The current disclosure describes carrier tape systems that include a carrier tape substrate and a cover tape. The carrier tape system includes a plurality of repetitive adhesion areas where the carrier tape substrate and cover tape are attached to each other and non-adhesion areas where the carrier tape substrate and cover tape are not attached to each other. Separating the cover tape and the carrier tape substrate at these repetitive adhesion and non-adhesion areas imparts a vibration to the cover tape which impedes or prevents semiconductor devices carried in pockets of the carrier tape substrate from adhering to adhesive on the cover tape.

A pressure sensitive adhesive sheet for batteries, which includes a base material and a pressure sensitive adhesive layer provided on one surface side of the base material. The pressure sensitive adhesive layer contains inorganic fine particles having a water content of 0.4% or less in a single body.

A carrier film includes an adhesive layer, a core layer, and a release layer. The adhesive layer includes a hydrogenated styrene block copolymer having a storage modulus (G′) of less than or equal to 400 kPa at 25° C., and a first polyolefin elastomer. The core layer includes a second polyolefin elastomer, and the release layer includes a polyolefin.

Presently described are polylactic acid polymer based films comprising a structured surface and articles. In one embodiment, the film comprises a semicrystalline polylactic acid polymer; a second polymer such as polyvinyl acetate polymer having a glass transition temperature (Tg) of at least 25° C.; and plasticizer. Articles are also described such as a tape or sheet, comprising the structured PLA-based film and a layer of (e.g. pressure sensitive) adhesive disposed on the film. In some embodiments, the tape or sheet further comprises a low adhesion backsize or a release liner. The article can be suitable for various end-uses. In one embodiment, the tape is a paint masking tape. In another embodiment, the tape is a floor marking tape.

A tape cassette includes a tape, a transparent cover film, and an ink ribbon. The tape has a thickness in a thickness direction and a width in a width direction. The tape is configured of a plurality of laminated layers including: a transparent base layer; a background layer having a width smaller than the width of the tape in the width direction; and a release layer constituting one surface of the tape in the thickness direction. The transparent cover film is to be bonded to the tape. The ink ribbon contains ink to be transferred to one of the tape and the cover film.

The disclosed tape strip stack is a stack of tape strips arranged one on top of the other for individual removal of each successive tape strip. Secured to a portion of an adhesive on the tape strip, and on alternating ends between successive tape strips, is a tab. The tab protects the adhesive at an exposed tape strip. In some cases, the tab is a removable release tab. Prior to use, the removable release tab is removed, such that a tape strip with an adhesive surface is available for use.

A film is described comprising a (meth)acrylic polymer and a polyvinyl acetal (e.g. butyral) resin. In some embodiments, the film has a glass transition temperature (i.e. Tg) ranging from 30 C. to 60 C. In some embodiments, the film has a gel content of at least 20% or greater. In some embodiments, the film has an elongation at break of at least 175%. The film typically comprises photoinitiator as a result of the method by which the film was made. The film may be a monolithic film or a layer of a multilayer film.

A composition, and article including such composition, wherein the silsesquioxane polymer includes a three-dimensional network of Formula (I): wherein: each R.sup.1 and R.sup.2 is independently a (C1-C4)alkyl; each L.sup.1 and L.sup.2 is independently a single bond, an alkylene, or an alkylene bonded to a group selected from oxy, thio, carbonyl, NH, and combinations thereof; each R.sup.3 is independently a linear (C14-C100)alkyl; each R5 is independently a (C1-C30)alkyl, a (C1-C30)fluorinated alkyl, or a (C2-C30)heteroalkyl having at least one oxygen, sulfur, or NH group; with the proviso that L.sup.1, L.sup.2, and R5 are selected such that each Si atom is directly bonded to an alkylene or an alkyl; m is an integer of at least 2; n is an integer of 0 or above; m+n is an integer of at least 10; each oxygen atom at an asterisk (*) is bonded to another Si atom within the three-dimensional network; and the silsesquioxane polymer is a solid at 25 C.

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Disclosed are an anti-sticking adhesive tape for molding of a composite material and a manufacturing method therefor and the use thereof, the anti-sticking adhesive tape including the following sequentially laminated structures: a first layer being a fluorine-containing resin layer, a second layer being a first adhesive layer, a third layer being a reinforcing material layer, and a fourth layer being a second adhesive layer, wherein the bonding force between the first layer and a resin for molding of a composite material is smaller than the 180-degree peeling adhesion force of the fourth layer, and the intermolecular cohesive force of the first adhesive layer and the intermolecular cohesive force of the second adhesive layer are both larger than the 180-degree peeling adhesion force of the fourth layer. The anti-sticking adhesive tape can easily be separated from the resin for molding of a composite material when opening the mold.

In debonding a temporarily adhesive-bonded carrier-workpiece pair by a combination of chemical and mechanical methods, solvents or chemicals are used to remove the adhesives primarily through dissolution, and a thin wire, filament, or blade is used to exert a cutting or wedging action between the carrier and workpiece. The two methods are used together during the debonding process. In the carrier-workpiece pair, the workpiece can be a semiconductor wafer that has been thinned and processed. The carrier and the workpiece are temporarily bonded using an adhesive dissolvable in a selected chemical or solvent. The chemical and mechanical debonding (CMDB) method can be carried out in solvent immersion or in solvent spray to provide high throughput debonding. The dissolved adhesives can be recycled and later reused, thus lowering the cost of the whole bonding and debonding process.