C09D201/06

THERMOSETTING COATING COMPOSITION

A thermosetting coating composition includes a hydroxyl group-containing resin (A), a blocked polyisocyanate curing agent (B), and an amine compound (C) represented by the formula (1). In the formula (1), R.sup.1 to R.sup.5 each independently represents a hydrogen atom or an organic group having one or more carbon atoms. The organic group may contain one or more atoms selected from the group consisting of oxygen atoms, nitrogen atoms, sulfur atoms, and halogen atoms.

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THERMOSETTING COATING COMPOSITION

A thermosetting coating composition includes a hydroxyl group-containing resin (A), a blocked polyisocyanate curing agent (B), and an amine compound (C) represented by the formula (1). In the formula (1), R.sup.1 to R.sup.5 each independently represents a hydrogen atom or an organic group having one or more carbon atoms. The organic group may contain one or more atoms selected from the group consisting of oxygen atoms, nitrogen atoms, sulfur atoms, and halogen atoms.

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Low-temperature-curable coating composition

The present invention provides a coating composition which cures at low temperatures to form a cured film having high solvent resistance. The present invention provides a low-temperature-curable coating composition which comprises (A) a film-forming polymer having a hydrogen-donating functional group that has a heteroatom which bonds covalently to a hydrogen atom, (B) a film-forming polymer having a specific hydrogen-accepting functional group that has a heteroatom to which no hydrogen atom bonds covalently, and (C) a non-basic volatile solvent selected from the group consisting of a non-basic volatile solvent (C-1) having, in the molecule, both a heteroatom that bonds covalently to a hydrogen atom and a heteroatom that does not bond covalently to a hydrogen atom; a mixture of a non-basic volatile solvent (C-2) having, in the molecule, a heteroatom which bonds covalently to a hydrogen atom and a non-basic volatile solvent (C-3) having, in the molecule, a heteroatom to which no hydrogen atom bonds covalently; and combinations thereof.

Low-temperature-curable coating composition

The present invention provides a coating composition which cures at low temperatures to form a cured film having high solvent resistance. The present invention provides a low-temperature-curable coating composition which comprises (A) a film-forming polymer having a hydrogen-donating functional group that has a heteroatom which bonds covalently to a hydrogen atom, (B) a film-forming polymer having a specific hydrogen-accepting functional group that has a heteroatom to which no hydrogen atom bonds covalently, and (C) a non-basic volatile solvent selected from the group consisting of a non-basic volatile solvent (C-1) having, in the molecule, both a heteroatom that bonds covalently to a hydrogen atom and a heteroatom that does not bond covalently to a hydrogen atom; a mixture of a non-basic volatile solvent (C-2) having, in the molecule, a heteroatom which bonds covalently to a hydrogen atom and a non-basic volatile solvent (C-3) having, in the molecule, a heteroatom to which no hydrogen atom bonds covalently; and combinations thereof.

BINDERS
20190264857 · 2019-08-29 ·

An un-reacted substantially formaldehyde free curable binder solution for binding loose matter consists essentially of a solution obtainable by dissolving a reducing sugar, an ammonium salt acid precursor, optionally a carboxylic acid or a precursor thereof and optionally ammonia in water.

BINDERS
20190264857 · 2019-08-29 ·

An un-reacted substantially formaldehyde free curable binder solution for binding loose matter consists essentially of a solution obtainable by dissolving a reducing sugar, an ammonium salt acid precursor, optionally a carboxylic acid or a precursor thereof and optionally ammonia in water.

SEMICONDUCTOR SUBSTRATE TREATMENT AGENT AND SUBSTRATE-TREATING METHOD

A substrate-treating method includes applying a treatment agent directly or indirectly on one face of a substrate to form a substrate pattern collapse-inhibitory film. The substrate includes a pattern on the one face. The substrate pattern collapse-inhibitory film is removed by dry etching after forming the substrate pattern collapse-inhibitory film. The treatment agent includes a compound including an aromatic ring, and a hetero atom-containing group that bonds to the aromatic ring; and a solvent.

(METH)ACRYLIC COPOLYMER, COATING MATERIAL COMPOSITION, COATED ARTICLE AND METHOD FOR FORMING MULTILAYER COATING FILM

Provided is a coating material composition that enables an efficient repair operation of a coating film after coating, a (meth)acrylic copolymer that is suitable for obtaining the coating material composition, and a coated article and a method for forming a multilayer coating film using the coating material composition. The (meth)acrylic copolymer includes: a constituent unit derived from a macromonomer (a); and a constituent unit derived from a vinyl monomer (b), a hydroxyl value of the (meth)acrylic copolymer is equal to or greater than 120 mgKOH/g and equal to or less than 260 mgKOH/g, and the content of a constituent unit that has a primary hydroxyl group of the (meth)acrylic copolymer is equal to or less than 30 parts by mass with respect to 100 parts by mass of the constituent unit derived from the macromonomer (a) and the constituent unit derived from the vinyl monomer (b).

Device and production method for the same

A device includes a substrate and a hydrophilic polymer layer made of a hydrophilic polymer having a hydroxyl group. The hydrophilic polymer layer having a hydroxyl group is fixed to at least a part of a surface of the substrate and the hydrophilic polymer further has an amide group. A liquid film retention time of the device is 15 seconds or more. The device has a surface of a substrate which is hydrophilized. A method for producing the device by a simple method is also disclosed.

BINDERS
20240159347 · 2024-05-16 ·

An un-reacted substantially formaldehyde free curable binder solution for binding loose matter consists essentially of a solution obtainable by dissolving a reducing sugar, an ammonium salt acid precursor, optionally a carboxylic acid or a precursor thereof and optionally ammonia in water.