Disclosed is a composition containing copper particles and organic solvents, in which the organic solvents include a first organic solvent having a vapor pressure at 20° C. of 200 Pa or more and 20 kPa or less, and a second organic solvent having a vapor pressure at 20° C. of 0.5 Pa or more and less than 200 Pa.

Disclosed is a composition containing copper particles and organic solvents, in which the organic solvents include a first organic solvent having a vapor pressure at 20° C. of 200 Pa or more and 20 kPa or less, and a second organic solvent having a vapor pressure at 20° C. of 0.5 Pa or more and less than 200 Pa.

The present specification relates to an ink composition including: a compound represented by Formula 1; and a solvent represented by the Formula 2, and a method for manufacturing an organic light emitting device formed by using the ink composition.

The present specification relates to an ink composition including: a compound represented by Formula 1; and a solvent represented by the Formula 2, and a method for manufacturing an organic light emitting device formed by using the ink composition.

An ink jet recording apparatus includes an ink composition, an ink encasement in which the ink composition is encased, a recording head that ejects the ink composition, and a carriage configured to move the recording head back and forth. The carriage carries the ink encasement, with the ink encasement integrated with the carriage. The ink encasement has an ink fill port that opens and shuts as a port through which the ink composition is loaded. The ink composition contains a disperse colorant, with the volume-average particle diameter of the disperse colorant being 110.0 nm or more and 200.0 nm or less, and also contains at least one organic solvent with an SP of 9 or more, with the percentage thereof being 10.0% by mass or more.

An ink jet recording apparatus includes an ink composition, an ink encasement in which the ink composition is encased, a recording head that ejects the ink composition, and a carriage configured to move the recording head back and forth. The carriage carries the ink encasement, with the ink encasement integrated with the carriage. The ink encasement has an ink fill port that opens and shuts as a port through which the ink composition is loaded. The ink composition contains a disperse colorant, with the volume-average particle diameter of the disperse colorant being 110.0 nm or more and 200.0 nm or less, and also contains at least one organic solvent with an SP of 9 or more, with the percentage thereof being 10.0% by mass or more.

Ink compositions are provided for using solvent-based additive manufacturing (SBAM) techniques to form contactor structures and/or structures for use in an adsorption or absorption contactor. Methods forming a contactor using SBAM are also provided. The ink compositions can include a substantial content of adsorbent particles to provide enhanced adsorption by a contactor. Metal organic framework (MOF) structures and zeotype framework structures are examples of types of adsorbent particles that can be incorporated into an ink composition for forming a contactor structure by SBAM. The ink can further include a polymeric component that can serve as the structural component of a polymeric structural material produced by the additive manufacturing method. Such a structural material can correspond to a polymeric material with incorporated adsorbent particles. In some aspects, the polymeric structural material and/or the adsorbent particles can have selectivity for adsorption of CO.sub.2 from a process fluid flow.

Ink compositions are provided for using solvent-based additive manufacturing (SBAM) techniques to form contactor structures and/or structures for use in an adsorption or absorption contactor. Methods forming a contactor using SBAM are also provided. The ink compositions can include a substantial content of adsorbent particles to provide enhanced adsorption by a contactor. Metal organic framework (MOF) structures and zeotype framework structures are examples of types of adsorbent particles that can be incorporated into an ink composition for forming a contactor structure by SBAM. The ink can further include a polymeric component that can serve as the structural component of a polymeric structural material produced by the additive manufacturing method. Such a structural material can correspond to a polymeric material with incorporated adsorbent particles. In some aspects, the polymeric structural material and/or the adsorbent particles can have selectivity for adsorption of CO.sub.2 from a process fluid flow.

The present invention relates to a suspension comprising 50-95% by weight of the total suspension (w/w) of at least one metallic material and/or ceramic material and/or polymeric material and/or solid carbon containing material; and at least 5% by weight of the total suspension of one or more fatty acids or derivatives thereof. In addition, the invention relates to uses of such suspension in 3D printing processes.

The present invention relates to a suspension comprising 50-95% by weight of the total suspension (w/w) of at least one metallic material and/or ceramic material and/or polymeric material and/or solid carbon containing material; and at least 5% by weight of the total suspension of one or more fatty acids or derivatives thereof. In addition, the invention relates to uses of such suspension in 3D printing processes.