C09D11/38

PARTICULATE COMPOSITIONS COMPRISING A METAL PRECURSOR FOR ADDITIVE MANUFACTURING AND METHODS ASSOCIATED THEREWITH
20230227680 · 2023-07-20 · ·

Additive manufacturing processes, such as powder bed fusion of thermoplastic particulates, may be employed to form printed objects in a range of shapes. It is sometimes desirable to form conductive traces upon the surface of printed objects. Conductive traces and similar features may be introduced during additive manufacturing processes by incorporating a metal precursor in a thermoplastic printing composition, converting a portion of the metal precursor to discontinuous metal islands using laser irradiation, and performing electroless plating. Suitable printing compositions may comprise a plurality of thermoplastic particulates comprising a thermoplastic polymer, a metal precursor admixed with the thermoplastic polymer, and optionally a plurality of nanoparticles disposed upon an outer surface of each of the thermoplastic particulates, wherein the metal precursor is activatable to form metal islands upon exposure to laser irradiation. Melt emulsification may be used to form the thermoplastic particulates.

PARTICULATE COMPOSITIONS COMPRISING A METAL PRECURSOR FOR ADDITIVE MANUFACTURING AND METHODS ASSOCIATED THEREWITH
20230227680 · 2023-07-20 · ·

Additive manufacturing processes, such as powder bed fusion of thermoplastic particulates, may be employed to form printed objects in a range of shapes. It is sometimes desirable to form conductive traces upon the surface of printed objects. Conductive traces and similar features may be introduced during additive manufacturing processes by incorporating a metal precursor in a thermoplastic printing composition, converting a portion of the metal precursor to discontinuous metal islands using laser irradiation, and performing electroless plating. Suitable printing compositions may comprise a plurality of thermoplastic particulates comprising a thermoplastic polymer, a metal precursor admixed with the thermoplastic polymer, and optionally a plurality of nanoparticles disposed upon an outer surface of each of the thermoplastic particulates, wherein the metal precursor is activatable to form metal islands upon exposure to laser irradiation. Melt emulsification may be used to form the thermoplastic particulates.

Binder jetting in additive manufacturing of inhomogeneous three-dimensional parts

Devices, systems, and methods are directed to binder jetting for forming three-dimensional parts having controlled, macroscopically inhomogeneous material composition. In general, a binder may be delivered to each layer of a plurality of layers of a powder of inorganic particles. An active component may be introduced, in a spatially controlled distribution, to at least one of the plurality of layers such that the binder, the powder of inorganic particles, and the active component, in combination, form an object. The object may be thermally processed into a three-dimensional part having a gradient of one or more physicochemical properties of a material at least partially formed from thermally processing the inorganic particles and the active component of the object.

Binder jetting in additive manufacturing of inhomogeneous three-dimensional parts

Devices, systems, and methods are directed to binder jetting for forming three-dimensional parts having controlled, macroscopically inhomogeneous material composition. In general, a binder may be delivered to each layer of a plurality of layers of a powder of inorganic particles. An active component may be introduced, in a spatially controlled distribution, to at least one of the plurality of layers such that the binder, the powder of inorganic particles, and the active component, in combination, form an object. The object may be thermally processed into a three-dimensional part having a gradient of one or more physicochemical properties of a material at least partially formed from thermally processing the inorganic particles and the active component of the object.

Inks for 3D printing having low print through depth
11702559 · 2023-07-18 · ·

In one aspect, inks for use with a three-dimensional (3D) printing system are described herein. In some embodiments, an ink described herein comprises up to 80 wt. % oligomeric curable material; up to 80 wt. % monomeric curable material; up to 10 wt. % photoinitiator; up to 1 wt. % non-curable absorber material; and up to 10 wt. % one or more additional components, based on the total weight of the ink, and wherein the total amount of the foregoing components is equal to 100 wt. %. Additionally, the photoinitiator is operable to initiate curing of the oligomeric curable material and/or the monomeric curable material when the photoinitiator is exposed to incident curing radiation having a peak wavelength λ. Moreover, the ink has a penetration depth (D.sub.p), a critical energy (E.sub.c), and a print through depth (D.sub.PT) at the wavelength λ of less than or equal to 2×D.sub.p.

Inks for 3D printing having low print through depth
11702559 · 2023-07-18 · ·

In one aspect, inks for use with a three-dimensional (3D) printing system are described herein. In some embodiments, an ink described herein comprises up to 80 wt. % oligomeric curable material; up to 80 wt. % monomeric curable material; up to 10 wt. % photoinitiator; up to 1 wt. % non-curable absorber material; and up to 10 wt. % one or more additional components, based on the total weight of the ink, and wherein the total amount of the foregoing components is equal to 100 wt. %. Additionally, the photoinitiator is operable to initiate curing of the oligomeric curable material and/or the monomeric curable material when the photoinitiator is exposed to incident curing radiation having a peak wavelength λ. Moreover, the ink has a penetration depth (D.sub.p), a critical energy (E.sub.c), and a print through depth (D.sub.PT) at the wavelength λ of less than or equal to 2×D.sub.p.

Ink composition for manufacturing organic semiconductor device
11702557 · 2023-07-18 · ·

An object of the present invention is to provide an ink composition for manufacturing an organic semiconductor device, the ink composition allowing an organic semiconductor material with a rigid main chain into an ink having an optimal solute concentration for a single-crystal formation process. The present invention provides an ink composition for manufacturing an organic semiconductor device, the ink composition including at least one solvent selected from Naphthalene Compound (A) and at least one solute. The isomer content of Naphthalene Compound (A) is preferably 2% or less in terms of a percentage for peak area with Naphthalene Compound (A) being 100% in gas chromatography. Naphthalene Compound (A): a compound represented by Formula (a), where in Formula (a), R is as defined in the description.

Pigmented inkjet ink with high acid number acrylic resin
11702558 · 2023-07-18 ·

This specification discloses non-aqueous solvent, pigmented ink formulations that are suitable for the electronic and aerospace industries and form printed marks that are resistant to smearing and dissolution by organic solvents commonly used in overcoatings in this industry and others. These ink formulations are based on use of an acidic resin with an inherent acid value of at least about 25 mg KOH/g, preferably at least partially neutralized by a quaternary ammonium hydroxide and/or alcohol amine acid neutralizing or modifying agent.

Pigmented inkjet ink with high acid number acrylic resin
11702558 · 2023-07-18 ·

This specification discloses non-aqueous solvent, pigmented ink formulations that are suitable for the electronic and aerospace industries and form printed marks that are resistant to smearing and dissolution by organic solvents commonly used in overcoatings in this industry and others. These ink formulations are based on use of an acidic resin with an inherent acid value of at least about 25 mg KOH/g, preferably at least partially neutralized by a quaternary ammonium hydroxide and/or alcohol amine acid neutralizing or modifying agent.

Method of controlling properties of nanoparticles and patterning with nanoparticles by ink lithography

Disclosed is a patterning method by ink lithography. More particularly, the patterning method includes coating thin film-forming nanoparticles surrounded by the first ligand on a substrate to form a nanoparticle thin film; directly spraying a ligand-substituting ink to a selected region on the nanoparticle thin film to form a region in which the first ligand is substituted with the second ligand; and washing the nanoparticle thin film with a washing solvent so that the region substituted with the second ligand is patterned.