C09J125/04

High performance water-based adhesion compositions and applications

An adhesion composition comprising a) a first polymer that is selected from the group consisting of acrylic polymers, acrylonitrile butadiene, butyl rubber, cellulose acetate, cellulose butyrate, epoxy resins, ethylene vinyl acetate, natural rubber, neoprene, phenolic polymers, polyurethanes, polyvinyl acetate, polyvinyl alcohol, styrene butadiene rubber, casein, dextrin, starch, copolymers thereof and combinations thereof; b) a second polymer selected from the group consisting of ethylene-acrylic acid copolymer, oxidized polyethylene, oxidized ethylene-vinyl acetate copolymer, maleated polyolefin and combinations thereof; and c) a surfactant; where the composition is water-based, having a solids content of greater than about 30% based on the total weight of the composition, with a particle size of about 10 nm to about 2000 nm, and is adapted for adhesion to substrates; and where the first and second polymers are different. The adhesion composition can also comprise a tackifier resin selected from the group consisting of rosin ester resin, rosin acid resin, synthetic hydrocarbon resin, synthetic terpenic resin and combinations thereof. Applications of the composition are also disclosed.

MANUFACTURING METHOD OF CARBON NANOTUBE CONDUCTIVE MICROSPHERES AND CONDUCTIVE GLUE
20180327267 · 2018-11-15 ·

The present invention provides a manufacturing method of carbon nanotube conductive microspheres and conductive glue in comparison with a manufacturing method of carbon nanotube conductive microspheres provided by the present invention provides and the conventional two-step method which needs to prepare the plastic or resin microspheres and then plating the conductive metal, it is not necessary to respectively prepare the plastic or resin microspheres and the conductive layer, instead, the carbon nanotube are mixed in the polymer microspheres when the styrene monomer, the crosslinking agent and the initiator have a crosslinking reaction to form the polymer microspheres with a method of spray-granulation. Only one step is needed to prepare the conductive microspheres with carbon nanotube as the conductive medium, which can simplify the process, reduce the process, save cost. With mixing the carbon nanotube inside the polymer microspheres, the thermal mismatching between the carbon nanotubes and the resin can be illuminated, to ensure the conductive properties of conductive microspheres. Furthermore, the entire preparing process has no heavy metal salts; the bio-toxicity is reduced and no environmental pollution. The present invention provides a conductive glue, which comprises the carbon nanotube conductive microspheres manufactured by the manufacturing method of carbon nanotube conductive microspheres are easy to manufacture, lower cost, lower impact of thermal mismatching, great conductive properties, and no environmental pollution.

Two-component hot-melt adhesive
10099464 · 2018-10-16 · ·

A moisture-curing two-component composition consisting of a component A containing at least one polyoxyalkylene, polyolefin and/or polyacrylate prepolymer having at least one hydrolysable silane group and at least one solid inert additive selected from hydrocarbons, polyesters or polyamides, a component B containing at least one crosslinking compound for the prepolymers, and auxiliary substances and additives in one or both components, the component A and the two-component composition each having hot-melt adhesive properties.

LAMINATING ADHESIVE, MULTILAYER FILM, AND SECONDARY BATTERY PRODUCED BY USING THE SAME

There are provided a laminating adhesive including, as essential components, an olefin resin (A) having acid groups or acid anhydride groups, a curing agent (B), and a styrene resin (C), wherein a mixing ratio of the styrene resin (C) relative to 100 parts by mass of the olefin resin (A) is 0.01 to 1.5 parts by mass; a multilayer film including, as an essential film structure, a laminate obtained by laminating a non-stretched polyolefin film and a metal film to each other with the laminating adhesive; and a secondary battery produced by using the multilayer film.

Aqueous emulsion and adhesive in which same is used

The present invention relates to an aqueous emulsion including an ethylenically unsaturated monomer unit-containing polymer as a dispersoid and a polyvinyl alcohol as a dispersant. The content of a free polyvinyl alcohol in the aqueous emulsion is 0.2 to 20 parts by mass relative to 100 parts by mass of the ethylenically unsaturated monomer unit-containing polymer. The free polyvinyl alcohol has a degree of saponification of 80.0 to 99.5 mol % and a viscosity-average degree of polymerization of 200 to 5000, and the free polyvinyl alcohol has a symmetry factor (W.sub.0.05h/2f) that satisfies the following expression (1) as determined by gradient high-performance liquid chromatography for reversed-phase separation using a water-acetone eluent according to JIS K 0124 (2011).
0.85W.sub.0.05h/2f1.30(1)
(The definitions of the symbols are omitted.)

Aqueous emulsion and adhesive in which same is used

The present invention relates to an aqueous emulsion including an ethylenically unsaturated monomer unit-containing polymer as a dispersoid and a polyvinyl alcohol as a dispersant. The content of a free polyvinyl alcohol in the aqueous emulsion is 0.2 to 20 parts by mass relative to 100 parts by mass of the ethylenically unsaturated monomer unit-containing polymer. The free polyvinyl alcohol has a degree of saponification of 80.0 to 99.5 mol % and a viscosity-average degree of polymerization of 200 to 5000, and the free polyvinyl alcohol has a symmetry factor (W.sub.0.05h/2f) that satisfies the following expression (1) as determined by gradient high-performance liquid chromatography for reversed-phase separation using a water-acetone eluent according to JIS K 0124 (2011).
0.85W.sub.0.05h/2f1.30(1)
(The definitions of the symbols are omitted.)

METHOD FOR PRODUCING ELLIPTICAL, NEEDLE-SHAPED, OR ROD-SHAPED POLYMER PARTICLES

A method for producing elliptical, needle-shaped, or rod-shaped polymer particles satisfying (1)-(3) below includes a step in which a synthesis solution including water, a mixed solvent of a hydrophilic organic solvent and a hydrophobic organic solvent, a polymeric stabilizer, a polymerization initiator, and an unsaturated monomer is heated, and, at least after the heating has started, the pH of the synthesis solution is adjusted to 5-9 inclusive to perform solution polymerization: (1) the average (L.sub.AV) length (L) in a two-dimensional projection diagram obtained by irradiating the particles with light from a direction orthogonal to the longitudinal direction is 0.1-80 ?m; (2) the average (D.sub.AV) breadth (D) in the two-dimensional projection diagram obtained by irradiating the particles with light from the direction orthogonal to the longitudinal direction is 0.05-40 ?m; and (3) the average (P.sub.AV) aspect ratio (L/D) calculated from the length (L) and the breadth (D) is 1.5-30.

HOT MELT ADHESIVE COMPOSITIONS INCLUDING MODIFIED STYRENE BLOCK COPOLYMER AND ARTICLES INCLUDING THE SAME
20240376346 · 2024-11-14 ·

The invention features a hot melt adhesive compositions for disposable absorbent articles including from 5% by weight to 40% by weight of a non-modified styrenic block copolymer, from 0.5% by weight to 30% by weight of a modified styrenic block copolymer, from 30% by weight to 65% by weight of a tackifying agent, and from 10% by weight to 45% by weight of a plasticizer, wherein the hot melt adhesive composition comprises less than 5% by weight of a wax.

HOT MELT ADHESIVE COMPOSITIONS INCLUDING MODIFIED STYRENE BLOCK COPOLYMER AND ARTICLES INCLUDING THE SAME
20240376346 · 2024-11-14 ·

The invention features a hot melt adhesive compositions for disposable absorbent articles including from 5% by weight to 40% by weight of a non-modified styrenic block copolymer, from 0.5% by weight to 30% by weight of a modified styrenic block copolymer, from 30% by weight to 65% by weight of a tackifying agent, and from 10% by weight to 45% by weight of a plasticizer, wherein the hot melt adhesive composition comprises less than 5% by weight of a wax.

Hot melt moisture cure adhesive compositions

An adhesive composition that includes: one or more polyester polyether copolymers of formula I: ##STR00001## wherein Nu is a predominately cyclic nucleus and RI is randomly selected from either a C.sub.2-6 alkylene or an amorphous, long-chain polyether subunit including a polyoxyalkylene group; one or more polyisocyanate prepolymers that includes the reaction product of: one or more polyols; and a polyfunctional isocyanate having a functionality of more than about 2; polymeric MDI; and a first aromatic or aromatic-aliphatic polymer tackifying resin having a softening point of equal to or greater than about 100 C.