An electrophoretic coating is disclosed. The electrophoretic coating comprises an aqueous medium and a charged film-forming resin dispersed in the aqueous medium. The film-forming resin is acid-insoluble and alkali-soluble.

A coating composition for the piston of an internal combustion engine comprises 10-30 wt. % of phenolic resin, 10-30 wt. % of epoxy resin, 10-30 wt. % of at least one solid lubricant selected from the group consisting of graphite, MoS.sub.2, WS.sub.2 and BN, and 5-30 wt. % of Fe.sub.2O.sub.3 particles.

A coating composition for the piston of an internal combustion engine comprises 10-30 wt. % of phenolic resin, 10-30 wt. % of epoxy resin, 10-30 wt. % of at least one solid lubricant selected from the group consisting of graphite, MoS.sub.2, WS.sub.2 and BN, and 5-30 wt. % of Fe.sub.2O.sub.3 particles.

A coating composition for the piston of an internal combustion engine comprises 10-30 wt. % of phenolic resin, 10-30 wt. % of epoxy resin, 10-30 wt. % of at least one solid lubricant selected from the group consisting of graphite, MoS.sub.2, WS.sub.2 and BN, and 5-30 wt. % of Fe.sub.2O.sub.3 particles.

A multimodal coating and method of coating a substrate are disclosed. The coating includes a structural framework: and a medium embedded in the structural framework forming an intumescent coating, the intumescent coating configured to undergo intumescent expansion of an outermost coating of the medium upon heating.

A multimodal coating and method of coating a substrate are disclosed. The coating includes a structural framework: and a medium embedded in the structural framework forming an intumescent coating, the intumescent coating configured to undergo intumescent expansion of an outermost coating of the medium upon heating.

An object of the present invention is to provide a useful underlayer film forming composition. The following underlayer film forming composition can solve the problem described above. An underlayer film forming composition comprising: a compound having a constituent unit represented by the following formula (1); and a solvent, wherein the weight average molecular weight of the compound is 1,000 to 30,000 as the molecular weight in terms of polystyrene, and the solubility of the compound in propylene glycol monomethyl ether acetate is 10% by mass at 23° C.:

##STR00001##

wherein A is a single bond or a divalent group; each R.sup.1 is independently a linear, branched, or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkynyl group having 2 to 10 carbon atoms, a thiol group, or a hydroxy group; each R.sup.2 is independently a linear, branched, or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkynyl group having 2 to 10 carbon atoms, a thiol group, or a hydroxy group, where at least one R.sup.2 is a hydroxy group and/or a thiol group; each m.sup.1 is independently an integer of 0 to 5; each m.sup.2 is independently an integer of 0 to 8; and each p.sup.2 is independently an integer of 0 to 2.

A method of producing a modified wood product is disclosed. The method comprises heating a resin impregnated wood product in a reactor, the resin impregnated wood product comprising source wood impregnated with a resin composition comprising resin, the heating being so as to substantially cure the resin, thereby to produce the modified wood product. The method comprises, during the heating of the resin impregnated wood product in the reactor, introducing water into the reactor. A reactor and a modified wood product are also disclosed.

[Problem] The present invention provides a method of manufacturing a resist pattern of effectively below the resolution limit, which is suitable for use in the liquid crystal display device manufacturing field. In particular, the present invention provides a method of accurately manufacturing a high-defined pattern of below the resolution limit while maintaining or improving a pattern shape having a taper shape. [Means for Solution]A method of manufacturing a high-defined pattern comprising the following steps of: coating a resist composition comprising a novolak resin having an alkali dissolution rate of 100-3,000 Å on a substrate to form a resist composition layer; subjecting said resist composition layer to exposure; developing said resist composition layer to form a resist pattern; heating said resist pattern; subjecting said resist pattern to flood exposure; coating a fine pattern forming composition on the surface of said resist pattern to form a fine pattern forming composition layer; heating said resist pattern and said fine pattern forming composition layer to cure the regions of said fine pattern forming composition layer in the vicinity of said resist pattern and to form an insolubilized layer; removing uncured regions of said fine pattern forming composition layer to form a fine pattern; and heating said fine pattern.

[Problem] The present invention provides a method of manufacturing a resist pattern of effectively below the resolution limit, which is suitable for use in the liquid crystal display device manufacturing field. In particular, the present invention provides a method of accurately manufacturing a high-defined pattern of below the resolution limit while maintaining or improving a pattern shape having a taper shape. [Means for Solution]A method of manufacturing a high-defined pattern comprising the following steps of: coating a resist composition comprising a novolak resin having an alkali dissolution rate of 100-3,000 Å on a substrate to form a resist composition layer; subjecting said resist composition layer to exposure; developing said resist composition layer to form a resist pattern; heating said resist pattern; subjecting said resist pattern to flood exposure; coating a fine pattern forming composition on the surface of said resist pattern to form a fine pattern forming composition layer; heating said resist pattern and said fine pattern forming composition layer to cure the regions of said fine pattern forming composition layer in the vicinity of said resist pattern and to form an insolubilized layer; removing uncured regions of said fine pattern forming composition layer to form a fine pattern; and heating said fine pattern.