Embodiments of the present invention provide a unique new approach to generating operating condition information used for assessing flow assurance and structural integrity. More specifically, apparatuses, systems and sensor housing assemblies configured in accordance with embodiments of the present invention utilize fiber optic sensors for enabling monitoring of operating condition information within one or more elongated tubular members within a subsea environment. To this end, such fiber optic sensors connected by lengths of optical fiber are strategically placed at a plurality of locations along a length of each elongated tubular member thereby allowing critical operating conditions such as strain, temperature and pressure of the elongated tubular member and/or a fluid therein to be monitored. A viscous media is used for mitigating attenuation associated with exposure of optical fiber exposed to forces generated by pressure within the subsea environment.

A packaging semiconductor device, such as a fan-out Wafer-Level Packaging (FOWLP) device, is fabricated by providing a semiconductor device (20) having conductive patterns (22) disposed on a first surface and then forming, on the conductive patterns, photoresist islands (24) having a first predetermined shape defined by a first critical width dimension and a minimum height dimension so that a subsequently-formed dielectric polymer layer (26) surrounds but does not cover each photoresist island (24), thereby allowing each photoresist island to be selectively removed from the one or more conductive patterns to form one or more via openings (28) in the dielectric polymer layer such that each via opening has a second predetermined shape which matches at least part of the first predetermined shape of the photoresist islands.

A packaging semiconductor device, such as a fan-out Wafer-Level Packaging (FOWLP) device, is fabricated by providing a semiconductor device (20) having conductive patterns (22) disposed on a first surface and then forming, on the conductive patterns, photoresist islands (24) having a first predetermined shape defined by a first critical width dimension and a minimum height dimension so that a subsequently-formed dielectric polymer layer (26) surrounds but does not cover each photoresist island (24), thereby allowing each photoresist island to be selectively removed from the one or more conductive patterns to form one or more via openings (28) in the dielectric polymer layer such that each via opening has a second predetermined shape which matches at least part of the first predetermined shape of the photoresist islands.

Provided are a polyimide film for a cover window which may satisfy performance required for an advanced cover window, and a use thereof. According to an implementation, it may be useful for a polyimide film for a cover window which has excellent visibility having no optical stain without deterioration of colorless and transparent optical properties, has excellent heat resistance and mechanical properties, and thus, is for use as an optical application or for replacing existing tempered glass, a laminate including the same, and a display device including the same.

Provided are a polyimide film for a cover window which may satisfy performance required for an advanced cover window, and a use thereof. According to an implementation, it may be useful for a polyimide film for a cover window which has excellent visibility having no optical stain without deterioration of colorless and transparent optical properties, has excellent heat resistance and mechanical properties, and thus, is for use as an optical application or for replacing existing tempered glass, a laminate including the same, and a display device including the same.

A polyimide copolymer, a polyimide film, and a manufacturing method of the polyimide film are provided. The polyimide copolymer includes a plurality of repeating units represented by a following formula (I) and a plurality of repeating units represented by a following formula (II).

##STR00001##

A structural formula of a substituent R.sub.1 is shown as follows:

##STR00002##

A structural formula of a substituent R.sub.2 is shown as follows:

##STR00003##

In addition, the polyimide copolymer has a weight average molecular weight (Mw) of between 30,000 and 200,000.

A polyimide copolymer, a polyimide film, and a manufacturing method of the polyimide film are provided. The polyimide copolymer includes a plurality of repeating units represented by a following formula (I) and a plurality of repeating units represented by a following formula (II).

##STR00001##

A structural formula of a substituent R.sub.1 is shown as follows:

##STR00002##

A structural formula of a substituent R.sub.2 is shown as follows:

##STR00003##

In addition, the polyimide copolymer has a weight average molecular weight (Mw) of between 30,000 and 200,000.

The present invention relates to a liquid crystal alignment composition comprising first liquid crystal alignment polymer; second liquid crystal alignment polymer; and a cross-linking agent compound, a method for preparing a liquid crystal alignment film using the same, a liquid crystal alignment film and a liquid crystal display using the same.

The present invention relates to a liquid crystal alignment composition comprising first liquid crystal alignment polymer; second liquid crystal alignment polymer; and a cross-linking agent compound, a method for preparing a liquid crystal alignment film using the same, a liquid crystal alignment film and a liquid crystal display using the same.

Provided is a polyimide having a repeating unit represented by the following Formula (1):

##STR00001##

wherein R.sup.1 represents a tetravalent group; R.sup.2 represents a divalent group; provided that at least one of R.sup.1's is represented by the following Formula (2); and among R.sup.2's, at least one group is represented by the following Formula (3), and at least one other group is represented by the following Formula (4):

##STR00002##