C09J7/32

Drywall joint tape with dual purpose adhesive backing

A joint tape to be applied to wallboard is provided and includes a base substrate having opposing sides. In certain embodiments, a first adhesive layer is applied to one of the sides of the base substrate and a second adhesive layer is applied to the first adhesive layer, where the first adhesive layer is different than the second adhesive layer. In certain other embodiments, two different adhesives are used in a single adhesive layer. In use, the joint tape is positioned over and removably secured to a joint or corner between adjacent wallboard panels using the first adhesive layer. After the joint tape is in position, joint compound is applied to the joint tape, and the water in the joint tape activates it to form a secure bond with the wallboard panels.

Drywall joint tape with dual purpose adhesive backing

A joint tape to be applied to wallboard is provided and includes a base substrate having opposing sides. In certain embodiments, a first adhesive layer is applied to one of the sides of the base substrate and a second adhesive layer is applied to the first adhesive layer, where the first adhesive layer is different than the second adhesive layer. In certain other embodiments, two different adhesives are used in a single adhesive layer. In use, the joint tape is positioned over and removably secured to a joint or corner between adjacent wallboard panels using the first adhesive layer. After the joint tape is in position, joint compound is applied to the joint tape, and the water in the joint tape activates it to form a secure bond with the wallboard panels.

PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE LAYER, AND PRESSURE-SENSITIVE ADHESIVE SHEET
20210222030 · 2021-07-22 ·

The present invention relates to an adhesive composition containing a base polymer and a moisture-curable component, wherein a degree of swelling when an adhesive layer is formed is 2.5 or less, an adhesive layer comprising the adhesive composition, and an adhesive sheet comprising the adhesive layer.

PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE LAYER, AND PRESSURE-SENSITIVE ADHESIVE SHEET
20210222030 · 2021-07-22 ·

The present invention relates to an adhesive composition containing a base polymer and a moisture-curable component, wherein a degree of swelling when an adhesive layer is formed is 2.5 or less, an adhesive layer comprising the adhesive composition, and an adhesive sheet comprising the adhesive layer.

ADHESIVE SHEET
20210230458 · 2021-07-29 ·

The present invention relates to an adhesive sheet including an adhesive layer comprising an adhesive composition containing a base polymer and a moisture-curable component, wherein an adhesive surface is peelably covered with a layer having moisture permeability of 5 g/m.sup.2.Math.24 hrs or less.

ADHESIVE SHEET
20210230458 · 2021-07-29 ·

The present invention relates to an adhesive sheet including an adhesive layer comprising an adhesive composition containing a base polymer and a moisture-curable component, wherein an adhesive surface is peelably covered with a layer having moisture permeability of 5 g/m.sup.2.Math.24 hrs or less.

Engineered wood product and method of making same
11084268 · 2021-08-10 ·

A novel engineered wood product and method of making same that withstands the stresses, both natural and man-made, that cause warp, twist and bow.

Engineered wood product and method of making same
11084268 · 2021-08-10 ·

A novel engineered wood product and method of making same that withstands the stresses, both natural and man-made, that cause warp, twist and bow.

THERMAL MANAGEMENT FOR ELECTRONICS USING NONCONDUCTIVE MAGNETIC PARTICLES
20210222043 · 2021-07-22 · ·

Compositions for thermal interface materials comprising magnetically-alignable, thermally-conductive, electrically-nonconductive particles in a matrix comprising curable polymers are provided. The compositions are also useful for use as heat sinks. Methods are provided for the use of such compounds for thermal management and heat dissipation in the electronics industry.

THERMAL MANAGEMENT FOR ELECTRONICS USING NONCONDUCTIVE MAGNETIC PARTICLES
20210222043 · 2021-07-22 · ·

Compositions for thermal interface materials comprising magnetically-alignable, thermally-conductive, electrically-nonconductive particles in a matrix comprising curable polymers are provided. The compositions are also useful for use as heat sinks. Methods are provided for the use of such compounds for thermal management and heat dissipation in the electronics industry.