A thermosetting resin composition and a prepreg are provided. The thermosetting resin composition includes a maleimide resin, a cyanate ester resin, and a crosslinking agent. The crosslinking agent is a silane-modified diallyl bisphenol compound whose structure is represented by Formula (1):

##STR00001##

In Formula (1), X is a linear or branched C1 to C6 alkyl, cycloalkyl, or sulfonyl group, R1 is a linear or branched C1 to C6 alkyl or aryl group, R2 is a C1 to C6 alkyl group, R3 is a functional group with a crosslinkable double bond, and n+m is a positive integer from 1 to 8.

A thermosetting resin composition and a prepreg are provided. The thermosetting resin composition includes a maleimide resin, a cyanate ester resin, and a crosslinking agent. The crosslinking agent is a silane-modified diallyl bisphenol compound whose structure is represented by Formula (1):

##STR00001##

In Formula (1), X is a linear or branched C1 to C6 alkyl, cycloalkyl, or sulfonyl group, R1 is a linear or branched C1 to C6 alkyl or aryl group, R2 is a C1 to C6 alkyl group, R3 is a functional group with a crosslinkable double bond, and n+m is a positive integer from 1 to 8.

There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.

There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.

There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.

Embodiments in accordance with the present invention encompass polyamic acid or polyimide polymers containing a reactive maleimide end group as well as photosensitive compositions made therefrom which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom exhibit improved thermo-mechanical properties, among other property enhancements.

Embodiments in accordance with the present invention encompass polyamic acid or polyimide polymers containing a reactive maleimide end group as well as photosensitive compositions made therefrom which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom exhibit improved thermo-mechanical properties, among other property enhancements.

A poly(amide-imide) copolymer that is a reaction product of a diamine represented by Chemical Formula 1, a tetracarboxylic acid dianhydride including a compound represented by Chemical Formula 2, and a compound represented by Chemical Formula 3: ##STR00001## wherein, in Chemical Formulae 1 to 4, R.sup.1 to R.sup.4, A, and X are the same as defined in the specification.

A poly(amide-imide) copolymer that is a reaction product of a diamine represented by Chemical Formula 1, a tetracarboxylic acid dianhydride including a compound represented by Chemical Formula 2, and a compound represented by Chemical Formula 3: ##STR00001## wherein, in Chemical Formulae 1 to 4, R.sup.1 to R.sup.4, A, and X are the same as defined in the specification.

An ion-conducting material, a core-shell structure containing the ion-conducting material, an electrode prepared with the core-shell structure and a metal-ion battery employing the electrode are provided. The core-shell structure includes a core particle and an organic-inorganic composite layer formed on the surface of the core particle for encapsulating the core particle. The core particle includes lithium cobalt oxide, lithium nickel cobalt oxide, lithium nickel cobalt manganese oxide, or lithium nickel cobalt aluminum oxide. Also, the organic-inorganic composite layer includes nitrogen-containing hyperbranched polymer and an ion-conducting material. The ion-conducting material is a lithium-containing linear polymer or a modified Prussian blue, wherein the modified Prussian blue has an ion-conducting group and the lithium-containing linear polymer has an ion-conducting segment.