An embodiment can provide a polyamide-imide film, which has particular punching properties, is colorless and transparent and has excellent mechanical properties and optical properties, and a method for preparing same. The polyamide-imide film comprises a polyamide-imide polymer, which is formed by means of polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, and satisfies the condition of general formula (1) below. General formula (1) 4≤X/Y≤12 X: the maximum hole diameter (mm) comprising cracks when the film is punched at 10 mm/min using a 2.5 mm spherical tip by means of a UTM compression mode Y: the modulus (GPa) of the film.

An embodiment can provide a polyamide-imide film, which has particular punching properties, is colorless and transparent and has excellent mechanical properties and optical properties, and a method for preparing same. The polyamide-imide film comprises a polyamide-imide polymer, which is formed by means of polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, and satisfies the condition of general formula (1) below. General formula (1) 4≤X/Y≤12 X: the maximum hole diameter (mm) comprising cracks when the film is punched at 10 mm/min using a 2.5 mm spherical tip by means of a UTM compression mode Y: the modulus (GPa) of the film.

Provided is a cleaning agent composition that is capable of efficiently performing the substitution of a molding raw material in a hot runner type mold. The cleaning agent composition contains 100 parts by weight of a thermoplastic resin; 1 part by weight to 20 parts by weight of at least one type of fatty acid ester that is selected from glycerin fatty acid ester, polyglycerin fatty acid ester, or sorbitan fatty acid ester; and 1 part by weight to 15 parts by weight of a metal salt of a fatty acid and/or a hydroxyfatty acid. The cleaning agent composition is used for cleaning a flow channel for resin in a hot runner type mold.

Provided is a cleaning agent composition that is capable of efficiently performing the substitution of a molding raw material in a hot runner type mold. The cleaning agent composition contains 100 parts by weight of a thermoplastic resin; 1 part by weight to 20 parts by weight of at least one type of fatty acid ester that is selected from glycerin fatty acid ester, polyglycerin fatty acid ester, or sorbitan fatty acid ester; and 1 part by weight to 15 parts by weight of a metal salt of a fatty acid and/or a hydroxyfatty acid. The cleaning agent composition is used for cleaning a flow channel for resin in a hot runner type mold.

The purpose of the present invention is to provide a, polyimide film having high transparency and improved bending resistance against multiple times of bending, and a varnish capable of providing such a polyimide film. The varnish according to the present invention contains a polymer (α) and a solvent (β). The polymer (α) is polyimide or a polyimide precursor. The varnish further contains a typical metal element having an atomic weight of 26-201 except alkali metals and alkaline earth metals, or at least one metal element among transition metal elements having an atomic weight of 26-201 or less. At least one of the metal elements contained in the varnish is present in an amount of 0.05-500 ppm relative to the polymer (α).

A resin composition for a printed wiring board, including: a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F), wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.

A resin composition for a printed wiring board, including: a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F), wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.

The present disclosure provides a polymer, including a first repeating unit represented by formula (I), a second repeating unit represented by formula (II), and a third repeating unit represented by formula (III). The first repeating unit, the second repeating unit, and the third repeating unit are arranged in an alternating fashion, in a random fashion, or in discrete blocks. The molar ratio of the first repeating unit, the second repeating unit and the third repeating unit is m:n:o, and m:(n+o) is from 60:40 to 85:15. The definitions of a, R.sup.1, R.sup.2, A.sup.−, and R.sup.+ are as defined in the specification.

The present disclosure provides a polymer, including a first repeating unit represented by formula (I), a second repeating unit represented by formula (II), and a third repeating unit represented by formula (III). The first repeating unit, the second repeating unit, and the third repeating unit are arranged in an alternating fashion, in a random fashion, or in discrete blocks. The molar ratio of the first repeating unit, the second repeating unit and the third repeating unit is m:n:o, and m:(n+o) is from 60:40 to 85:15. The definitions of a, R.sup.1, R.sup.2, A.sup.−, and R.sup.+ are as defined in the specification.

The resin composition according to one aspect is a resin composition containing a polyamic acid and a solvent, wherein the polyamic acid has a repeating unit represented by the following general formula (1) in a molecular chain, and the molecular chain has a structure represented by the following general formula (2) at one end or both ends. The proportion of the structure represented by the following general formula (2) relative to 1 mol of the repeating unit represented by the following general formula (1) is 0.001 mol or more and 0.1 mol or less. In the following general formulas, R.sup.1 is a tetravalent organic group; R.sup.2 is a divalent organic group; and R.sup.3 is an organic group having 15 or less carbon atoms.

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