An adhesive composition, a method for preparing the same, a reticle assembly including the same, and a method for fabricating the reticle assembly including the same are provided. The adhesive composition includes a polyphenol compound including tannic acid, a polymer including polyvinyl alcohol, and a solvent including water and alcohol.

A cooling sheet comprising: a backing layer; an adhesive agent layer; and a liner layer for protecting the adhesive agent layer, wherein the adhesive agent layer contains water at 65 to 85% by mass based on a total mass of the adhesive agent layer, polyalkylene glycol monooleate at 0.12 to 0.7% by mass based on the total mass of the adhesive agent layer, polyvinyl alcohol at 3 to 10% by mass based on the total mass of the adhesive agent layer, polyacrylic acid at 0.5 to 5% by mass based on the total mass of the adhesive agent layer, and a parahydroxybenzoate at 0.01 to 1% by mass based on the total mass of the adhesive agent layer, and a mass ratio of a content of the polyvinyl alcohol to a content of the polyacrylic acid is in a range of 1.2:1 to 5:1.

A cooling sheet comprising: a backing layer; an adhesive agent layer; and a liner layer for protecting the adhesive agent layer, wherein the adhesive agent layer contains water at 65 to 85% by mass based on a total mass of the adhesive agent layer, polyalkylene glycol monooleate at 0.12 to 0.7% by mass based on the total mass of the adhesive agent layer, polyvinyl alcohol at 3 to 10% by mass based on the total mass of the adhesive agent layer, polyacrylic acid at 0.5 to 5% by mass based on the total mass of the adhesive agent layer, and a parahydroxybenzoate at 0.01 to 1% by mass based on the total mass of the adhesive agent layer, and a mass ratio of a content of the polyvinyl alcohol to a content of the polyacrylic acid is in a range of 1.2:1 to 5:1.

An adhesive composition includes an organic adhesive material and a sand. The organic adhesive material includes a water-soluble adhesive and a starch, wherein a weight of the organic adhesive material accounts for 4 wt % to 70 wt % of an overall weight of the adhesive composition, and a weight of the sand accounts for 30 wt % to 96 wt % of the overall weight of the adhesive composition. A water-soluble adhesive mixture includes the adhesive composition and an aqueous solution, which are mixed to form a viscous mixture (i.e., the water-soluble adhesive mixture). The water-soluble adhesive mixture has an adhering function for users to apply to and adhere to a surface of toys, so that the toys could be adhered together to form a toy model. As the water-soluble adhesive could be softened and dissolved when the water-soluble adhesive mixture is immersed in water, the toy model could be disassembled easily.

An adhesive composition includes an organic adhesive material and a sand. The organic adhesive material includes a water-soluble adhesive and a starch, wherein a weight of the organic adhesive material accounts for 4 wt % to 70 wt % of an overall weight of the adhesive composition, and a weight of the sand accounts for 30 wt % to 96 wt % of the overall weight of the adhesive composition. A water-soluble adhesive mixture includes the adhesive composition and an aqueous solution, which are mixed to form a viscous mixture (i.e., the water-soluble adhesive mixture). The water-soluble adhesive mixture has an adhering function for users to apply to and adhere to a surface of toys, so that the toys could be adhered together to form a toy model. As the water-soluble adhesive could be softened and dissolved when the water-soluble adhesive mixture is immersed in water, the toy model could be disassembled easily.

An adhesive composition includes an organic adhesive material and a sand. The organic adhesive material includes a water-soluble adhesive and a starch, wherein a weight of the organic adhesive material accounts for 4 wt % to 70 wt % of an overall weight of the adhesive composition, and a weight of the sand accounts for 30 wt % to 96 wt % of the overall weight of the adhesive composition. A water-soluble adhesive mixture includes the adhesive composition and an aqueous solution, which are mixed to form a viscous mixture (i.e., the water-soluble adhesive mixture). The water-soluble adhesive mixture has an adhering function for users to apply to and adhere to a surface of toys, so that the toys could be adhered together to form a toy model. As the water-soluble adhesive could be softened and dissolved when the water-soluble adhesive mixture is immersed in water, the toy model could be disassembled easily.

An ethylene-vinyl alcohol copolymer may have an ethylene unit content of 1 mol % or more and less than 15 mol %, a saponification degree of 85 mol % or more and less than 99.9 mol %, and a viscosity-average degree of polymerization of 200 or more and less than 3000. The copolymer may contain a molecule containing a structure (I)

##STR00001##

Y being H or —CH.sub.3, at an end; and a molecule containing a structure (II)

##STR00002##

Z being H or —CH.sub.3, at an end, a total content of the structure (I) and the structure (II) in all monomer units is 0.001 mol % or more and less than 0.1 mol %, and a molar ratio R [I/(I+II)] of the structure (I) to the total of the structure (I) and the structure (II) satisfies formula (1):

[00001]$\begin{array}{cc}R<0.92-\mathrm{Et}/100,& \left(1\right)\end{array}$

Et being ethylene unit content (mol %).

An ethylene-vinyl alcohol copolymer may have an ethylene unit content of 1 mol % or more and less than 15 mol %, a saponification degree of 85 mol % or more and less than 99.9 mol %, and a viscosity-average degree of polymerization of 200 or more and less than 3000. The copolymer may contain a molecule containing a structure (I)

##STR00001##

Y being H or —CH.sub.3, at an end; and a molecule containing a structure (II)

##STR00002##

Z being H or —CH.sub.3, at an end, a total content of the structure (I) and the structure (II) in all monomer units is 0.001 mol % or more and less than 0.1 mol %, and a molar ratio R [I/(I+II)] of the structure (I) to the total of the structure (I) and the structure (II) satisfies formula (1):

[00001]$\begin{array}{cc}R<0.92-\mathrm{Et}/100,& \left(1\right)\end{array}$

Et being ethylene unit content (mol %).

The present invention relates generally to wall repair compounds such as joint compounds, spackling compounds, and the like used to repair imperfections in walls or fill joints between adjacent wallboard panels. Particularly, the present invention relates to such a wall repair compound comprising a dust reducing additive that reduces the quantity of airborne dust generated when the hardened compound is sanded. The dust reducing additive also imparts adhesion to the wall repair compounds to which it is added, for example to a joint compound. The dust reducing additive comprises microcrystalline-wax based emulsion.

The present invention relates generally to wall repair compounds such as joint compounds, spackling compounds, and the like used to repair imperfections in walls or fill joints between adjacent wallboard panels. Particularly, the present invention relates to such a wall repair compound comprising a dust reducing additive that reduces the quantity of airborne dust generated when the hardened compound is sanded. The dust reducing additive also imparts adhesion to the wall repair compounds to which it is added, for example to a joint compound. The dust reducing additive comprises microcrystalline-wax based emulsion.