A pressure-sensitive adhesive comprising a polymer (X1) containing 48% by mass or more of a constituent unit derived from at least one monomer (Y) selected from the group consisting of a monomer (A1) represented by the following general formula (1) and a monomer (B1) represented by the following general formula (2), in which a tan δ (23° C.) determined as G″ (23° C.)/G′ (23° C.) is 0.8 to 1.3, wherein a storage elastic modulus and a loss coefficient at 23° C. are respectively represented by G′ (23° C.) and G″ (23° C.). In the formula (1), R.sup.1 represents H or CH.sub.3, R.sup.2 represents —C.sub.nH.sub.2n+1 and n represents an integer of 7 to 14. In the formula (2), R.sup.3 represents —C(═O)C.sub.mH.sub.2m+1 and m represents an integer of 7 to 13. Thus, retention force under high temperature, low-temperature attachability, and adhesiveness to a low-polar adherend are favorable along with a high bio rate.

The present application relates to a method for manufacturing an indicator for food that can visually check the quality change in food in a package state, an indicator for food manufactured therefrom, and a method for checking the storage status of food using the same. The manufacturing method of an indicator for food of the present application includes bonding a first film, on which an indicator layer including a pH-sensitive indicator is formed on one surface thereof, and a second film, on which an adhesive layer is formed on one surface thereof, so that the indicator layer of the first film and the adhesive layer of the second film can face each other.

The present application relates to a method for manufacturing an indicator for food that can visually check the quality change in food in a package state, an indicator for food manufactured therefrom, and a method for checking the storage status of food using the same. The manufacturing method of an indicator for food of the present application includes bonding a first film, on which an indicator layer including a pH-sensitive indicator is formed on one surface thereof, and a second film, on which an adhesive layer is formed on one surface thereof, so that the indicator layer of the first film and the adhesive layer of the second film can face each other.

Provided is a sealing method that uses a photo-curable sealant sheet. The sealing method provided comprises, in the following order, a step of obtaining a photo-curable sealant sheet, a step of subj ecting the sealant sheet to photoirradiation, and a step of applying the sealant sheet to a target object.

Provided is a sealing method that uses a photo-curable sealant sheet. The sealing method provided comprises, in the following order, a step of obtaining a photo-curable sealant sheet, a step of subj ecting the sealant sheet to photoirradiation, and a step of applying the sealant sheet to a target object.

The present disclosure relates to a B-stageable epoxy adhesive composition and an article manufactured therefrom. The B-stageable epoxy adhesive composition comprises (A) 20% to 50% by weight of a first epoxy resin with an epoxide equivalent of 5000 g/eq or more; (B) 5% to 20% by weight of a second epoxy resin with an epoxide equivalent of 800 g/eq or less and having 2 to 4 epoxy functional groups; (C) 5% to 30% by weight of a carboxyl terminated polyester; (D) 5% to 15% by weight of a poly-isocyanate modified polyester; and (E) 0.1% to 0.5% by weight of a crosslinking agent containing 2 or more aziridine groups, all the content percentages are based on the total weight of the B-stageable epoxy adhesive composition. The B-stageable epoxy adhesive composition and the related products could be widely used as insulation protection for battery management, bus bar, transformers and other markets with a good balance between a high bonding strength and a high temperature resistance, and others.

The present disclosure relates to a B-stageable epoxy adhesive composition and an article manufactured therefrom. The B-stageable epoxy adhesive composition comprises (A) 20% to 50% by weight of a first epoxy resin with an epoxide equivalent of 5000 g/eq or more; (B) 5% to 20% by weight of a second epoxy resin with an epoxide equivalent of 800 g/eq or less and having 2 to 4 epoxy functional groups; (C) 5% to 30% by weight of a carboxyl terminated polyester; (D) 5% to 15% by weight of a poly-isocyanate modified polyester; and (E) 0.1% to 0.5% by weight of a crosslinking agent containing 2 or more aziridine groups, all the content percentages are based on the total weight of the B-stageable epoxy adhesive composition. The B-stageable epoxy adhesive composition and the related products could be widely used as insulation protection for battery management, bus bar, transformers and other markets with a good balance between a high bonding strength and a high temperature resistance, and others.

The adhesive tape of the present disclosure includes: a substrate; and an adhesive layer disposed on one surface of the substrate. In the adhesive tape of the present disclosure, when a breakdown voltage in a thickness direction of the adhesive tape is represented as X (unit: kV) and an initial elastic modulus evaluated from a stress-strain curve in a tensile test is represented as Y (unit: N/mm), an inequality Y ≤ 4.5X -22.5 is satisfied. The adhesive tape of the present disclosure has an excellent balance between insulating properties and winding properties in winding work.

The adhesive tape of the present disclosure includes: a substrate; and an adhesive layer disposed on one surface of the substrate. In the adhesive tape of the present disclosure, when a breakdown voltage in a thickness direction of the adhesive tape is represented as X (unit: kV) and an initial elastic modulus evaluated from a stress-strain curve in a tensile test is represented as Y (unit: N/mm), an inequality Y ≤ 4.5X -22.5 is satisfied. The adhesive tape of the present disclosure has an excellent balance between insulating properties and winding properties in winding work.

A light path control member according to an embodiment comprises: a first substrate; a first electrode disposed on the first substrate; a second substrate disposed on the first substrate; a second electrode disposed under the second substrate; a light conversion part disposed between the first electrode and the second electrode; and an adhesive layer disposed between the second electrode and the light conversion part, wherein the light conversion part comprises alternately disposed partition wall portions and accommodating portions, the accommodating portions comprise a dispersion and a plurality of light absorbing particles disposed in the dispersion, and the log volume resistivity of the adhesive layer is 9 Ω.Math.cm to 15 Ω.Math.cm.