The present invention relates to an aqueous dispersion (P) comprising at least one polymeric resin (P1) and at least one polymeric resin (P2) different therefrom, where the polymeric resin (P1) is a polyamide and the polymeric resin (P2) is a polyester which is at least obtainable by reaction of at least one polymerized aliphatic C.sub.12-C.sub.24 monocarboxylic acid with at least one diol and/or polyol, (P) being obtainable by dispersing of (P1) in water or an aqueous medium in the presence of (P2), and where (P1) has an acid number <10 mg of KOH per g of polyamide, and (P) contains at most 25 wt %, based on the total weight of (P), of one or more organic solvents, and also to an aqueous coating composition comprising (P), at least one binder (A) comprising at least one polymeric resin (A1), which is different from the polymeric resins (P1) and (P2), and at least one pigment (B) for at least partly coating a substrate with a basecoat film.

Anti-corrosion metal pretreatment compositions comprising a Group IVB metal, a Group IB metal and polyamidoamine polymers; replenisher compositions for the metal pretreatment compositions; methods of making the metal pretreatment compositions; methods of forming an anti-corrosion Group IVB oxide coating on at least one metal substrate surface by contacting the surface with the metal pretreatment composition; and coated metal substrates having anti-corrosion coatings deposited on the metal substrates from chrome VI free, anti-corrosion metal pretreatment compositions having enhanced corrosion resistance of the Group IVB metal oxide coatings and adhesion of the anti-corrosion and primer coating layers to metal substrates.

Anti-corrosion metal pretreatment compositions comprising a Group IVB metal, a Group IB metal and polyamidoamine polymers; replenisher compositions for the metal pretreatment compositions; methods of making the metal pretreatment compositions; methods of forming an anti-corrosion Group IVB oxide coating on at least one metal substrate surface by contacting the surface with the metal pretreatment composition; and coated metal substrates having anti-corrosion coatings deposited on the metal substrates from chrome VI free, anti-corrosion metal pretreatment compositions having enhanced corrosion resistance of the Group IVB metal oxide coatings and adhesion of the anti-corrosion and primer coating layers to metal substrates.

A corrosion inhibitor has a film-forming portion. In one embodiment, the corrosion inhibitor further includes a surfactant, a coupling solvent and a carrier solvent. In another embodiment, the corrosion inhibitor has a film-forming portion that includes at least two multi-dentate compounds and a compound having a single active group. Each of the multi-dentate compounds and the compound having a single active group are selected from the group consisting of compounds having nitrogen-containing polar groups, compounds having acid groups and combinations thereof.

A corrosion inhibitor has a film-forming portion. In one embodiment, the corrosion inhibitor further includes a surfactant, a coupling solvent and a carrier solvent. In another embodiment, the corrosion inhibitor has a film-forming portion that includes at least two multi-dentate compounds and a compound having a single active group. Each of the multi-dentate compounds and the compound having a single active group are selected from the group consisting of compounds having nitrogen-containing polar groups, compounds having acid groups and combinations thereof.

The invention relates to thermosetting powder coating compositions as these are disclosed herein. The compositions comprise A) unsaturated resin(s) comprising ethylenic unsaturations selected from the group consisting of polyester resins, polyurethanes, epoxy resins, polyamides, polyesteramides, polycarbonates, polyureas and mixtures thereof; and B) curing agent(s) selected from the group consisting of certain vinyl urethanes, vinyl functionalized urethane resins and mixtures thereof; and C) thermal radical initiator(s) selected from the group consisting of organic peroxides, azo compounds, and mixtures thereof; and D) co-initiator(s) selected from the group consisting of certain onium compounds, sulpho-compounds, and mixtures thereof; and E) inhibitor(s) selected from the group consisting of phenolic compounds, stable radicals, catechols, phenothiazines, hydroquinones, benzoquinones and mixtures thereof. The invention further relates to a process for making said thermosetting powder coating compositions and processes for coating an article with said thermosetting powder coating compositions. The invention further relates to cured thermosetting powder coating compositions obtained by curing of the thermosetting powder coating compositions of the invention. The invention further relates to an article having coated thereon said thermosetting powder coating composition as well as to an article having coated and cured thereon said thermosetting powder coating composition. The invention further relates to the use of said thermosetting powder coating compositions, to the use of an article having coated thereon said thermosetting powder coating compositions and to the use of an article having coated and cured thereon said thermosetting powder coating compositions. The invention further relates to various uses of either the thermosetting powder coating compositions of the invention, or the cured thermosetting powder coating compositions of the invention or of articles having coated thereon the thermosetting powder coating composition of the invention, or of articles having coated and cured thereon the thermosetting powder coating composition of the invention. The invention further relates to a method for substantially lowering the T.sub.chalk-free as the latter is defined herein.

The present invention relates to a polyamideimide composition that is highly suitable for use as primary insulation for wires. The composition comprises from 55 to 65 pbw of N-n-butyl pyrollidone, from 25 to 40 pbw of polyamideimide resin, from 0 to 20 pbw of other components, wherein the polyamideimide resin has a Mw of between 10000 to 40000 g/mol (Dalton) and a Mw/Mn ratio between 1,1 and 2.

The present invention relates to a polyamideimide composition that is highly suitable for use as primary insulation for wires. The composition comprises from 55 to 65 pbw of N-n-butyl pyrollidone, from 25 to 40 pbw of polyamideimide resin, from 0 to 20 pbw of other components, wherein the polyamideimide resin has a Mw of between 10000 to 40000 g/mol (Dalton) and a Mw/Mn ratio between 1,1 and 2.

Coating formulations capable of forming coatings exhibiting minimal or no blushing may comprise an aqueous carrier fluid, an amine-terminated polyamide, a resin, an acid catalyst, and a water-soluble fluorescent compound. The resin may comprise at least one compound selected from the group consisting of an aminoplast melamine-based resin, a benzoguanamine-based resin, a cresolformaldehyde-based resin, and any combination thereof. Such coating formulations may be curable in at least about 1 minute at 200° F. Coatings formed therefrom may comprise a crosslinked reaction product of the amine-terminated polyamide and the resin. The water-soluble fluorescent compound may be compliant with 21 CFR § 175.300 (2019), of which quinine is a representative example. Such coatings that are compliant with 21 CFR § 175.300 may be disposed upon a surface in contact with a foodstuff, such as upon at least a portion of an easy-open end of a can or similar container.

Coating formulations capable of forming coatings exhibiting minimal or no blushing may comprise an aqueous carrier fluid, an amine-terminated polyamide, a resin, an acid catalyst, and a water-soluble fluorescent compound. The resin may comprise at least one compound selected from the group consisting of an aminoplast melamine-based resin, a benzoguanamine-based resin, a cresolformaldehyde-based resin, and any combination thereof. Such coating formulations may be curable in at least about 1 minute at 200° F. Coatings formed therefrom may comprise a crosslinked reaction product of the amine-terminated polyamide and the resin. The water-soluble fluorescent compound may be compliant with 21 CFR § 175.300 (2019), of which quinine is a representative example. Such coatings that are compliant with 21 CFR § 175.300 may be disposed upon a surface in contact with a foodstuff, such as upon at least a portion of an easy-open end of a can or similar container.