A high-temperature-resistant insulating polymer composite is provided, including the following components in parts by mass: 3-12 parts of cyanate ester resin, 3-20 parts of epoxy resin, 5-15 parts of an inorganic filler, 0.1-2 parts of an epoxy resin curing agent, 0.0001-0.005 parts of a curing accelerant, and 0.1-2 parts of a dispersant. A glass transition temperature of the cured high-temperature-resistant insulating polymer composite is higher than 120° C.

A display device includes a substrate, a light-emitting element positioned on the substrate; and an encapsulation layer positioned on the light-emitting element and comprising a first layer, a second layer positioned on the first layer, and a third layer positioned on the second layer, wherein the first layer comprises a first polymer, the second layer comprises a compound represented by Formula 1, and the third layer comprises a second polymer and a hygroscopic getter, wherein, in Formula 1, A is a C.sub.1-C.sub.10 alkyl group or a C.sub.6-C.sub.60 aryl group, n is an integer from 1 to 100, m is an integer from 1 to 6, o is an integer greater than or equal to 1, and R.sup.1 is a hydroxyl group.

The present disclosure relates to a polyester resin composition including a polyester resin including a diol residue and a dicarboxylic acid residue, wherein the diol residue includes a cyclohexanedimethanol residue and the dicarboxylic acid residue includes an isophthalic acid residue and a terephthalic acid residue, wherein an amount of the isophthalic acid residue is 0 to 20 mol % when a total amount of the dicarboxylic acid residue is considered as 100 mol %, wherein an amount of the cyclohexanedimethanol residue is 50 to 100 mol % when a total amount of the diol residue is considered as 100 mol %, wherein the polyester resin composition includes an antioxidant, and wherein the antioxidant includes a phenol-based antioxidant, a phosphorus-based antioxidant, and a sulfur-based antioxidant.

In a first aspect, a single layer polymer film includes 60 to 99 wt % of a crosslinked polyimide, having a gel fraction in the range of from 20 to 100% and a refractive index of 1.74 or less, and 1 to 40 wt % of a colorant. A surface of the single layer polymer film has been textured and has a maximum roughness (S.sub.pv) of 6 μm or more, an L* color of 30 or less and a 60° gloss of 15 or less. In a second aspect, a coverlay for a printed circuit board includes the single layer polymer film of the first aspect. In third and fourth aspects, processes are disclosed for forming a single layer polymer film including a crosslinked polyimide film including a dianhydride and a diamine.

A polyethylene copolymer blend consisting essentially of (A) an ethylene/unsaturated carboxylic ester bipolymer and (B) an ethylene/unsaturated carboxylic ester/carbon monoxide terpolymer. The polyethylene copolymer blend is defined by constituents (A) and (B) and at least one omitted material that would have otherwise restricted a physical property of the blend. The (A) ethylene/unsaturated carboxylic ester bipolymer is defined by features comprising choice of unsaturated carboxylic ester, unsaturated carboxylic ester comonomeric content in weight percent (wt %), and bipolymer melt index (I.sub.2; 190° C., 2.16 kg) in grams per 10 minutes (g/10 min.). The (B) ethylene/unsaturated carboxylic ester/carbon monoxide terpolymer is defined by features comprising choice of unsaturated carboxylic ester, unsaturated carboxylic ester comonomeric content in wt %, carbon monoxide comonomeric content in wt %, and terpolymer melt index (I.sub.2; 190° C., 2.16 kg) in g/10 min. Also formulations, cured polymer products, strippable semiconductive insulation shield layers, coated conductors, methods of making and using same.

An encapsulant of a photovoltaic module, intended for coating a photovoltaic cell, having a composition which does not include any cross-linking agent and including: an ethylene—alkyl acrylate copolymer, the copolymer making up 70% to 96% of the weight of the composition; a silane, making up 0.1% to 2% of the weight of the composition; wherein the composition also includes a terpolymer of ethylene—acrylic ester—maleic anhydride or glycidyl methacrylate, the terpolymer making up 2% to 29.9% of the weight of the composition. Also relates to the use of such an encapsulant in a photovoltaic module as well as to a photovoltaic module including such an encapsulant.

The present invention relates to a foamed pressure-sensitive adhesive compound on the basis of aromatic polyvinyl-polydiene block copolymers, in particular for double-sided self-adhesive strips, containing a) 39.8 wt. % to 51.8 wt. % of an elastomer component, b) 35.0 wt. % to 58.0 wt % of an adhesive resin component, c) 2.0 wt. % to 15.0 wt. % of a plasticizer component, d) 0.0 wt. % to 18.0 wt. % of further additives and e) microballoons, the microballoons being at least partly expanded.

A photocurable composition for a hard coating material according to an aspect of the present invention contains (A) a polyfunctional polymerizable compound having three or more polymerizable double bonds, (B) an acrylic resin having a polymerizable double bond, (C) a polymerizable fluorine compound, and (D) a photopolymerization initiator.

A thermally-conductive structural adhesive for new energy power batteries, including: composition A including 3.3-14 wt. % of a block polymerized telechelic carboxyl compound and/or a block polymerized telechelic amino compound; 0.1-1.0 wt. % of a coupling agent and/or a modifier; 0-1.6 wt. % of curing accelerator; 84-92 wt. % of a thermally-conductive powder; and 0.3-3.0 wt. % of a flame retardant agent; and composition B including 3.3-14 wt. % of a block polymerized telechelic isocyanate compound and/or a block polymerized telechelic epoxy compound; 0-1.0 wt. % of a coupling agent and/or a modifier; 0-1.6 wt. % of a curing accelerator; 84-92 wt. % of a thermally-conductive powder; and 0.3-3 wt. % of a flame retardant agent. The composition A and the composition B are mixed evenly in a weight or volume ratio of 1:(0.25-2) and cured to obtain the thermally-conductive structural adhesive. A preparation of the thermally-conductive structural adhesive is also provided.

Curable organopolysiloxane compositions and their cured products with superior properties are described as well as their uses as materials for optical devices, such as LEDs.