The present invention relates to a solder resist composition, and more specifically, to: a solder resist composition that can be used to obtain high reflectance, excellent yellowing resistance, excellent crack resistance, high resolution and flatness, excellent sensitivity, developability, adhesion, solder heat resistance, pencil hardness, solvent resistance, HAST resistance, and high reflectance and high gloss after a HAST test; a dry film and a printed wiring board which include a solder resist layer obtained therefrom; and methods for manufacturing same. The solder resist composition according to the present invention can provide a dry film and a printed wiring substrate which have a solder resist layer, wherein the solder resist layer has excellent sensitivity, developability, adhesion, solder heat resistance, and solvent resistance, has high reflectance, experiences only a small decrease in reflectance even after high-temperature reflow and UV post-curing, experiences only a small decrease in reflectance even after being irradiated with blue light for 3000 hours, has excellent yellowing resistance and crack resistance, has excellent flatness and gloss, and has high resolution.

The present invention relates to a curable composition and an adhesive film including the same, and provides a curable composition and an adhesive film which may prevent damage to an element from moisture contained in the composition, ionic substances, and other foreign substances, and effectively block electrochemical corrosion, thereby improving a lifespan and durability of an organic electronic device.

The present invention relates to a curable composition and an adhesive film including the same, and provides a curable composition and an adhesive film which may prevent damage to an element from moisture contained in the composition, ionic substances, and other foreign substances, and effectively block electrochemical corrosion, thereby improving a lifespan and durability of an organic electronic device.

The present invention relates to a curable composition and an adhesive film including the same, and provides a curable composition and an adhesive film which may prevent damage to an element from moisture contained in the composition, ionic substances, and other foreign substances, and effectively block electrochemical corrosion, thereby improving a lifespan and durability of an organic electronic device.

A polymeric material has a repeat unit of formula O-Ph-O-Ph-CO-Ph-I and a repeat unit of formula O-Ph-Ph-O-Ph-CO-Ph-II wherein Ph represents a phenylene moiety; wherein the repeat units I and II are in the relative molar properties I:II of from 65:35 to 95:5; wherein log.sub.10 (X %)>1.50-0.26 MV; wherein X % refers to the % crystallinity and MV refers to the melt viscosity. A process for making the polymeric material is also disclosed.

A polymeric material has a repeat unit of formula O-Ph-O-Ph-CO-Ph-I and a repeat unit of formula O-Ph-Ph-O-Ph-CO-Ph-II wherein Ph represents a phenylene moiety; wherein the repeat units I and II are in the relative molar properties I:II of from 65:35 to 95:5; wherein log.sub.10 (X %)>1.50-0.26 MV; wherein X % refers to the % crystallinity and MV refers to the melt viscosity. A process for making the polymeric material is also disclosed.

This invention proposes a conductive material having a high conductivity, a high density conductivity, a pressure sensitive adhesiveness, a durability and a high speed responsibility. A conductive material comprising a polymer electrolyte composition (X.sup.1) obtained by graft polymerizing or living polymerizing 2 to 90 mole % of a molten salt monomer having a polymerizable functional group and having an onium cation and anion containing a fluorine with at least one kind selected from the group consisting of a fluorine containing polymer, vinyl acetal polymer, rubber having a polar group and cellulose having a hydroxyl and/or carboxyl group and a polymer or copolymer (X.sup.2) of a molten salt monomer having a polymerizable functional group and having an onium cation and anion containing a fluorine, wherein the amount of X.sup.1 is 5 to 90 wt. % based on the total amount of X.sup.1 and X.sup.2.

A resin composition includes a resin A, a resin C, and a solvent. The resin A includes a sulfonic-acid-group-containing structural unit in an amount exceeding 5 mol % with respect to total structural units included in the resin A. The resin A has a content of a fluorine atom of 30 mass % or less with respect to a total mass of the resin A. The resin C includes a fluorine atom in a larger content per unit mass than the content of a fluorine atom per unit mass in the resin A. A content of the resin A in the resin composition is lower than a content of the resin C in the resin composition in terms of mass.

A resin composition includes a resin A, a resin C, and a solvent. The resin A includes a sulfonic-acid-group-containing structural unit in an amount exceeding 5 mol % with respect to total structural units included in the resin A. The resin A has a content of a fluorine atom of 30 mass % or less with respect to a total mass of the resin A. The resin C includes a fluorine atom in a larger content per unit mass than the content of a fluorine atom per unit mass in the resin A. A content of the resin A in the resin composition is lower than a content of the resin C in the resin composition in terms of mass.

A composition includes a first polymer and a solvent. The first polymer includes a first structural unit including a fluorine atom, and a group including a first functional group at an end of a main chain or a side chain of the first polymer. The first functional group is capable of forming a bond with a metal or a metalloid. The first structural unit preferably includes a fluorinated hydrocarbon group. The first structural unit is preferably derived from a (meth)acrylic ester containing a fluorine atom, or a styrene compound containing a fluorine atom. The first structural unit preferably contains 6 or more fluorine atoms.