivity of a material. Methods for repairing a flaw in a layer on a surface of an object.

Described herein is a method of using copolyamides c) produced by polymerization of components A′) 15% to 84% by weight of at least one lactam, and B′) 16% to 85% by weight of a monomer mixture (M) including components B1′) at least one C.sub.32-C.sub.40-dimer acid and B2′) at least one C.sub.4-C.sub.12-diamine, where the percentages by weight of the components A′) and B′) are in each case based on the sum of the percentages by weight of the components A′) and B′), the method including using the copolyamides c) to increase an impact strength and/or breaking elongation of molded articles made of molding materials including thermoplastic polyamides, which are different from copolyamides c).

Described herein is a method of using copolyamides c) produced by polymerization of components A′) 15% to 84% by weight of at least one lactam, and B′) 16% to 85% by weight of a monomer mixture (M) including components B1′) at least one C.sub.32-C.sub.40-dimer acid and B2′) at least one C.sub.4-C.sub.12-diamine, where the percentages by weight of the components A′) and B′) are in each case based on the sum of the percentages by weight of the components A′) and B′), the method including using the copolyamides c) to increase an impact strength and/or breaking elongation of molded articles made of molding materials including thermoplastic polyamides, which are different from copolyamides c).

Described herein is a method of using copolyamides c) produced by polymerization of components A′) 15% to 84% by weight of at least one lactam, and B′) 16% to 85% by weight of a monomer mixture (M) including components B1′) at least one C.sub.32-C.sub.40-dimer acid and B2′) at least one C.sub.4-C.sub.12-diamine, where the percentages by weight of the components A′) and B′) are in each case based on the sum of the percentages by weight of the components A′) and B′), the method including using the copolyamides c) to increase an impact strength and/or breaking elongation of molded articles made of molding materials including thermoplastic polyamides, which are different from copolyamides c).

The present document describes a polyamide hot-melt resin having a chemical structure consisting of dimerized fatty acids and diamines, loaded with an active ingredient. The dimerized fatty acids may have 12 to 24 carbons and the diamines may have 2 to 14 carbons. The amine residual functional groups and acid residual functional groups within the polyamide hot-melt resin may have a [NH.sub.2]/[COOH] molar ratio below 5, and the active ingredient may be incorporated in quantities of between about 0.01 and about 55% by weight of weight of the resin. The present document also describes items molded from the polyamide hot-melt resins, and processes of preparing the polyamide hot-melt resins.

The present document describes a polyamide hot-melt resin having a chemical structure consisting of dimerized fatty acids and diamines, loaded with an active ingredient. The dimerized fatty acids may have 12 to 24 carbons and the diamines may have 2 to 14 carbons. The amine residual functional groups and acid residual functional groups within the polyamide hot-melt resin may have a [NH.sub.2]/[COOH] molar ratio below 5, and the active ingredient may be incorporated in quantities of between about 0.01 and about 55% by weight of weight of the resin. The present document also describes items molded from the polyamide hot-melt resins, and processes of preparing the polyamide hot-melt resins.

The present document describes a polyamide hot-melt resin having a chemical structure consisting of dimerized fatty acids and diamines, loaded with an active ingredient. The dimerized fatty acids may have 12 to 24 carbons and the diamines may have 2 to 14 carbons. The amine residual functional groups and acid residual functional groups within the polyamide hot-melt resin may have a [NH.sub.2]/[COOH] molar ratio below 5, and the active ingredient may be incorporated in quantities of between about 0.01 and about 55% by weight of weight of the resin. The present document also describes items molded from the polyamide hot-melt resins, and processes of preparing the polyamide hot-melt resins.

The present disclosure provides a polyamide composition and method of making a polyamide composition. The polyamide composition includes branched chains to provide for greater fiber tenacity and residues of a salt of 5-sulfoisophthalic or 5-sulfoisophthalic acid to provide excellent stain resistance.

The present invention relates to the use of a polyamide molding compound for application purposes in which a high resistance to hypochlorous acid is decisive. The molding compound is thus used in accordance with the invention for molds that are suitable for contact with aqueous solutions containing hypochlorous acid.