Patent classifications
C09D11/03
METHOD FOR PRODUCING SEMICONDUCTING SINGLE-WALLED CARBON NANOTUBE DISPERSION
In one aspect, provided is a method for producing a semiconducting single-walled carbon nanotube dispersion. This method allows semiconducting single-walled carbon nanotubes to be separated from a single-walled carbon nanotube mixture containing semiconducting single-walled carbon nanotubes and metallic single-walled carbon nanotubes in an aqueous medium, and yet requires only an easily available separation agent and a simple operation.
One aspect of the present disclosure relates to a method for producing a semiconducting single-walled carbon nanotube dispersion. The method includes (A) preparing a single-walled carbon nanotube dispersion to be separated that contains single-walled carbon nanotubes composed of semiconducting single-walled carbon nanotubes and metallic single-walled carbon nanotubes, an aqueous medium, and a nonionic polymer containing a constitutional unit A derived from a monomer represented by the following formula (1), and (B) centrifuging the single-walled carbon nanotube dispersion to be separated and then collecting a supernatant containing the semiconducting single-walled carbon nanotubes from the centrifuged single-walled carbon nanotube dispersion. A content of the constitutional unit A in all constitutional units of the polymer is 2 mol % or more. The polymer is water soluble.
CH.sub.2═CR.sup.1—COO—(EO).sub.p(PO).sub.q—R.sup.2 (1)
METHOD FOR PRODUCING SEMICONDUCTING SINGLE-WALLED CARBON NANOTUBE DISPERSION
In one aspect, provided is a method for producing a semiconducting single-walled carbon nanotube dispersion. This method allows semiconducting single-walled carbon nanotubes to be separated from a single-walled carbon nanotube mixture containing semiconducting single-walled carbon nanotubes and metallic single-walled carbon nanotubes in an aqueous medium, and yet requires only an easily available separation agent and a simple operation.
One aspect of the present disclosure relates to a method for producing a semiconducting single-walled carbon nanotube dispersion. The method includes (A) preparing a single-walled carbon nanotube dispersion to be separated that contains single-walled carbon nanotubes composed of semiconducting single-walled carbon nanotubes and metallic single-walled carbon nanotubes, an aqueous medium, and a nonionic polymer containing a constitutional unit A derived from a monomer represented by the following formula (1), and (B) centrifuging the single-walled carbon nanotube dispersion to be separated and then collecting a supernatant containing the semiconducting single-walled carbon nanotubes from the centrifuged single-walled carbon nanotube dispersion. A content of the constitutional unit A in all constitutional units of the polymer is 2 mol % or more. The polymer is water soluble.
CH.sub.2═CR.sup.1—COO—(EO).sub.p(PO).sub.q—R.sup.2 (1)
DIGITAL PRINTED FABRIC, MANUFACTURING METHOD FOR DIGITAL PRINTED FABRIC, AND DIGITAL PRINTING INK
A digital printed fabric includes a base cloth and a digital printing ink disposed on the base cloth, and a manufacturing method for the digital printing ink includes the following steps. A first thermal process including mixing a dye, a crosslinking agent, and a polyol is performed, such that a polymer dye is formed, in which a reaction temperature of the first thermal process is between 70° C. and 90° C. A second thermal process including mixing the polymer dye and an aqueous bridging agent is performed, such that a first mixture is formed, in which a reaction temperature of the second thermal process is between 90° C. and 120° C. A third thermal process including mixing the first mixture and a chain extender is performed, such that the digital printing ink is formed, in which a reaction temperature of the third thermal process is between 120° C. and 150° C.
DIGITAL PRINTED FABRIC, MANUFACTURING METHOD FOR DIGITAL PRINTED FABRIC, AND DIGITAL PRINTING INK
A digital printed fabric includes a base cloth and a digital printing ink disposed on the base cloth, and a manufacturing method for the digital printing ink includes the following steps. A first thermal process including mixing a dye, a crosslinking agent, and a polyol is performed, such that a polymer dye is formed, in which a reaction temperature of the first thermal process is between 70° C. and 90° C. A second thermal process including mixing the polymer dye and an aqueous bridging agent is performed, such that a first mixture is formed, in which a reaction temperature of the second thermal process is between 90° C. and 120° C. A third thermal process including mixing the first mixture and a chain extender is performed, such that the digital printing ink is formed, in which a reaction temperature of the third thermal process is between 120° C. and 150° C.
Method for 3D printing of carbon nanotube microstructure having high conductivity, and ink used therein
A method of manufacturing a carbon nanotube (CNT) composite material structure is provided. The method includes providing ink, in which a CNT composite material including a CNT and a rheological modifier is dispersed, to a nozzle, positioning the nozzle at a predetermined point on a substrate, and moving the nozzle along a predetermined path on the substrate while discharging the ink from the nozzle by surface tension of a meniscus formed at a leading end of the nozzle and printing a CNT composite material pattern corresponding to a movement path of the nozzle. In printing the CNT composite material pattern, the pattern is stacked as the CNT composite material by evaporation of a solvent within a meniscus formed by the ink extruded from the nozzle between the nozzle and the substrate.
Method for 3D printing of carbon nanotube microstructure having high conductivity, and ink used therein
A method of manufacturing a carbon nanotube (CNT) composite material structure is provided. The method includes providing ink, in which a CNT composite material including a CNT and a rheological modifier is dispersed, to a nozzle, positioning the nozzle at a predetermined point on a substrate, and moving the nozzle along a predetermined path on the substrate while discharging the ink from the nozzle by surface tension of a meniscus formed at a leading end of the nozzle and printing a CNT composite material pattern corresponding to a movement path of the nozzle. In printing the CNT composite material pattern, the pattern is stacked as the CNT composite material by evaporation of a solvent within a meniscus formed by the ink extruded from the nozzle between the nozzle and the substrate.
Composite sheet for shielding electromagnetic and radiating heat including graphene sheet
A composite sheet for shielding electromagnetic and radiating heat includes: a first layer formed of metal; and a second layer that is a graphene layer formed on one surface of the first layer and including charged chemically modified graphene such that thermal conductivity and electromagnetic shielding ability are improved while securing economic efficiency by using the second layer including the charged chemically modified graphene and the graphene flakes.
Composite sheet for shielding electromagnetic and radiating heat including graphene sheet
A composite sheet for shielding electromagnetic and radiating heat includes: a first layer formed of metal; and a second layer that is a graphene layer formed on one surface of the first layer and including charged chemically modified graphene such that thermal conductivity and electromagnetic shielding ability are improved while securing economic efficiency by using the second layer including the charged chemically modified graphene and the graphene flakes.
Hybrid nanosilver/liquid metal ink composition and uses thereof
The present disclosure is directed to a hybrid conductive ink including: silver nanoparticles and eutectic low melting point alloy particles, wherein a weight ratio of the eutectic low melting point alloy particles and the silver nanoparticles ranges from 1:20 to 1:5. Also provided herein are methods of forming an interconnect including a) depositing a hybrid conductive ink on a conductive element positioned on a substrate, wherein the hybrid conductive ink comprises silver nanoparticles and eutectic low melting point alloy particles, the eutectic low melting point alloy particles and the silver nanoparticles being in a weight ratio from about 1:20 to about 1:5; b) placing an electronic component onto the hybrid conductive ink; c) heating the substrate, conductive element, hybrid conductive ink and electronic component to a temperature sufficient i) to anneal the silver nanoparticles in the hybrid conductive ink and ii) to melt the low melting point eutectic alloy particles, wherein the melted low melting point eutectic alloy flows to occupy spaces between the annealed silver nanoparticles, d) allowing the melted low melting point eutectic alloy of the hybrid conductive ink to harden and fuse to the electronic component and the conductive element, thereby forming an interconnect. Electrical circuits including conductive traces and, optionally, interconnects formed with the hybrid conductive ink are also provided.
Hybrid nanosilver/liquid metal ink composition and uses thereof
The present disclosure is directed to a hybrid conductive ink including: silver nanoparticles and eutectic low melting point alloy particles, wherein a weight ratio of the eutectic low melting point alloy particles and the silver nanoparticles ranges from 1:20 to 1:5. Also provided herein are methods of forming an interconnect including a) depositing a hybrid conductive ink on a conductive element positioned on a substrate, wherein the hybrid conductive ink comprises silver nanoparticles and eutectic low melting point alloy particles, the eutectic low melting point alloy particles and the silver nanoparticles being in a weight ratio from about 1:20 to about 1:5; b) placing an electronic component onto the hybrid conductive ink; c) heating the substrate, conductive element, hybrid conductive ink and electronic component to a temperature sufficient i) to anneal the silver nanoparticles in the hybrid conductive ink and ii) to melt the low melting point eutectic alloy particles, wherein the melted low melting point eutectic alloy flows to occupy spaces between the annealed silver nanoparticles, d) allowing the melted low melting point eutectic alloy of the hybrid conductive ink to harden and fuse to the electronic component and the conductive element, thereby forming an interconnect. Electrical circuits including conductive traces and, optionally, interconnects formed with the hybrid conductive ink are also provided.