An insulated wire including a conductor (A) and an insulating layer (B) around the conductor (A). The insulating layer (B) contains an aromatic polyetherketone resin (I) and a fluorine-containing copolymer (II) and has a melt viscosity at 60 sec.sup.−1 and 390° C. of 0.40 to 0.75 kPa.Math.s. The aromatic polyetherketone resin (I) has a melt viscosity at 60 sec.sup.−1 and 390° C. of 0.30 kPa.Math.s or lower. The insulating layer (B) has a thickness of 30 to 300 μm.

Polycyclocarbonate compounds and upgraded molecular weight polymers made from such compounds are provided. The polymers have particular utility in coating compositions, especially for use on food and beverage contact substrates that are formed into or will be formed into containers or container components.

Polycyclocarbonate compounds and upgraded molecular weight polymers made from such compounds are provided. The polymers have particular utility in coating compositions, especially for use on food and beverage contact substrates that are formed into or will be formed into containers or container components.

The present disclosure relates to process of obtaining a powder of poly(ether ketone ketone) (PEKK) polymer, comprising grinding a PEKK polymer at a temperature comprised between 60° C. and 85° C., wherein the powder has a d.sub.50-value comprised 0 between 40 pm and 60 pm (as measured by laser scattering in isopropanol). The present invention also relates to a PEKK powder presenting such particle size distribution (PSD), obtained by the grinding method of the present invention.

Provided is a curable composition having excellent workability and being capable of forming a cured product having excellent heat resistance. The curable composition of the present invention includes a compound represented by Formula (1) below and a solvent: In Formula (1) below, R.sup.1 and R.sup.2 each represent a curable functional group, and D.sup.1 and D.sup.2 each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below. In Formula (I) and Formula (II) below, Ar.sup.1 to Ar.sup.3 each represent a group in which two hydrogen atoms are removed from an aromatic ring structure or a group in which two hydrogen atoms are removed from a structure in which two or more aromatic rings are bonded through a single bond or a linking group. X represents —CO—, —S—, or —SO.sub.2—, and Y represents —S—, —SO.sub.2—, —O—, —CO—, —COO—, or —CONH—. n represents an integer of 0 or greater.

Provided is a curable composition having excellent workability and being capable of forming a cured product having excellent heat resistance. The curable composition of the present invention includes a compound represented by Formula (1) below and a solvent: In Formula (1) below, R.sup.1 and R.sup.2 each represent a curable functional group, and D.sup.1 and D.sup.2 each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below. In Formula (I) and Formula (II) below, Ar.sup.1 to Ar.sup.3 each represent a group in which two hydrogen atoms are removed from an aromatic ring structure or a group in which two hydrogen atoms are removed from a structure in which two or more aromatic rings are bonded through a single bond or a linking group. X represents —CO—, —S—, or —SO.sub.2—, and Y represents —S—, —SO.sub.2—, —O—, —CO—, —COO—, or —CONH—. n represents an integer of 0 or greater.

A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm.sup.2 to about 300 J/cm.sup.2.

Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.

An insulated wire, containing a conductor and an insulating film (A) provided in contact with the conductor, in which the insulating film (A) contains polyaryletherketone, the polyaryletherketone has an exothermic peak at the range of 290 to 330 C. in a differential scanning calorimetry when the polyaryletherketone is cooled at a temperature falling rate of 10 C./min from a temperature equal to or higher than the melting temperature of the polyaryletherketone, and the half width of the exothermic peak is 6 C. or more.

Polycyclocarbonate compounds and upgraded molecular weight polymers made from such compounds are provided. The polymers have particular utility in coating compositions, especially for use on food and beverage contact substrates that are formed into or will be formed into containers or container components.

Polycyclocarbonate compounds and upgraded molecular weight polymers made from such compounds are provided. The polymers have particular utility in coating compositions, especially for use on food and beverage contact substrates that are formed into or will be formed into containers or container components.