Patent classifications
C09D161/22
POLYHEMIAMINAL AND POLYHEXAHYDROTRIAZINE MATERIALS FROM 1,4 CONJUGATE ADDITION REACTIONS
Polyhemiaminal (PHA) and polyhexahydrotriazine (PHT) materials are modified by 1,4 conjugate addition chemical reactions to produce a variety of molecular architectures comprising pendant groups and bridging segments. The materials are formed by a method that includes heating a mixture comprising solvent(s), paraformaldehyde, aromatic amine groups, aliphatic amine Michael donors, and Michael acceptors, such as acrylates. The reaction mixtures may be used to prepare polymer pre-impregnated materials and composites containing PHT matrix resin.
Polyhemiaminal and polyhexahydrotriazine materials from 1,4 conjugate addition reactions
Polyhemiaminal (PHA) and polyhexahydrotriazine (PHT) materials are modified by 1,4 conjugate addition chemical reactions to produce a variety of molecular architectures comprising pendant groups and bridging segments. The materials are formed by a method that includes heating a mixture comprising solvent(s), paraformaldehyde, aromatic amine groups, aliphatic amine Michael donors, and Michael acceptors, such as acrylates. The reaction mixtures may be used to prepare polymer pre-impregnated materials and composites containing PHT matrix resin.
Polyhemiaminal and polyhexahydrotriazine materials from 1,4 conjugate addition reactions
Polyhemiaminal (PHA) and polyhexahydrotriazine (PHT) materials are modified by 1,4 conjugate addition chemical reactions to produce a variety of molecular architectures comprising pendant groups and bridging segments. The materials are formed by a method that includes heating a mixture comprising solvent(s), paraformaldehyde, aromatic amine groups, aliphatic amine Michael donors, and Michael acceptors, such as acrylates. The reaction mixtures may be used to prepare polymer pre-impregnated materials and composites containing PHT matrix resin.
Polyhemiaminal and polyhexahydrotriazine materials from 1,4 conjugate addition reactions
Polyhemiaminal (PHA) and polyhexahydrotriazine (PHT) materials are modified by 1,4 conjugate addition chemical reactions to produce a variety of molecular architectures comprising pendant groups and bridging segments. The materials are formed by a method that includes heating a mixture comprising solvent(s), paraformaldehyde, aromatic amine groups, aliphatic amine Michael donors, and Michael acceptors, such as acrylates. The reaction mixtures may be used to prepare polymer pre-impregnated materials and composites containing PHT matrix resin.
COMPOSITION FOR FORMING ORGANIC FILM, SUBSTRATE FOR MANUFACTURING SEMICONDUCTOR APPARATUS, METHOD FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND POLYMER
The invention provides a composition for forming an organic film, which generates no by-product even under such a film formation condition in an inert gas to prevent substrate corrosion, which is capable of forming an organic film not only excellent in properties of filling and planarizing a pattern formed on a substrate but also favorable for dry etching resistance during substrate processing, and further which causes no fluctuation in film thickness of the film due to thermal decomposition even when a CVD hard mask is formed on the organic film. The composition for forming an organic film includes (A) a polymer having a repeating unit shown by the following general formula (1) and (B) an organic solvent.
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COMPOSITION FOR FORMING ORGANIC FILM, SUBSTRATE FOR MANUFACTURING SEMICONDUCTOR APPARATUS, METHOD FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND POLYMER
The invention provides a composition for forming an organic film, which generates no by-product even under such a film formation condition in an inert gas to prevent substrate corrosion, which is capable of forming an organic film not only excellent in properties of filling and planarizing a pattern formed on a substrate but also favorable for dry etching resistance during substrate processing, and further which causes no fluctuation in film thickness of the film due to thermal decomposition even when a CVD hard mask is formed on the organic film. The composition for forming an organic film includes (A) a polymer having a repeating unit shown by the following general formula (1) and (B) an organic solvent.
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TAILORABLE SURFACE TOPOLOGY FOR ANTIFOULING COATINGS
Embodiments are directed to a method of making an antifouling and bactericidal coating with tailorable surface topology. The method includes depositing a layer of branched polyethyleneimine (BPEI) and diamino-functionalized poly(propylene oxide) (PPO) in a mixture of water and organic solvent on a substrate to form a layer of BPEI/PPO. The method includes depositing a layer of glyoxal in a water-containing solution on the layer of BPEI/PPO. The method further includes curing the layer of BPEI/PPO and layer of glyoxal to form a homogenous, glyoxal crosslinked BPEI/PPO coating, where the curing induces local precipitation and alteration of the glyoxal crosslinked BPEI/PPO coating to provide a textured surface.
TAILORABLE SURFACE TOPOLOGY FOR ANTIFOULING COATINGS
Embodiments are directed to a method of making an antifouling and bactericidal coating with tailorable surface topology. The method includes depositing a layer of branched polyethyleneimine (BPEI) and diamino-functionalized poly(propylene oxide) (PPO) in a mixture of water and organic solvent on a substrate to form a layer of BPEI/PPO. The method includes depositing a layer of glyoxal in a water-containing solution on the layer of BPEI/PPO. The method further includes curing the layer of BPEI/PPO and layer of glyoxal to form a homogenous, glyoxal crosslinked BPEI/PPO coating, where the curing induces local precipitation and alteration of the glyoxal crosslinked BPEI/PPO coating to provide a textured surface.
AMINE GLYOXAL RESINS
Condensation polymers are prepared by agitating a mixture comprising glyoxal, a monomer comprising two or three primary aromatic amine groups, an organic solvent, and water at a temperature between 20 C. and 100 C. The resulting solution can be applied to a surface of a substrate, forming an initial film. Curing the initial film layer using two or more heating steps, wherein one of the heat steps is performed at a temperature of 150 C. to 250 C., produces a cured film layer. Depending on the relative amounts of glyoxal and monomer used, the film layer can contain predominantly high Tg imine-containing units or predominantly lower Tg aminal-containing units. All film layers were highly resistant to the solvent used to prepare the polymer. The Tg of the polymer can be about 190 C. to greater than 300 C.
Coating system, a method of applying the coating system and an article comprising the coating system
A coating system comprising an epoxy coating layer prepared from an epoxy formulation which comprises an epoxy resin; a curing agent with no more than 4.5 wt % free amine based on a weight solids of the curing agent; and an adjacent layer prepared from a non-isocyanate polyurethane formulation wherein the epoxy formulation and/or non-isocyanate polyurethane formulation optionally further comprise one or more additives selected from the group consisting of solvent, reactive diluent, plasticizer, pigment, filler; rheology modifiers, dispersants, surfactants, UV stabilizers, and corrosion inhibitors is provided. Also provided are a method of applying a multi-layer coating system and an article comprising a coating system.