Described is an adhesive coating that can be applied, for example, to a surface of the insulation product. The adhesive coating includes between about 15-40% by weight of the adhesive coating of at least one of polystyrene-maleic anhydride (SMA) and polyacrylic acid (PAA), between about 15 and 50% by weight of the adhesive coating of a polyvinyl alcohol, between about 0.05% and 1.0% by weight of a homogenizer, and between about 20 and 40% by weight of the adhesive coating of a starch paste. The adhesive is activated with the application of liquid water.

Described is an adhesive coating that can be applied, for example, to a surface of the insulation product. The adhesive coating includes between about 15-40% by weight of the adhesive coating of at least one of polystyrene-maleic anhydride (SMA) and polyacrylic acid (PAA), between about 15 and 50% by weight of the adhesive coating of a polyvinyl alcohol, between about 0.05% and 1.0% by weight of a homogenizer, and between about 20 and 40% by weight of the adhesive coating of a starch paste. The adhesive is activated with the application of liquid water.

Described is an adhesive coating that can be applied, for example, to a surface of the insulation product. The adhesive coating includes between about 15-40% by weight of the adhesive coating of at least one of polystyrene-maleic anhydride (SMA) and polyacrylic acid (PAA), between about 15 and 50% by weight of the adhesive coating of a polyvinyl alcohol, between about 0.05% and 1.0% by weight of a homogenizer, and between about 20 and 40% by weight of the adhesive coating of a starch paste. The adhesive is activated with the application of liquid water.

Described is an adhesive coating that can be applied, for example, to a surface of the insulation product. The adhesive coating includes between about 15-40% by weight of the adhesive coating of at least one of polystyrene-maleic anhydride (SMA) and polyacrylic acid (PAA), between about 15 and 50% by weight of the adhesive coating of a polyvinyl alcohol, between about 0.05% and 1.0% by weight of a homogenizer, and between about 20 and 40% by weight of the adhesive coating of a starch paste. The adhesive is activated with the application of liquid water.

A method for producing elliptical, needle-shaped, or rod-shaped polymer particles satisfying (1)-(3) below includes a step in which a synthesis solution including water, a mixed solvent of a hydrophilic organic solvent and a hydrophobic organic solvent, a polymeric stabilizer, a polymerization initiator, and an unsaturated monomer is heated, and, at least after the heating has started, the pH of the synthesis solution is adjusted to 5-9 inclusive to perform solution polymerization: (1) the average (L.sub.AV) length (L) in a two-dimensional projection diagram obtained by irradiating the particles with light from a direction orthogonal to the longitudinal direction is 0.1-80 m; (2) the average (D.sub.AV) breadth (D) in the two-dimensional projection diagram obtained by irradiating the particles with light from the direction orthogonal to the longitudinal direction is 0.05-40 m; and (3) the average (P.sub.AV) aspect ratio (L/D) calculated from the length (L) and the breadth (D) is 1.5-30.

A method for producing elliptical, needle-shaped, or rod-shaped polymer particles satisfying (1)-(3) below includes a step in which a synthesis solution including water, a mixed solvent of a hydrophilic organic solvent and a hydrophobic organic solvent, a polymeric stabilizer, a polymerization initiator, and an unsaturated monomer is heated, and, at least after the heating has started, the pH of the synthesis solution is adjusted to 5-9 inclusive to perform solution polymerization: (1) the average (L.sub.AV) length (L) in a two-dimensional projection diagram obtained by irradiating the particles with light from a direction orthogonal to the longitudinal direction is 0.1-80 m; (2) the average (D.sub.AV) breadth (D) in the two-dimensional projection diagram obtained by irradiating the particles with light from the direction orthogonal to the longitudinal direction is 0.05-40 m; and (3) the average (P.sub.AV) aspect ratio (L/D) calculated from the length (L) and the breadth (D) is 1.5-30.

A resin-metal composite member for a tire, the member including: a metal member; an adhesive layer; and a covering resin layer in this order, wherein: the adhesive layer includes a continuous phase that contains a polyester-based thermoplastic elastomer having a polar functional group, and a discontinuous phase that contains at least one of a polyphenylene ether resin or a styrene resin and contains a styrene-based elastomer having an epoxy group.

Provided are a kit and a laminate which are capable of suppressing residues derived from a temporary adhesive in manufacture of a semiconductor. The kit for manufacturing a semiconductor device includes a composition which contains a solvent A; a composition which contains a solvent B; and a composition which contains a solvent C, in which the kit is used when a temporary adhesive layer is formed on a first substrate using a temporary adhesive composition containing a temporary adhesive and the solvent A, at least some of an excessive amount of the temporary adhesive on the first substrate is washed using the composition containing the solvent B, a laminate is manufactured by bonding the first substrate and a second substrate through the temporary adhesive layer, one of the first substrate and the second substrate is peeled off from the laminate at a temperature of lower than 40 C., and then the temporary adhesive remaining on at least one of the first substrate or the second substrate is washed using the composition containing the solvent C, and the solvent A, the solvent B, and the solvent C respectively satisfy a predetermined vapor pressure and a predetermined saturated solubility.

Provided are a kit and a laminate which are capable of suppressing residues derived from a temporary adhesive in manufacture of a semiconductor. The kit for manufacturing a semiconductor device includes a composition which contains a solvent A; a composition which contains a solvent B; and a composition which contains a solvent C, in which the kit is used when a temporary adhesive layer is formed on a first substrate using a temporary adhesive composition containing a temporary adhesive and the solvent A, at least some of an excessive amount of the temporary adhesive on the first substrate is washed using the composition containing the solvent B, a laminate is manufactured by bonding the first substrate and a second substrate through the temporary adhesive layer, one of the first substrate and the second substrate is peeled off from the laminate at a temperature of lower than 40 C., and then the temporary adhesive remaining on at least one of the first substrate or the second substrate is washed using the composition containing the solvent C, and the solvent A, the solvent B, and the solvent C respectively satisfy a predetermined vapor pressure and a predetermined saturated solubility.

A dielectric welding film capable of tightly welding adherends of a polyolefin resin or the like within a relatively short time through dielectric heating, and a bonding method using the dielectric welding film are provided. The dielectric welding film is configured to bond a plurality of adherends of the same material or different materials through dielectric heating, the dielectric welding film containing (A) a polyolefin resin and (B) a dielectric filler whose mean particle size measured in accordance with JIS Z 8819-2 (2001) is in a range from 1 to 30 m, a thickness of the dielectric welding film ranging from 10 to 2,000 m. The method uses the dielectric welding film.