An object of the present invention relates to a thermosetting adhesive sheet that, without the use of a metal reinforcement sheet, which is regarded as a major factor responsible for an increase in thickness of electronic devices and other devices, reinforces a flexible printed circuit to such a level that detachment of mounted components, for example, is prevented, prevents warping, and has good electrical conductivity. The present invention relates to a thermosetting adhesive sheet configured to be used to reinforce a flexible printed circuit. The thermosetting adhesive sheet includes a woven fabric, a nonwoven fabric, or a metal base of 50 m or less thickness and a thermosetting adhesive layer adjacent to at least one surface of the woven fabric, the nonwoven fabric, or the metal base of 50 m or less thickness.

The invention provides a joining film that can enhance the mechanical strength and thermal cycle characteristics in a semiconductor device produced by joining a semiconductor element and a substrate, and a tape for wafer processing.

Disclosed is a joining film 13 for joining a semiconductor element 2 and a substrate 40, the joining film having an electroconductive joining layer 13a having a reinforcing layer formed from a porous body or a reticulate body, the pores or meshes of the porous body or the reticulate body being filled with an electroconductive paste containing metal fine particles (p).

The present invention relates to a pressure-sensitive adhesive tape comprising a backing layer having a first and a second surface; and a first pressure-sensitive adhesive layer affixed to the first surface; wherein the first pressure-sensitive adhesive layer has an adhesive strength of 2.0 N/10 mm to 9.0 N/10 mm in absence of a solvent and the pressure-sensitive adhesive tape has a tensile strength in longitudinal direction of 45 N/15 mm to 80 N/15 mm.

The invention relates to a method for producing an adhesive tape, by: providing a tapelike textile carrier (2), applying a thickener (7) and an aqueous dispersion-based adhesive (8) to the textile carrier (2), and then drying the dispersion-based adhesive (8).

A silicone adhesive composition includes 100 parts by weight of a peroxide-curable silicone, 1.2 to 3.2 parts by weight of an organic peroxide curing agent, and 2 to 9 parts by weight of an addition reaction-curable silicone rubber. An adhesive tape according to the present invention is a tape including includes a base and an adhesive layer placed on the base, the adhesive layer being formed from the above silicone adhesive composition. The adhesive composition according to the present invention exhibits high load bearing capacity even in higher-temperature environments than ever before. The adhesive tape according to the present invention exhibits high load bearing capacity and good shelf life even in such high-temperature environments.

A roll includes a core having a tubular shape and a laminate wound around the core. The laminate includes a process film, a surface coat layer formed from a fluorine resin, a substrate layer, an adhesive layer, and a release liner formed from polyethylene terephthalate (PET) in this order in a laminating direction. The process film is formed from at least of polyethylene terephthalate (PET), polyolefin, and polyvinyl chloride (PVC), and is thinner than the release liner.

A structural reinforcement for an article including a carrier that includes: (i) a mass of polymeric material having an outer surface; and (ii) at least one consolidated fibrous insert having an outer surface and including at least one elongated fiber arrangement having a plurality of ordered fibers arranged in a predetermined manner. The fibrous insert is envisioned to adjoin the mass of the polymeric material in a predetermined location for carrying a predetermined load that is subjected upon the predetermined location (thereby effectively providing localized reinforcement to that predetermined location). The fibrous insert and the mass of polymeric material are of compatible materials, structures or both, for allowing the fibrous insert to be at least partially joined to the mass of the polymeric material. Disposed upon at least a portion of the carrier will be a mass of activatable material.

An object of the present invention relates to a thermosetting adhesive sheet that, without the use of a metal reinforcement sheet, which is regarded as a major factor responsible for an increase in thickness of electronic devices and other devices, reinforces a flexible printed circuit to such a level that detachment of mounted components, for example, is prevented, prevents warping, and has good electrical conductivity. The present invention relates to a thermosetting adhesive sheet configured to be used to reinforce a flexible printed circuit. The thermosetting adhesive sheet includes a woven fabric, a nonwoven fabric, or a metal base of 50 m or less thickness and a thermosetting adhesive layer adjacent to at least one surface of the woven fabric, the nonwoven fabric, or the metal base of 50 m or less thickness.

Unique designs, devices, systems, materials and fabrication methods are provided including adhesive closure devices that are easily released and are suitable for extended/repeated use in a variety of applications.

A self-adhesive wrap product includes a non-woven material layer impregnated with a wax formulation. The wax formulation has microcrystalline wax, mineral oil, polypropylene glycol, and soy oil. The self-adhesive wrap product is particularly suitable for minimizing a corrosion of metal components wrapped with the self-adhesive wrap product.