An object of the present invention is to provide a pressure-sensitive adhesive composition that enables a pressure-sensitive adhesive layer to be formed, the pressure-sensitive adhesive layer allowing the appearance of a display device and an input device to be unlikely to deteriorate even under low pressure conditions, a pressure-sensitive adhesive layer, a pressure-sensitive adhesive sheet, an optical member, and a touch panel. The pressure-sensitive adhesive composition of the present invention contains an acrylic polymer (A) and a hydrogenated polyolefinic resin (B). The acrylic polymer (A) contains a (meth)acrylic alkyl ester having an alkyl group having 8 or more carbon atoms as a constituent monomer component. The hydrogenated polyolefinic resin (B) contains a hydrogenated polyolefin.

Provided are a film including a matrix material, and a particle having an elastic modulus at 25° C. which is higher than an elastic modulus of the matrix material, in which the film has a region A at at least a part between the matrix material and the particle, and the region A contains a compound having a loss tangent of 0.1 or greater at 25° C.; and a laminate formed of the film.

A problem is to provide a sheet having a pre-sintering layer, the thickness of which following sintering is such as to be capable of relieving stresses. Solution means relate to a sheet comprising a pre-sintering layer. Viscosity at 90° C. of the pre-sintering layer is not less than 0.27 MPa.Math.s. Thickness of the pre-sintering layer is 30 μm to 200 μm.

A problem is to provide a sheet having a pre-sintering layer, the thickness of which following sintering is such as to be capable of relieving stresses. Solution means relate to a sheet comprising a pre-sintering layer. Viscosity at 90° C. of the pre-sintering layer is not less than 0.27 MPa.Math.s. Thickness of the pre-sintering layer is 30 μm to 200 μm.

Provided is a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance. Therefore, the multi-layered anisotropic conductive adhesive has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. Also provided is a method of producing the multi-layered anisotropic conductive adhesive.

Provided is a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance. Therefore, the multi-layered anisotropic conductive adhesive has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. Also provided is a method of producing the multi-layered anisotropic conductive adhesive.

Masking film stacks, kits composed of said film stacks, adhesive tapes, and covering tapes, and methods for producing said stacks and kits are provided. The masking film stacks comprise masking films having widths and lengths, wherein the masking films are foldable along folding lines, running along the lengths, to form double-ply-folded masking films such that two free longitudinal edges of the double-ply-folded masking films run adjacent to each another and the double-ply masking films are foldable to form stacks and the two longitudinal edges lie on the masking film stacks.

Masking film stacks, kits composed of said film stacks, adhesive tapes, and covering tapes, and methods for producing said stacks and kits are provided. The masking film stacks comprise masking films having widths and lengths, wherein the masking films are foldable along folding lines, running along the lengths, to form double-ply-folded masking films such that two free longitudinal edges of the double-ply-folded masking films run adjacent to each another and the double-ply masking films are foldable to form stacks and the two longitudinal edges lie on the masking film stacks.

Curable compositions comprising a urethane multifunctional (meth)acrylate, a photo initiator system, a moisture-cure initiator, and an oligomer, where the oligomer is represented by the formula (I) where each X.sup.1 is independently alkylene; each X.sup.2 is independently alkylene, polyether, polyester, or polyurethane; R.sup.1 is a (meth)acrylate; R.sup.2 is urethane or isocyanate; and R.sup.3 alkylene (meth)acrylate, polyester (meth)acrylate, polyether, polyester, polyurethane, or nothing, and where the ratio of (meth)acrylate to isocyanate in the oligomer is 1:1 to 1:2. Methods of making curable compositions, methods of sealing a substrate, and methods of adhering two substrates are provided.

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Curable compositions comprising a urethane multifunctional (meth)acrylate, a photo initiator system, a moisture-cure initiator, and an oligomer, where the oligomer is represented by the formula (I) where each X.sup.1 is independently alkylene; each X.sup.2 is independently alkylene, polyether, polyester, or polyurethane; R.sup.1 is a (meth)acrylate; R.sup.2 is urethane or isocyanate; and R.sup.3 alkylene (meth)acrylate, polyester (meth)acrylate, polyether, polyester, polyurethane, or nothing, and where the ratio of (meth)acrylate to isocyanate in the oligomer is 1:1 to 1:2. Methods of making curable compositions, methods of sealing a substrate, and methods of adhering two substrates are provided.

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