C08L2203/204

POLYOLEFIN COMPOSITIONS FOR PHOTOVOLTAIC ENCAPSULANT FILMS

This disclosed is an encapsulant film made from a curable composition comprising: (A) a polyolefin polymer; (B) an organic peroxide; (C) a silane coupling agent; and (D) a co-agent comprising a silane compound of formula (I). This further disclosed is a process for preparing said encapsulant film.

Multilayered polyolefin-based films having a layer comprising a crystalline block copolymer composite or a block copolymer composite resin

Disclosed are multilayer film structures including a layer (B) that includes a crystalline block copolymer composite (CBC) or a specified block copolymer composite (BC), including i) an ethylene polymer (EP) including at least 80 mol % polymerized ethylene; ii) an alpha-olefin-based crystalline polymer (CAOP) and iii) a block copolymer including (a) an ethylene polymer block including at least 80 mol % polymerized ethylene and (b) a crystalline alpha-olefin block (CAOB); and a layer C that includes a polyolefin having at least one melting peak greater than 125 C, the top facial surface of layer C in adhering contact with the bottom facial surface of layer B. Such multilayer film structure preferably includes (A) a seal layer A having a bottom facial surface in adhering contact with the top facial surface of layer B. Such films are suited for use in electronic device (ED) modules including an electronic device such as a PV cell.

Polymer compositions and substrates for high temperature transparent conductive film applications
10767041 · 2020-09-08 · ·

Described are polymer compositions that include a blend of copolyester polymers based on monomers that include on terephthalic acid (TPA), isophthalic acid (IPA) and 1,4-cyclohexanedimethanol (CHDM), wherein the blend includes a first copolyester that is semi-crystalline and a second copolyester that is amorphous; and films made from the polymer compositions useful for transparent high temperature conductive film applications.

Polyimides

This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib), [insert formula here] (la) or [insert formula here] (lb), (b) at least one diamine of Structure (II), (c) at least one tetracarboxylic acid dianhydride, and optionally (d) at least one compound containing a first functional group reactive with an amine or an anhydride and at least a second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formulas is defined in the specification.

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ENCAPSULATING COMPOSITION AND ENCAPSULATING FILM COMPRISING SAME AND ELECTRONIC COMPONENT ASSEMBLY

The present invention discloses an encapsulation composition, an encapsulation film including the encapsulation composition, and an electronic device module. The encapsulation composition includes a polymer matrix, a tackifier and a free radical initiator. Based on 100 parts by weight of the polymer matrix, the polymer matrix includes 5 to 100 parts by weight of highly branched polyethylene (P1), 0 to 95 parts by weight of an ethylene--olefin copolymer, and 0 to 70 parts by weight of an ethylene-polar monomer copolymer. The highly branched polyethylene (P1) is an ethylene homopolymer having a branch structure and has a degree of branching of not less than 40 branches/1,000 carbon atoms. A density of the ethylene--olefin copolymer is not higher than 0.91 g/cm.sup.3. The encapsulation composition provided by the present invention has good volume resistivity, aging resistance, processability and low cost.

FLUOROPOLYMER HYBRID COMPOSITE

The present invention pertains to a fluoropolymer hybrid organic/inorganic composite, to a film comprising said fluoropolymer hybrid organic/inorganic composite and to uses of said film in various applications, especially in electrochemical and in photo-electrochemical applications.

PID-FREE ENCAPSULANT FOR PHOTOVOLTAIC MODULE, PHOTOVOLTAIC MODULE INCLUDING SAME, AND METHOD OF MANUFACTURING SAME

The present invention relates to an encapsulant capable of reducing potential-induced degradation (PID). The encapsulant is used to seal a solar cell to form a photovoltaic module, in which silica gel is dispersed in the encapsulant as a sodium ion adsorbent. Since the silica gel that is highly transparent is used as the sodium ion adsorbent, it is possible to prevent PID attributable to sodium ions and to prevent deterioration in photovoltaic efficiency of the photovoltaic module. Since the silica gel has a high specific surface area, it is possible to adsorb sodium ions with a small amount of the silica gel.

1,2,5,6-Naphthalenediimide co-polymer

A copolymer comprising a repeat unit A, wherein repeat unit A comprises ##STR00001##
and at least one repeat unit B, wherein repeat unit B comprises an aryl group.

Biodegradable flexible lightweight energy storage composite and methods of making the same
10614928 · 2020-04-07 ·

Provided are biodegradable, flexible, lightweight composites with efficient energy storage and methods for producing the same. Said composites comprise a conductive polymer, a secondary dopant, and a structural component.

CONDUCTIVE PASTE COMPOSITION, DEVICE COMPRISING ELECTRODE FORMED FROM SAME, AND METHOD FOR PRODUCING CONDUCTIVE PASTE COMPOSITION

A conductive paste composition includes 1 to 10 parts by weight of a binder (A), 2 to 20 parts by weight of an epoxy monomer (B), 1 to 20 parts by weight of a crosslinking agent (C), and 70 to 95 parts by weight of a conductive filler (D). The binder (A) is a reactive oligomer having a siloxane bond as a main skeleton and including a plurality of oxirane rings as an organic group. The epoxy monomer (B) includes an oxirane ring. The total amount of the binder (A), the epoxy monomer (B), the crosslinking agent (C), and the conductive filler (D) is 100 parts by weight.