A core-shell particle includes: a core including an iron oxyhydroxide compound represented by Formula A.sup.3.sub.a3Fe.sub.1a3OOH (in which A.sup.3 represents at least one metal element other than Fe, and a3 satisfies 0<a3<1) or at least one iron oxide compound selected from the group consisting of Fe.sub.2O.sub.3, a compound represented by Formula A.sup.1.sub.a1Fe.sub.2a1O.sub.3 (in which A.sup.1 represents at least one metal element other than Fe, and a1 satisfies 0<a1<2), Fe.sub.3O.sub.4, and a compound represented by Formula A.sup.2.sub.a2Fe.sub.3a2O.sub.4 (in which A.sup.2 represents at least one metal element other than Fe, and a2 satisfies 0<a2<2); and a shell which covers the core and includes a polycondensate of a metal alkoxide.

A binder resin composition for a preform has a Tg of 50 C. to 100 C., a complex viscoelastic coefficient G* determined by dynamic viscoelasticity measurement of 10 kPa to 500 kPa at Tg+30 C., and G* at Tg+30 C./G* at Tg+80 C. of 10 to 300, wherein the viscosity monotonically decreases as temperature of the binder resin composition for a preform rises to 200 C. The binder resin composition is excellent in storage stability at ordinary temperatures and adhesiveness between preform layers at low temperatures, and is capable of exhibiting stable adhesiveness even when the temperature during preform molding is uneven. A reinforcing fiber base material, a preform, and a fiber reinforced composite material include the binder resin composition.

A binder resin composition for a preform has a Tg of 50 C. to 100 C., a complex viscoelastic coefficient G* determined by dynamic viscoelasticity measurement of 10 kPa to 500 kPa at Tg+30 C., and G* at Tg+30 C./G* at Tg+80 C. of 10 to 300, wherein the viscosity monotonically decreases as temperature of the binder resin composition for a preform rises to 200 C. The binder resin composition is excellent in storage stability at ordinary temperatures and adhesiveness between preform layers at low temperatures, and is capable of exhibiting stable adhesiveness even when the temperature during preform molding is uneven. A reinforcing fiber base material, a preform, and a fiber reinforced composite material include the binder resin composition.

A titanium oxide particle includes a metal compound having a titanium metal atom and a carbon atom, and being bonded to a surface of the particle via an oxygen atom, wherein an element ratio (C/Ti) between carbon and titanium on the surface is in a range of 0.2 to 1.1 and the titanium oxide particle has an absorption at a wavelength of each of 450 nm and 750 nm in a visible absorption spectrum.

There is provided herein a composition comprising (a) a mercapto-functional silicon compound having the general Formula (I): ##STR00001##
and a reactive resin containing at least one epoxy and/or (meth)acrylate group. There is also provided a silylated resin resulting from the reaction product of mercapto-functional silicon compound (a) and reactive resin contain at least one epoxy and/or (meth)acrylate groups.

There is provided herein a composition comprising (a) a mercapto-functional silicon compound having the general Formula (I): ##STR00001##
and a reactive resin containing at least one epoxy and/or (meth)acrylate group. There is also provided a silylated resin resulting from the reaction product of mercapto-functional silicon compound (a) and reactive resin contain at least one epoxy and/or (meth)acrylate groups.

The present disclosure relates to novel multiple trigger negative working photoresist compositions and processes. The processes involve removing acid-labile protecting groups from crosslinking functionalities in a first step and crosslinking the crosslinking functionality with an acid sensitive crosslinker in a second step. The incorporation of a multiple trigger pathway in the resist catalytic chain increases the chemical gradient in areas receiving a low dose of irradiation, effectively acting as a built in dose depend quencher-analog and thus enhancing chemical gradient and thus resolution, resolution blur and exposure latitude. The photoresist compositions and the methods are ideal for fine pattern processing using, for example, ultraviolet radiation, beyond extreme ultraviolet radiation, extreme ultraviolet radiation, X-rays and charged particle rays.

A conductive liquid composition includes: for a binder resin, 5 to 25 mass % of hydroxyl-containing resin with hydroxyl value 3 to 100 and weight-average molecular weight 4000 to 20000, for a solvent, at least one solvent with a boiling point 170 C., 70 mass % of the total solvent, for a curing agent, 1.5 to 10.0 mass % of polyisocyanate, (D) for a curing accelerator, 0.005 to 0.1 mass % of an organometallic compound, (E) for an adhesion reinforcing agent, 0.2 to 2.5 mass % of coupling agent, (F) for conducting materials: (f1) 2.0 to 10.0 mass % of graphite, (f2) 5.0 to 15.0 mass % of conductive carbon black, and (f3) 20.0 to 50.0 mass % of silica particles with a mean particle size 1.0 to 7.0 m and surface-coated with silver, and (G) a surface resistivity 1 to 1000 /sq. when the thickness of the cured film of the conductive liquid composition is 8 m.

An un-reacted substantially formaldehyde free curable binder solution for binding loose mutter consists essentially of a solution obtainable by dissolving a reducing sugar, an ammonium salt acid precursor, optionally a carboxylic acid or a precursor thereof and optionally ammonia in water.

An un-reacted substantially formaldehyde free curable binder solution for binding loose mutter consists essentially of a solution obtainable by dissolving a reducing sugar, an ammonium salt acid precursor, optionally a carboxylic acid or a precursor thereof and optionally ammonia in water.