C09D201/06

COMPOSITION FOR FORMING PROTECTIVE FILM AGAINST ALKALINE AQUEOUS HYDROGEN PEROXIDE, SUBSTRATE FOR PRODUCING SEMICONDUCTOR APPARATUS, METHOD FOR FORMING PROTECTIVE FILM, AND METHOD FOR FORMING PATTERN

Provided is a composition for forming a protective film using a polymer having an imide group: that is cured under a film-forming condition not only in the air but in an inert gas; that can form a protective film having excellent heat resistance, embedding and planarization ability for a pattern formed on a substrate, and good adhesiveness to the substrate; and that can form a protective film having excellent resistance against an alkaline aqueous hydrogen peroxide. A composition for forming a protective film against an alkaline aqueous hydrogen peroxide, the composition including: (A) a polymer having a repeating unit represented by the following general formula (1A) and having at least one or more fluorine atoms and at least one or more hydroxy groups, a terminal group thereof is a group of any one of the following general formulae (1B) and (1C); and (B) an organic solvent,

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wherein R.sub.1 represents any one group represented by the following formula (1D), and two or more kinds of R.sub.1 are optionally used in combination.

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COMPOSITION FOR FORMING PROTECTIVE FILM AGAINST ALKALINE AQUEOUS HYDROGEN PEROXIDE, SUBSTRATE FOR PRODUCING SEMICONDUCTOR APPARATUS, METHOD FOR FORMING PROTECTIVE FILM, AND METHOD FOR FORMING PATTERN

Provided is a composition for forming a protective film using a polymer having an imide group: that is cured under a film-forming condition not only in the air but in an inert gas; that can form a protective film having excellent heat resistance, embedding and planarization ability for a pattern formed on a substrate, and good adhesiveness to the substrate; and that can form a protective film having excellent resistance against an alkaline aqueous hydrogen peroxide. A composition for forming a protective film against an alkaline aqueous hydrogen peroxide, the composition including: (A) a polymer having a repeating unit represented by the following general formula (1A) and having at least one or more fluorine atoms and at least one or more hydroxy groups, a terminal group thereof is a group of any one of the following general formulae (1B) and (1C); and (B) an organic solvent,

##STR00001##

##STR00002##

##STR00003##

wherein R.sub.1 represents any one group represented by the following formula (1D), and two or more kinds of R.sub.1 are optionally used in combination.

##STR00004##

COMPOSITION FOR FORMING A COATING FILM FOR REMOVING FOREIGN MATTERS

A simple method for removing foreign substances that are formed on a substrate during a semiconductor device production process and a composition for forming a coating film for foreign substance removal, said coating film being used in the above-described method. A composition for forming a coating film for foreign substance removal, said composition containing a polymer and a solvent and being capable of forming a coating film that dissolves in a developer liquid, wherein: the polymer is selected from among phenolic novolacs, polyhydroxystyrene derivatives and carboxylic acid-containing polymers; and the polymer is contained in an amount of 50% by mass or more relative to the total solid content in the composition.

COMPOSITION FOR FORMING A COATING FILM FOR REMOVING FOREIGN MATTERS

A simple method for removing foreign substances that are formed on a substrate during a semiconductor device production process and a composition for forming a coating film for foreign substance removal, said coating film being used in the above-described method. A composition for forming a coating film for foreign substance removal, said composition containing a polymer and a solvent and being capable of forming a coating film that dissolves in a developer liquid, wherein: the polymer is selected from among phenolic novolacs, polyhydroxystyrene derivatives and carboxylic acid-containing polymers; and the polymer is contained in an amount of 50% by mass or more relative to the total solid content in the composition.

(Meth)acrylic copolymer, coating material composition, coated article and method for forming multilayer coating film

Provided is a coating material composition that enables an efficient repair operation of a coating film after coating, a (meth)acrylic copolymer that is suitable for obtaining the coating material composition, and a coated article and a method for forming a multilayer coating film using the coating material composition. The (meth)acrylic copolymer includes: a constituent unit derived from a macromonomer (a); and a constituent unit derived from a vinyl monomer (b), a hydroxyl value of the (meth)acrylic copolymer is equal to or greater than 120 mgKOH/g and equal to or less than 260 mgKOH/g, and the content of a constituent unit that has a primary hydroxyl group of the (meth)acrylic copolymer is equal to or less than 30 parts by mass with respect to 100 parts by mass of the constituent unit derived from the macromonomer (a) and the constituent unit derived from the vinyl monomer (b).

(Meth)acrylic copolymer, coating material composition, coated article and method for forming multilayer coating film

Provided is a coating material composition that enables an efficient repair operation of a coating film after coating, a (meth)acrylic copolymer that is suitable for obtaining the coating material composition, and a coated article and a method for forming a multilayer coating film using the coating material composition. The (meth)acrylic copolymer includes: a constituent unit derived from a macromonomer (a); and a constituent unit derived from a vinyl monomer (b), a hydroxyl value of the (meth)acrylic copolymer is equal to or greater than 120 mgKOH/g and equal to or less than 260 mgKOH/g, and the content of a constituent unit that has a primary hydroxyl group of the (meth)acrylic copolymer is equal to or less than 30 parts by mass with respect to 100 parts by mass of the constituent unit derived from the macromonomer (a) and the constituent unit derived from the vinyl monomer (b).

Inorganic particle dispersion

An inorganic particle dispersion having high spinnability comprises an inorganic powder, hydrophilic fumed silica, and a resin having a hydroxyl group.

Inorganic particle dispersion

An inorganic particle dispersion having high spinnability comprises an inorganic powder, hydrophilic fumed silica, and a resin having a hydroxyl group.

MINERAL WOOL INSULATION
20230288013 · 2023-09-14 ·

A method of manufacturing a mineral fibre thermal insulation product comprises the sequential steps of: Forming mineral fibres from a molten mineral mixture; Spraying a substantially formaldehyde free binder solution on to the mineral fibres, the binder solution comprising: a reducing sugar, an acid precursor derivable from an inorganic salt and a source of nitrogen; Collecting the mineral fibres to which the binder solution has been applied to form a batt of mineral fibres; and Curing the batt comprising the mineral fibres and the binder which is in contact with the mineral fibres by passing the batt through a curing oven so as to provide a batt of mineral fibres held together by a substantially water insoluble cured binder.

MINERAL WOOL INSULATION
20230288013 · 2023-09-14 ·

A method of manufacturing a mineral fibre thermal insulation product comprises the sequential steps of: Forming mineral fibres from a molten mineral mixture; Spraying a substantially formaldehyde free binder solution on to the mineral fibres, the binder solution comprising: a reducing sugar, an acid precursor derivable from an inorganic salt and a source of nitrogen; Collecting the mineral fibres to which the binder solution has been applied to form a batt of mineral fibres; and Curing the batt comprising the mineral fibres and the binder which is in contact with the mineral fibres by passing the batt through a curing oven so as to provide a batt of mineral fibres held together by a substantially water insoluble cured binder.