The present invention relates to a polymer composition, to a layer element, preferably to at least one layer element of a photovoltaic module, comprising the polymer composition and to an article which is preferably said at least one layer of a layer element, preferably of a layer element of a photovoltaic module.

The present invention relates to a polymer composition, to a layer element, preferably to at least one layer element of a photovoltaic module, comprising the polymer composition and to an article which is preferably said at least one layer of a layer element, preferably of a layer element of a photovoltaic module.

A wiring harness has a waterproof structure in which a waterproof agent covers a conductor exposed portion-and outer peripheral surfaces of end portions of wire covering members of a plurality of insulated wires in succession, the portion including a splice portion where portions of the members of the insulated wires are removed and the exposed conductors are spliced together and a bundle of the exposed conductors of the insulated wires, the end portions being adjacent to the portion, whereby the portion is sealed with the waterproof agent, wherein the waterproof agent is a cured product of an ultraviolet curable adhesive agent that contains(A) an ester acrylate having a linear or branched C2-C12 alkyl group, (B) a (meth)acrylate compound comprising at least two urethane bonds in one molecule, and (C) a photopolymerization initiator.

A resin composite includes a maleimide resin powder and a resin having a glass transition point that is lower that the glass transition point of the maleimide resin. The resin having a glass transition point that is lower than that of the maleimide resin may be an epoxy resin. Then, the resin composite may be cured at the curing temperature of the epoxy resin. The maleimide resin powder is mixed in an amount ranging from 50 weight % to 80 weight % with respect to the epoxy resin.

An insulating medium rubber film and a production method thereof, and a multi-layer printed-circuit board. The insulating medium rubber film includes a release film and an insulating medium layer arranged on the surface of the release film, where materials of the insulating medium layer include saturated polyester resin, amino resin or blocked isocyanate, epoxy resin, a curing agent, inorganic filler and a curing accelerator. According to the insulating medium rubber film and the production method thereof and the multi-layer printed-circuit board, by introducing the saturated polyester resin component into an epoxy resin composition, the produced insulating medium rubber film has the advantages that a dielectric constant is low, a dielectric dissipation factor is low, thermal expansion is not liable to happen, and adhesion is good.

The present disclosure relates to a curable composition for an encapsulant film, the curable composition comprising: (A) a polyolefin; (B) a fumed alumina; (C) an organic peroxide; (D) a silane coupling agent; (E) a crosslinking co-agent; and, optionally, (F) an additive component comprising a UV stabilizer, wherein the polyolefin has a volume resistivity of less than 4.0E+15 ohm.Math.cm. The present disclosure further relates to an encapsulant film made from such a curable composition and a PV module containing such an encapsulant film.

The present invention provides a polyimide film in which a parameter A for the relationship of the viscosity (V) of a polyamic acid solution, the number average molecular weight (Mn) of polyamic acid, and the thickness (T) of a polyimide film falls within a range from 0.4 to 1.13.

A method and apparatus are disclosed for an RF guidewire for applying RF energy to create a channel through a region of tissue within a patient's body. The RF guidewire is configured to have a hydrophilic coating disposed thereon to reduce friction to facilitate traversal through vasculature while maintaining its mechanical, electrical and thermal properties.

A resin composition for semiconductor encapsulation, containing (A) an epoxy resin, (B) a phenolic resin-based curing agent, (C) an inorganic filler, and (D) amorphous carbon, wherein the amorphous carbon of the component (D) contains 30 atomic % or more of an SP.sup.3 structure and 55 atomic % or less of an SP.sup.2 structure.

The present invention provides a polymer composition having a low water absorption (i.e. being dampproof), excellent electrical insulation, high adhesion to various substrates, and excellent thermal stability. The present invention relates to a polymer composition comprising (A) a dimer acid-based polyamide and (B) an olefin-based-modified polymer, wherein the olefin-based-modified polymer (B) comprises a chemical structure derived from an olefin and a chemical structure derived from an amide.