The present invention relates to a heating element composition capable of three-dimensional molding and a film heater formed therefrom. Specifically, the present invention relates to a heating element composition capable of three-dimensional molding and a film heater formed therefrom, wherein the heating element composition has high extensibility and excellent high temperature durability which is in a conflicting relationship with extensibility, so that mechanical damage such as cracks during stretching can be suppressed, has the characteristic of being stably maintained in a molded shape rather than being restored to an original shape after molding, like conventional stretchable materials, can minimize the change rate of resistance when deformed by three-dimensional molding, can be cured at 150 C. or less, and can form a heating element by various printings or coatings so as to be applied to various film heaters.

The resin-coated metal sheet for containers includes a resin coating layer (A) having a multilayered structure mainly composed of a polyester resin on at least one surface thereof. The resin coating layer (A) includes a resin layer (a1). The resin layer (a1) adheres to the metal sheet, contains (i) a polyester resin, (ii) a phenolic resin, (iii) a metal alkoxide compound and/or a metal chelate compound, (iv) an epoxy resin, and (v) at least one selected from the group consisting of polyamine resins, polyamidoamine resins, and polyamide resins, and is mainly composed of the polyester resin. Preferably, a polyester film (a2) is disposed on the resin layer (a1).

The present invention provides a novel resist underlayer film-forming composition capable of forming a resist underlayer film that has etching resistance and excellent embeddability in a surface having concave portions and/or convex portions. A resist underlayer film-forming composition comprising a polymer having a structural unit represented by formula (1) or formula (2):

##STR00001##

(wherein X is an arylene group, n is 1 or 2, and R.sub.1, R.sub.2, R.sub.3, and R.sub.4 are each independently a hydrogen atom, a hydroxy group, a C.sub.1-3 alkyl group, or a phenyl group), and a solvent.

The present invention provides a novel resist underlayer film-forming composition capable of forming a resist underlayer film that has etching resistance and excellent embeddability in a surface having concave portions and/or convex portions. A resist underlayer film-forming composition comprising a polymer having a structural unit represented by formula (1) or formula (2):

##STR00001##

(wherein X is an arylene group, n is 1 or 2, and R.sub.1, R.sub.2, R.sub.3, and R.sub.4 are each independently a hydrogen atom, a hydroxy group, a C.sub.1-3 alkyl group, or a phenyl group), and a solvent.

A material for use in a fused filament fabrication (FFF) printer comprises a polyaryletherketone (PAEK) having an amorphous morphology. In some embodiments, the material also includes a PAEK having a semi-crystalline morphology.

A material for use in a fused filament fabrication (FFF) printer comprises a polyaryletherketone (PAEK) having an amorphous morphology. In some embodiments, the material also includes a PAEK having a semi-crystalline morphology.

Provided are a polymer for an underlayer film, used in semiconductor and display manufacturing processes, an underlayer film composition for semiconductor and display manufacturing processes, containing the same, and a method for forming an underlayer film for semiconductor and display manufacturing processes using the underlayer film composition. The polymer according to the present invention is a polymer including a repeating unit represented by the following Chemical Formula 1: ##STR00001##
in Chemical Formula 1, Ar, R.sub.1 to R.sub.6, L, and R and R are the same as those in the detailed description of the present invention.

Provided are a polymer for an underlayer film, used in semiconductor and display manufacturing processes, an underlayer film composition for semiconductor and display manufacturing processes, containing the same, and a method for forming an underlayer film for semiconductor and display manufacturing processes using the underlayer film composition. The polymer according to the present invention is a polymer including a repeating unit represented by the following Chemical Formula 1: ##STR00001##
in Chemical Formula 1, Ar, R.sub.1 to R.sub.6, L, and R and R are the same as those in the detailed description of the present invention.