Patent classifications
C09D161/22
Polymeric coatings and coating method
Polymeric coatings and methods of forming polymeric coatings are described. In a method of forming a polymeric coating a first layer is deposited on a substrate. The first layer includes at least one highly soluble diamine component. A second layer is formed on the substrate to contact the first layer. The second layer includes paraformaldehyde and an aromatic diamine including two primary amine groups. Once formed, the first and second layers are heated. Heating causes the components of the first and second layers to cure. For example, the paraformaldehyde from the second layer diffuses into the first layer and reacts via hemiaminal-type chemistry with the high soluble diamine component. The coatings may be substantially homogenous or comprise a compositional gradient in thickness or along the substrate plane depending on deposition methods and other processing parameters.
Conductive composition, and conductive complex
A conductive composition containing carbon nanotubes, a carbon nanotube dispersant, and a dopant precursor, wherein the dispersant is a non-conjugated polymer compound having an aromatic ring as the repeating unit, and the dopant precursor is an acid-generating agent which generates cation by being subjected to light and/or heat. The aforementioned conductive composition is capable of stably dispersing carbon nanotubes and of efficiently doping same without damaging the conductive properties of the carbon nanotubes.
Conductive composition, and conductive complex
A conductive composition containing carbon nanotubes, a carbon nanotube dispersant, and a dopant precursor, wherein the dispersant is a non-conjugated polymer compound having an aromatic ring as the repeating unit, and the dopant precursor is an acid-generating agent which generates cation by being subjected to light and/or heat. The aforementioned conductive composition is capable of stably dispersing carbon nanotubes and of efficiently doping same without damaging the conductive properties of the carbon nanotubes.
Conductive composition, and conductive complex
A conductive composition containing carbon nanotubes, a carbon nanotube dispersant, and a dopant precursor, wherein the dispersant is a non-conjugated polymer compound having an aromatic ring as the repeating unit, and the dopant precursor is an acid-generating agent which generates cation by being subjected to light and/or heat. The aforementioned conductive composition is capable of stably dispersing carbon nanotubes and of efficiently doping same without damaging the conductive properties of the carbon nanotubes.
Resins for underlayers
Polymeric reaction products of certain substituted tetraarylmethane monomers are useful as underlayers in semiconductor manufacturing processes.
Resins for underlayers
Polymeric reaction products of certain substituted tetraarylmethane monomers are useful as underlayers in semiconductor manufacturing processes.
Composition for forming resist underlayer film and patterning process
The present invention provides a composition for forming a resist underlayer film, containing an organic solvent and either or both of a compound shown by the following general formula (1) and a condensate of the compound. There can be provided a composition for forming a resist underlayer film that is capable of forming an underlayer film, especially for use in a three-layer resist process, that can reduce reflectance, has high pattern-bend resistance, and prevents line fall and wiggling after etching of a high aspect line especially thinner than 60 nm, and a patterning process using the same. ##STR00001##
Composition for forming resist underlayer film and patterning process
The present invention provides a composition for forming a resist underlayer film, containing an organic solvent and either or both of a compound shown by the following general formula (1) and a condensate of the compound. There can be provided a composition for forming a resist underlayer film that is capable of forming an underlayer film, especially for use in a three-layer resist process, that can reduce reflectance, has high pattern-bend resistance, and prevents line fall and wiggling after etching of a high aspect line especially thinner than 60 nm, and a patterning process using the same. ##STR00001##
COATING SYSTEM, A METHOD OF APPLYING THE COATING SYSTEM AND AN ARTICLE COMPRISING THE COATING SYSTEM
A coating system comprising an epoxy coating layer prepared from an epoxy formulation which comprises an epoxy resin; a curing agent with no more than 4.5 wt % free amine based on a weight solids of the curing agent; and an adjacent layer prepared from a non-isocyanate polyurethane formulation wherein the epoxy formulation and/or non-isocyanate polyurethane formulation optionally further comprise one or more additives selected from the group consisting of solvent, reactive diluent, plasticizer, pigment, filler; rheology modifiers, dispersants, surfactants, UV stabilizers, and corrosion inhibitors is provided. Also provided are a method of applying a multi-layer coating system and an article comprising a coating system.
POLYMERIC COATINGS AND COATING METHOD
Polymeric coatings and methods of forming polymeric coatings are described. In a method of forming a polymeric coating a first layer is deposited on a substrate. The first layer includes at least one highly soluble diamine component. A second layer is formed on the substrate to contact the first layer. The second layer includes paraformaldehyde and an aromatic diamine including two primary amine groups. Once formed, the first and second layers are heated. Heating causes the components of the first and second layers to cure. For example, the paraformaldehyde from the second layer diffuses into the first layer and reacts via hemiaminal-type chemistry with the high soluble diamine component. The coatings may be substantially homogenous or comprise a compositional gradient in thickness or along the substrate plane depending on deposition methods and other processing parameters.