The present invention relates to a method for forming a metal pattern on a pattern formation section set on a base material. In the present invention, a substrate provided with a fluorine-containing resin layer on a surface of the base material including the pattern formation section is used. The present inventive method for forming a metal pattern includes steps of: forming a functional group on the pattern formation section; and applying a metal ink including an amine compound and a fatty acid as protective agents to the base material surface to fix the metal particles on the pattern formation section. In the present invention, a fluorine-containing resin having a surface free energy measured by the Owens-Wendt method of 13 mN/m or more and 20 mN/m or less is applied as the fluorine-containing resin layer. Further, a metal ink including ethyl cellulose as an additive is applied as the metal ink.

There are provided a silver powder, which is able to form an electrically conductive film having a lower resistance value than that of conventional electrically conductive films when the silver powder is used as the material of an electrically conductive paste which is fired to form the electrically conductive film, and a method for producing the same. A first silver powder having one peak or more, at each of which a frequency is a local maximum value in a volume-based particle size distribution obtained by measuring the first silver powder in a dry process by means of a laser diffraction particle size analyzer, is mixed with a second silver powder having two peaks or more, at each of which a frequency is a local maximum value in a volume-based particle size distribution obtained by measuring the second silver powder in a dry process by means of a laser diffraction particle size analyzer, to produce a silver powder having three peaks or more, at each of which a frequency is a local maximum value in a volume-based particle size distribution obtained by measuring the silver powder in a dry process by means of a laser diffraction particle size analyzer, the silver powder having one peak, at which a frequency is a local maximum value in a volume-based particle size distribution obtained by measuring the silver powder in a wet process by means of a laser diffraction scattering particle size analyzer.

There are provided a silver powder, which is able to form an electrically conductive film having a lower resistance value than that of conventional electrically conductive films when the silver powder is used as the material of an electrically conductive paste which is fired to form the electrically conductive film, and a method for producing the same. A first silver powder having one peak or more, at each of which a frequency is a local maximum value in a volume-based particle size distribution obtained by measuring the first silver powder in a dry process by means of a laser diffraction particle size analyzer, is mixed with a second silver powder having two peaks or more, at each of which a frequency is a local maximum value in a volume-based particle size distribution obtained by measuring the second silver powder in a dry process by means of a laser diffraction particle size analyzer, to produce a silver powder having three peaks or more, at each of which a frequency is a local maximum value in a volume-based particle size distribution obtained by measuring the silver powder in a dry process by means of a laser diffraction particle size analyzer, the silver powder having one peak, at which a frequency is a local maximum value in a volume-based particle size distribution obtained by measuring the silver powder in a wet process by means of a laser diffraction scattering particle size analyzer.

This invention relates to a white inkjet ink composition having improved compatibility of functional polymer-stabilized titanium dioxide with binder resins, resulting in significantly slowing down the sedimentation rate, resisting clogging nozzles upon jetting, and enhancing the lightness of the ink coating. The white inkjet ink composition comprises a white colorant; one or more binder resins; one or more compatibilizers; an ink solvent; and optionally one or more additives. The white colorant is modified with a functional copolymer comprising an acid group, such as such as styrene-maleic anhydride, to form a modified white colorant. The presence of the one or more compatibilizers significantly improve the compatibility of the modified white colorant, such as styrene-maleic anhydride stabilized titanium dioxide, with the one or more binder resins.

A system and method for production and implementation of a photonic crystal forming, aqueous solution, may include: a block polymer mixture and at least one solvent, wherein the at least one solvent comprises water. The “color” of the photonic crystal solution may be set either through a single, or multiple, brush block copolymer mixtures (i.e., premixed coloring) or through layering of multiple layers of distinct single, or multiple, brush block copolymer mixtures. The system functions as an aqueous structural color (i.e., a photonic crystal) precursor, wherein applying the water-based color solution to a substrate, functions to provide a desired photonic crystal object arrangement possessing color reflective properties.

A system and method for production and implementation of a photonic crystal forming, aqueous solution, may include: a block polymer mixture and at least one solvent, wherein the at least one solvent comprises water. The “color” of the photonic crystal solution may be set either through a single, or multiple, brush block copolymer mixtures (i.e., premixed coloring) or through layering of multiple layers of distinct single, or multiple, brush block copolymer mixtures. The system functions as an aqueous structural color (i.e., a photonic crystal) precursor, wherein applying the water-based color solution to a substrate, functions to provide a desired photonic crystal object arrangement possessing color reflective properties.

The present invention relates to security elements, comprising (a) a substrate, (b) on at least part of the substrate surface a metal layer, (c) optionally on at least part of the metal layer a dielectric layer, (d) on at least part of the metal layer, or the dielectric layer, a layer obtained by overcoating the metal layer, or the dielectric layer with a composition, comprising (i) silver nanoparticles, (ii) a solvent, (iii) (surface) stabilizing agent(s) and (iv) optionally a binder, and (e) a protective layer on top of layer (d). The maximum absorption wavelength of the silver nanoparticles in layer (d) is controlled by the amount of (surface) stabilizing agent(s) and optionally binder relative to the amount of silver nanoparticles to be preferably in the range of 700 to 1600 nm.

The present invention relates to security elements, comprising (a) a substrate, (b) on at least part of the substrate surface a metal layer, (c) optionally on at least part of the metal layer a dielectric layer, (d) on at least part of the metal layer, or the dielectric layer, a layer obtained by overcoating the metal layer, or the dielectric layer with a composition, comprising (i) silver nanoparticles, (ii) a solvent, (iii) (surface) stabilizing agent(s) and (iv) optionally a binder, and (e) a protective layer on top of layer (d). The maximum absorption wavelength of the silver nanoparticles in layer (d) is controlled by the amount of (surface) stabilizing agent(s) and optionally binder relative to the amount of silver nanoparticles to be preferably in the range of 700 to 1600 nm.

The present invention provides a silver paste containing at least a silver powder, a binder resin, and an organic solvent, wherein the silver powder contains a first silver powder having a D50 of 3.50 to 7.50 μm and a second silver powder having a D50 of 0.80 to 2.00 μm, where D50 represents a 50% value of a volume-based cumulative fraction obtained by laser diffraction particle size distribution measurement; a copper content of the whole silver powder is 10 to 5000 ppm by mass; a copper content of the second silver powder is 80 ppm by mass or more; and the first silver powder contains substantially no copper. The present invention provides a silver paste containing a powder in a high concentration and excellent in printability, and provides a silver conductor film that has a high filling factor, a high film density, high electrical conductivity, and excellent migration resistance.

The present invention provides a silver paste containing at least a silver powder, a binder resin, and an organic solvent, wherein the silver powder contains a first silver powder having a D50 of 3.50 to 7.50 μm and a second silver powder having a D50 of 0.80 to 2.00 μm, where D50 represents a 50% value of a volume-based cumulative fraction obtained by laser diffraction particle size distribution measurement; a copper content of the whole silver powder is 10 to 5000 ppm by mass; a copper content of the second silver powder is 80 ppm by mass or more; and the first silver powder contains substantially no copper. The present invention provides a silver paste containing a powder in a high concentration and excellent in printability, and provides a silver conductor film that has a high filling factor, a high film density, high electrical conductivity, and excellent migration resistance.