High reliability power cables for subsea application are provided. Example power cables provide enhanced resistance to partial discharge dielectric breakdown as well as resistance to explosive gas decompression, by eliminating micro-defects and voids at the interface between the insulation layer and the barrier layer during the cable manufacturing process. Lead metal, which is conventionally extruded as a primary barrier layer, is replaced in the example power cables by a gas-and-fluid-resistant thermoplastic that is co-extruded or tandem extruded with surface-modified insulation to promote bonding between the two layers. Elimination of lead metal in the example power cables also significantly reduces their overall weight. The improved resistance to partial discharge and resistance to rapid gas decompression translates to lower workover and lower cost of ownership.

High reliability power cables for subsea application are provided. Example power cables provide enhanced resistance to partial discharge dielectric breakdown as well as resistance to explosive gas decompression, by eliminating micro-defects and voids at the interface between the insulation layer and the barrier layer during the cable manufacturing process. Lead metal, which is conventionally extruded as a primary barrier layer, is replaced in the example power cables by a gas-and-fluid-resistant thermoplastic that is co-extruded or tandem extruded with surface-modified insulation to promote bonding between the two layers. Elimination of lead metal in the example power cables also significantly reduces their overall weight. The improved resistance to partial discharge and resistance to rapid gas decompression translates to lower workover and lower cost of ownership.

A bonding component includes a first amount of an organofluorine polymer and a second amount of an organosilicon polymer which are chemically bound to each other and form a copolymer.

A bonding component includes a first amount of an organofluorine polymer and a second amount of an organosilicon polymer which are chemically bound to each other and form a copolymer.

Provided is an adhesive for use in an ultraviolet-light-emitting device using ultraviolet light having a wavelength of from 200 to 400 nm as a light source, which can attach adherends made of a polymer having a fluorine-containing alicyclic structure with excellent adhesiveness which is unlikely to be impaired by exposure to such ultraviolet light or heat.

An adhesive for forming an adhesive joint in an ultraviolet-light-emitting device, which is either the following adhesive (A) or the following adhesive (B) comprising a fluoropolymer having a fluorine-containing alicyclic structure; the adhesive (A): an adhesive in which the glass transition temperature of the fluoropolymer is from 30 to 100 C., and which does not contain an ultraviolet-shielding agent; and the adhesive (B): an adhesive comprising the fluoropolymer and an ultraviolet-shielding agent.

Provided is an adhesive for use in an ultraviolet-light-emitting device using ultraviolet light having a wavelength of from 200 to 400 nm as a light source, which can attach adherends made of a polymer having a fluorine-containing alicyclic structure with excellent adhesiveness which is unlikely to be impaired by exposure to such ultraviolet light or heat.

An adhesive for forming an adhesive joint in an ultraviolet-light-emitting device, which is either the following adhesive (A) or the following adhesive (B) comprising a fluoropolymer having a fluorine-containing alicyclic structure; the adhesive (A): an adhesive in which the glass transition temperature of the fluoropolymer is from 30 to 100 C., and which does not contain an ultraviolet-shielding agent; and the adhesive (B): an adhesive comprising the fluoropolymer and an ultraviolet-shielding agent.

Pressure-sensitive adhesive material for encasing an electronic arrangement to prevent permeate, which material comprises at least 70 percent by weight of a mixture of at least one fluorine-containing thermoplastic elastomer and at least one fluorine-containing liquid elastomer, wherein the mass ratio of the fluorine-containing liquid elastomer to the fluorine-containing thermoplastic elastomer is between 5:95 to 55:45.

Pressure-sensitive adhesive material for encasing an electronic arrangement to prevent permeate, which material comprises at least 70 percent by weight of a mixture of at least one fluorine-containing thermoplastic elastomer and at least one fluorine-containing liquid elastomer, wherein the mass ratio of the fluorine-containing liquid elastomer to the fluorine-containing thermoplastic elastomer is between 5:95 to 55:45.

Embodiments of the present disclosure are directed to an adhesive layer, bearing including the adhesive layer, and methods of forming. The adhesive layer can include a mixture of a first polymer, a second polymer, and a third polymer, wherein the third polymer is a modified fluoropolymer of the second polymer. In a particular embodiment, a weight ratio of a weight content of the second polymer to a weight content of the third polymer in the mixture can be at least 12:1. In another particular embodiment, the adhesive layer can have a normalized peel strength of at least 4.8 N/in/microns.

Embodiments of the present disclosure are directed to an adhesive layer, bearing including the adhesive layer, and methods of forming. The adhesive layer can include a mixture of a first polymer, a second polymer, and a third polymer, wherein the third polymer is a modified fluoropolymer of the second polymer. In a particular embodiment, a weight ratio of a weight content of the second polymer to a weight content of the third polymer in the mixture can be at least 12:1. In another particular embodiment, the adhesive layer can have a normalized peel strength of at least 4.8 N/in/microns.