C08L2203/206

DIELECTRICALLY-ENHANCED POLYETHYLENE FORMULATION
20220049073 · 2022-02-17 ·

A dielectrically-enhanced polyethylene formulation made from (A) a polyethylene-nucleation agent, a dielectrically-enhanced (B) a multimodal ultra-high density polyethylene (multimodal uHDPE) composition, and, optionally, (C) a low density polyethylene (LDPE) polymer. A method of making same, an insulated electrical device comprising same, and a method of using same.

CURABLE SILICONE COMPOSITION FOR TRANSFER MOLDING, CURED PRODUCT THEREOF, AND PRODUCTION METHOD THEREOF
20220049100 · 2022-02-17 ·

Provided is a curable silicone composition and applications thereof. The curable silicone composition has low modulus and flexibility even at high temperature of a cured product formed therefrom, and superior stress relaxation properties, so that the cured product does not readily warp or become defective when integrally molded with a base material, and has superior demolding property (e.g. mold release) of the cured product after transfer molding. A curable silicone composition for transfer molding, where (1) the maximum torque measured from a molding temperature of room temperature through 200° C. using a moving die rheometer (MDR) is less than 50 dN-m, and (2) the loss tangent (tans) expressed by the ratio of stored torque value/lost torque value is less than 0.2.

Thermosetting resin composition, method for forming protective film for flexible wiring board, and flexible wiring board

A thermosetting resin composition which contains a polyurethane resin and a curing agent, the polyurethane resin including a constitutional unit derived from an alicyclic diol and having an acid value of 10 to 35 mgKOH/g.

RESIN COMPOSITION
20170275453 · 2017-09-28 · ·

A resin composition is disclosed that includes a thermosetting base resin; a curing agent; an inorganic filler; and at least one fluorine resin powder selected from polyvinylidene fluoride, polychlorotetrafluoroethylene, and a tetrafluoroethylene/perfluoro(alkyl vinyl ether)/chlorotrifluoroethylene copolymer, and a semiconductor device which is fabricated by being sealed using a sealant formed of the resin composition.

Heat-resistant chlorine-containing crosslinked resin formed body and method for producing the same, silane master batch, master batch mixture and formed body thereof, and heat-resistant product

A production method comprising: (a) a step of melt-mixing a base resin containing a chlorinated polyethylene; an organic peroxide, an inorganic filler, and a silane coupling agent, in specific ratios, at a temperature equal to or higher than a decomposition temperature of the organic peroxide, to prepare a silane master batch; (b) a step of mixing the silane master batch obtained in the step (a) with a silanol condensation catalyst, and then forming the resultant mixture; and conducting at least one of the melt-mixing in the step (a) and the mixing in the step (b) is performed in the coexistence of a chloroprene rubber or a polyvinyl chloride; a heat-resistant chlorine-containing crosslinked resin formed body produced by the method, a silane master batch, a mixture and formed body thereof, and a heat-resistant product.

Resin composition, resin sheet, cured resin sheet, resin sheet structure, cured resin sheet structure, method for producing cured resin sheet structure, semiconductor device, and LED device

A resin composition including an epoxy resin monomer, a novolac resin including a compound having a structural unit represented by Formula (I), and a filler; in which the filler has at least 4 peaks in a particle size distribution measured by laser diffractometry, in which four of the peaks are present respectively in ranges of not less than 0.01 μm and less than 1 μm, not less than 1 μm and less than 10 μm, from 10 μm to 50 μm, and from 20 μm to 100 μm, and in which a peak present in a range of from 10 μm to 50 μm includes an aluminum oxide particle, and a peak present in a range of from 20 μm to 100 μm includes a boron nitride particle. In Formula (I) each of R.sup.1, R.sup.2 and R.sup.3 independently represents a hydrogen atom, an alkyl group, or the like. m represents 0 to 2, and n represents 1 to 7. ##STR00001##

POLYPROPYLENE COMPOSITIONS FOR CAPACITOR FILM

The present invention relates to a newpolypropylene composition with improved processability and heat resistance for use in a capacitor film, as well as a cast film and a biaxially oriented film for the use as capacitor film comprising such polypropylene composition.

POLYMER COMPOSITION FOR A LAYER OF A LAYER ELEMENT

The present invention relates to a polymer composition, to a layer element, preferably to at least one layer element of a photovoltaic module, comprising the polymer composition and to an article which is preferably said at least one layer of a layer element, preferably of a layer element of a photovoltaic module.

POLYMER COMPOSITION FOR A LAYER OF A LAYER ELEMENT

The present invention relates to a polymer composition, to a layer element, preferably to at least one layer element of a photovoltaic module, comprising the polymer composition and to an article which is preferably said at least one layer of a layer element, preferably of a layer element of a photovoltaic module.