The present invention relates to a process for preparing a resin composition comprising benzoxazine, a prepreg and a laminate prepared therefrom. Said resin composition comprising benzoxazine is prepared by adding an acidic filler into the resin composition comprising benzoxazine, wherein said resin composition comprising benzoxazine comprises a benzoxazine resin, an epoxy resin A1 having an epoxy equivalent of 150-450, and an epoxy resin A2 having an epoxy equivalent of 451-1000. By adding an acidic filler into the resin composition, the present invention greatly promotes the polymerization of benzoxazine and epoxy resins, and decreases the curing temperature needed for the polymerization of benzoxazine and epoxy resins. The laminates prepared from the resin composition added with an acidic filler have a high anti-stripping stability, a high glass transition temperature, a low water absorption, a high heat resistance, a high bending strength and a better processability, and can achieve a low coefficient of thermal expansion.

The present invention relates to a process for preparing a resin composition comprising benzoxazine, a prepreg and a laminate prepared therefrom. Said resin composition comprising benzoxazine is prepared by adding an acidic filler into the resin composition comprising benzoxazine, wherein said resin composition comprising benzoxazine comprises a benzoxazine resin, an epoxy resin A1 having an epoxy equivalent of 150-450, and an epoxy resin A2 having an epoxy equivalent of 451-1000. By adding an acidic filler into the resin composition, the present invention greatly promotes the polymerization of benzoxazine and epoxy resins, and decreases the curing temperature needed for the polymerization of benzoxazine and epoxy resins. The laminates prepared from the resin composition added with an acidic filler have a high anti-stripping stability, a high glass transition temperature, a low water absorption, a high heat resistance, a high bending strength and a better processability, and can achieve a low coefficient of thermal expansion.

A polymerizable thermoset composition including a polymerizable organic cyanate ester resin and a polymerizable aryl ethynyl-terminated polyimide, a polymerized thermoset, a process for the production of the polymerized thermoset as well as the use of the polymerizable thermoset composition for the production of lightweight construction components, preferably carbon fiber composite materials (CFC), and a lightweight construction component, preferably carbon fiber composite material (CFC), containing the polymerized thermoset are described.

A polymerizable thermoset composition including a polymerizable organic cyanate ester resin and a polymerizable aryl ethynyl-terminated polyimide, a polymerized thermoset, a process for the production of the polymerized thermoset as well as the use of the polymerizable thermoset composition for the production of lightweight construction components, preferably carbon fiber composite materials (CFC), and a lightweight construction component, preferably carbon fiber composite material (CFC), containing the polymerized thermoset are described.

A polymerizable thermoset composition including a polymerizable organic cyanate ester resin and a polymerizable aryl ethynyl-terminated polyimide, a polymerized thermoset, a process for the production of the polymerized thermoset as well as the use of the polymerizable thermoset composition for the production of lightweight construction components, preferably carbon fiber composite materials (CFC), and a lightweight construction component, preferably carbon fiber composite material (CFC), containing the polymerized thermoset are described.

In accordance with the present invention, there are provided methods to improve the performance properties of thermoset polymer resins prepared by the activation of one or more reactive monomer(s) which is(are) initiated by way of a first reaction mechanism at a defined temperature (typically a temperature in the range of 40-200 C.). Exemplary performance properties which are improved by the invention methods include enhanced thermal stability, tensile strength (which is maintained in spite of exposure to elevated temperatures over extended periods of time), adhesive properties (which are substantially maintained in spite of exposure to elevated temperatures over extended periods of time), weight loss (which is minimized in spite of exposure to elevated temperatures over extended periods of time), dielectric strength (which is substantially maintained in spite of exposure to elevated temperatures over extended periods of time), and the like.

The technology discloses a halogen-free resin composition and a prepreg and a laminate used for a printed circuit. The resin composition comprises: alkyl phenol epoxy resin; benzoxazine resin, alkyl phenol novolac curing agent, and phosphorus-containing flame retardant. The alkyl phenol epoxy resin has many alkyl branched chains in its molecular structure, making the composition have excellent dielectric properties, a higher glass transition temperature, low water absorption, and good heat resistance. Mixing benzoxazine resin into the composition can further reduce dielectric constant, dielectric loss value and water absorption of the cured product. With an alkyl phenol novolac curing agent, the molecular structure will have many alkyls, excellent dielectric properties and low water absorption. A prepreg and a laminate used for printed circuit prepared using the resin composition have low dielectric constants, dielectric loss factors, and water absorption, high dimensional stability, high thermal resistance and good flame retardancy, processability and chemical resistance.

The technology discloses a halogen-free resin composition and a prepreg and a laminate used for a printed circuit. The resin composition comprises: alkyl phenol epoxy resin; benzoxazine resin, alkyl phenol novolac curing agent, and phosphorus-containing flame retardant. The alkyl phenol epoxy resin has many alkyl branched chains in its molecular structure, making the composition have excellent dielectric properties, a higher glass transition temperature, low water absorption, and good heat resistance. Mixing benzoxazine resin into the composition can further reduce dielectric constant, dielectric loss value and water absorption of the cured product. With an alkyl phenol novolac curing agent, the molecular structure will have many alkyls, excellent dielectric properties and low water absorption. A prepreg and a laminate used for printed circuit prepared using the resin composition have low dielectric constants, dielectric loss factors, and water absorption, high dimensional stability, high thermal resistance and good flame retardancy, processability and chemical resistance.

The present invention relates to composites comprising rigid-rod polymers and graphene nanoparticles, processes for the preparation thereof, nanocomposite films and fibers comprising such composites and articles containing such nanocomposite films and fibers.

The present invention relates to composites comprising rigid-rod polymers and graphene nanoparticles, processes for the preparation thereof, nanocomposite films and fibers comprising such composites and articles containing such nanocomposite films and fibers.