Patent classifications
C08L2205/18
HYDROPHILIC SILICONE PARTICLE AND METHOD FOR PRODUCING THE SAME
A hydrophilic silicone particle containing a surfactant fixed by a chemical bond formed by radical polymerization to a surface of a silicone particle having a volume average particle size of 0.1 to 100 μm and a method for producing the hydrophilic silicone particle, the method including fixing a hydrophilic group derived from a component (B) to a surface of a silicone particle by subjecting an emulsion to radical polymerization, the emulsion containing: (A) 100 parts by mass of an organopolysiloxane having a radical polymerization reactive group; (B) 0.5 to 50 parts by mass of a surfactant having a radical polymerization reactive group; (C) 0.1 to 5 parts by mass of a radical generator; and (D) 10 to 1000 parts by mass of water. A silicone particle may be readily dispersed in an aqueous material without the additional use of a dispersant (typically, a surfactant) and has a hydrophilic group.
AQUEOUS EMULSION INCLUDING INTERPENETRATING NETWORK OF SILICONE GUM AND CROSSLINKED ORGANIC POLYMER
An aqueous emulsion comprising particles having an average volume particle size (Dv 50) of 1 to 10 pm wherein the particles comprise an interpenetrating polymer network including from 90 to 99 wt % silicone gum and 1 to 10 wt % of crosslinked organic polymer, methods for making such aqueous emulsions, polyurethane coating compositions including such interpenetrating polymer networks, methods of preparing such polyurethane coating compositions, and their use in treating leather.
TWO-PART SILICONECOMPOSITION AND SEALANT AND ASSEMBLY MADE THEREFROM
The two-part composition includes a first part and a second part. The first part includes a vinyl-substituted polysiloxane, a hydrosilylation catalyst, expandable graphite comprising moisture, and first polymeric microspheres having been at least partially coated with inorganic filler. The second part includes a second vinyl-substituted polysiloxane, a hydrosilyl-substituted polysiloxane, and second polymeric microspheres having been at least partially coated with flame-retardant inorganic filler. The two-part composition is useful, for example, for curing into a sealant and making an assembly. The assembly has a first substrate and a second substrate with a cured product of the two-part composition in contact with the first substrate and the second substrate. Methods of making a sealant and an assembly are also described.
THERMOPLASTIC RESIN COMPOSITION, METHOD OF PREPARING THE SAME, AND MOLDED ARTICLE INCLUDING THE SAME
A thermoplastic resin composition including 100 parts by weight of a base resin including 0.5 to 45% by weight of a graft copolymer (A-1) including acrylate rubber having an average particle diameter of 50 to 150 nm, an aromatic vinyl compound, and a vinyl cyanide compound, 20 to 80% by weight of a graft copolymer (A-2) including acrylate rubber having an average particle diameter of 151 to 600 nm, an aromatic vinyl compound, and a vinyl cyanide compound, and 10 to 45% by weight of an α-methylstyrene-based copolymer (B) having a weight average molecular weight of 60,000 to 180,000 g/mol; and 0.5 to 10 parts by weight of an ultra-high molecular weight copolymer (C) having a weight average molecular weight of 1,000,000 to 12,000,000 g/mol. A method of preparing the thermoplastic resin composition and a molded article including the thermoplastic resin composition are also disclosed.
THERMOPLASTIC RESIN COMPOSITION, METHOD OF PREPARING THE SAME, AND MOLDED ARTICLE MANUFACTURED USING THE SAME
Disclosed are a thermoplastic resin composition, a method of preparing the same, and a molded article manufactured using the same. The thermoplastic resin composition includes 3 to 22% by weight of a graft copolymer (A-1) including an acrylate-based rubber having an average particle diameter of 200 to 400 nm, an aromatic vinyl compound, and a vinyl cyanide compound; 17 to 40% by weight of a graft copolymer (A-2) including an acrylate-based rubber having an average particle diameter of 50 to 199 nm, an aromatic vinyl compound, and a vinyl cyanide compound; 30 to 57% by weight of a copolymer (B) including a (meth)acrylic acid alkyl ester compound, an α-methyl styrene-based compound, and a vinyl cyanide compound; and 6 to 30% by weight of a polymethacrylate resin (C) (except for α-methyl styrene), wherein an average multi-axial impact strength is 22 J/mm or more.
POLYIMIDE PRECURSOR SOLUTION, METHOD FOR PRODUCING POROUS POLYIMIDE FILM, POROUS POLYIMIDE FILM, AND INSULATED WIRE
A polyimide precursor solution includes: a polyimide precursor; polyester resin particles containing a polyester resin and having a volume average particle diameter of from 3 μm to 50 μm inclusive and an average circularity of 0.970 or more; and a solvent.
POLYIMIDE PRECURSOR SOLUTION, POROUS POLYIMIDE MEMBRANE, AND INSULATED ELECTRIC WIRE
A polyimide precursor solution includes an aqueous solvent including water, a polyimide precursor, resin particles, and an ionization agent X having a boiling point of 100° C. or more and 130° C. or less and an ionization agent Y having a boiling point of 250° C. or more and 300° C. or less.
POLYIMIDE PRECURSOR SOLUTION, POROUS POLYIMIDE FILM, AND INSULATED WIRE
A polyimide precursor solution includes: a polyimide precursor that is a polymer of a tetracarboxylic dianhydride and a diamine compound; particles; a solvent; and a compound having at least four carboxy groups per molecule.
Ink jet composition and flameproofing method
An ink jet composition according to the present disclosure contains a flameproofing agent and resin particles. The resin particles are preferably urethanic resin particles. It is preferable that a urethanic resin making up the urethanic resin particles is a urethanic resin containing a crosslinking group and the crosslinking group is one or more selected from the group consisting of a blocked isocyanate group and a silanol group. The urethanic resin making up the urethanic resin particles preferably has a polycarbonate skeleton.
Elastomeric Conductive Composite Interconnect
A moldable interconnect device for providing an electrical connection between two or more opposing arrays of contacts for establishing an electrical circuit. The moldable interconnect device having an insulting substrate and an array of conductive elements held in the insulating substrate, the conductive elements are made of an elastomeric conductive composite. The composite having a polymeric matrix comprising a crosslinked polymer. The polymer having a curing agent for catalyzing crosslinking of the polymer matrix and conductive metal particles and non-conductive compressible rubber particles dispersed with the polymer matrix. The non-conductive compressible rubber particles having a greater compressibility than the elastomeric conductive composite that is the same as the elastomeric conductive composite but free of non-conductive compressible rubber particles.